JP2010514568A5 - - Google Patents

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Publication number
JP2010514568A5
JP2010514568A5 JP2009543418A JP2009543418A JP2010514568A5 JP 2010514568 A5 JP2010514568 A5 JP 2010514568A5 JP 2009543418 A JP2009543418 A JP 2009543418A JP 2009543418 A JP2009543418 A JP 2009543418A JP 2010514568 A5 JP2010514568 A5 JP 2010514568A5
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JP
Japan
Prior art keywords
laser beam
sensor unit
photodiode
alignment
intensity distribution
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Application number
JP2009543418A
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English (en)
Japanese (ja)
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JP2010514568A (ja
JP5193226B2 (ja
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Priority claimed from DE102007035715A external-priority patent/DE102007035715A1/de
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Publication of JP2010514568A publication Critical patent/JP2010514568A/ja
Publication of JP2010514568A5 publication Critical patent/JP2010514568A5/ja
Application granted granted Critical
Publication of JP5193226B2 publication Critical patent/JP5193226B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2009543418A 2006-12-27 2007-12-03 レーザービーム処理装置並びに焦点位置をアライメントするための方法 Expired - Fee Related JP5193226B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE102006061622.7 2006-12-27
DE102006061622 2006-12-27
DE102007035715A DE102007035715A1 (de) 2006-12-27 2007-07-30 Laserstrahlbearbeitungsvorrichtung sowie Verfahren zum Justieren der Fokuslage
DE102007035715.1 2007-07-30
PCT/EP2007/063167 WO2008080728A1 (de) 2006-12-27 2007-12-03 Laserstrahlbearbeitungsvorrichtung mit mittel zum abbilden der reflektierten ringgeformten laserstrahlung auf einer sensoreinheit sowie verfahren zum justieren der fokuslage

Publications (3)

Publication Number Publication Date
JP2010514568A JP2010514568A (ja) 2010-05-06
JP2010514568A5 true JP2010514568A5 (enExample) 2012-12-06
JP5193226B2 JP5193226B2 (ja) 2013-05-08

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ID=39111581

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009543418A Expired - Fee Related JP5193226B2 (ja) 2006-12-27 2007-12-03 レーザービーム処理装置並びに焦点位置をアライメントするための方法

Country Status (7)

Country Link
US (1) US8546725B2 (enExample)
EP (1) EP2117761B1 (enExample)
JP (1) JP5193226B2 (enExample)
KR (1) KR101467956B1 (enExample)
DE (1) DE102007035715A1 (enExample)
ES (1) ES2423952T3 (enExample)
WO (1) WO2008080728A1 (enExample)

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DE102010002260A1 (de) 2010-02-23 2011-08-25 Robert Bosch GmbH, 70469 Messeinrichtung für eine Laserstrahlbearbeitungsvorrichtung
DE102010002253A1 (de) * 2010-02-23 2011-08-25 Robert Bosch GmbH, 70469 Laserstrahlschweißeinrichtung und Verfahren zum Betreiben einer Laserstrahlschweißeinrichtung
DE102010002255A1 (de) * 2010-02-23 2011-08-25 Robert Bosch GmbH, 70469 Laserstrahlschweißeinrichtung und Verfahren zum Betreiben einer Laserstrahlschweißeinrichtung
DE102010002257A1 (de) * 2010-02-23 2011-08-25 Robert Bosch GmbH, 70469 Laserstrahlschweißeinrichtung und Verfahren zur Prüfung einer Laserstrahlschweißeinrichtung
DE102011007792A1 (de) 2011-04-20 2012-10-25 Robert Bosch Gmbh Laserstrahlschweißvorrichtung und Laserstrahlschweißverfahren
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US9039814B2 (en) 2013-04-18 2015-05-26 Saes Pure Gas, Inc. System and method for welding a plurality of small diameter palladium alloy tubes to a common base plate in a space efficient manner
US9429716B1 (en) * 2013-06-03 2016-08-30 Corning Cable Systems Llc Mirror systems securing optical fibers to ferrules by thermally securing bonding agents within fiber optic connector housings, and related methods and assemblies
JP6277986B2 (ja) * 2015-03-24 2018-02-14 トヨタ自動車株式会社 レーザ溶接装置及びレーザ溶接方法
EP3412400A1 (en) * 2017-06-09 2018-12-12 Bystronic Laser AG Beam shaper and use thereof, device for laser beam treatment of a workpiece and use thereof, method for laser beam treatment of a workpiece
CN109822219A (zh) * 2019-02-27 2019-05-31 惠州市通发激光设备有限公司 一种具有无缝焊接功能的水壶焊接装置
CN110129523A (zh) * 2019-06-04 2019-08-16 沈阳中科煜宸科技有限公司 一种圆柱体工件表面连续无搭接激光淬火装置及其淬火方法
CN111766690B (zh) * 2020-07-24 2022-03-25 苏州天准科技股份有限公司 对位成像设备及激光直接成像系统
CN112643199A (zh) * 2020-12-24 2021-04-13 洛阳博特自动化工程有限公司 一种环形光激光焊接装置
CN113084290B (zh) * 2021-03-15 2023-04-28 武汉华工激光工程有限责任公司 激光锡焊系统以及方法
CN114523207B (zh) * 2022-03-02 2024-03-29 河北科技大学 激光焊接方法
JP2024107934A (ja) * 2023-01-30 2024-08-09 株式会社ディスコ ウエーハの加工方法
EP4600718A3 (de) * 2023-02-28 2025-10-15 Saertex multicom GmbH Aushärtung eines liners mittels laser
CN116851906B (zh) * 2023-05-30 2026-01-30 深圳市单色科技有限公司 可灵活调控焦点形态结构的激光加工系统及方法

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