JP2010512292A - フラットパネルディスプレイのための環境隔絶システム - Google Patents

フラットパネルディスプレイのための環境隔絶システム Download PDF

Info

Publication number
JP2010512292A
JP2010512292A JP2009540521A JP2009540521A JP2010512292A JP 2010512292 A JP2010512292 A JP 2010512292A JP 2009540521 A JP2009540521 A JP 2009540521A JP 2009540521 A JP2009540521 A JP 2009540521A JP 2010512292 A JP2010512292 A JP 2010512292A
Authority
JP
Japan
Prior art keywords
container
door
flat panel
panel display
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009540521A
Other languages
English (en)
Japanese (ja)
Inventor
アンソニー シー ボノラ
マイケル フアラン
ロバート ゴールド
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asyst Technologies Inc
Original Assignee
Asyst Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asyst Technologies Inc filed Critical Asyst Technologies Inc
Publication of JP2010512292A publication Critical patent/JP2010512292A/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/48—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/18—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient
    • B65D81/20—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient under vacuum or superatmospheric pressure, or in a special atmosphere, e.g. of inert gas
    • B65D81/2069—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient under vacuum or superatmospheric pressure, or in a special atmosphere, e.g. of inert gas in a special atmosphere
    • B65D81/2076—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient under vacuum or superatmospheric pressure, or in a special atmosphere, e.g. of inert gas in a special atmosphere in an at least partially rigid container
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/38—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67363—Closed carriers specially adapted for containing substrates other than wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67383—Closed carriers characterised by substrate supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2585/00—Containers, packaging elements or packages specially adapted for particular articles or materials
    • B65D2585/68—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form
    • B65D2585/6802—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form specific machines, engines or vehicles
    • B65D2585/6835—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form specific machines, engines or vehicles audio-visual devices
    • B65D2585/6837—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form specific machines, engines or vehicles audio-visual devices tv or computers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Warehouses Or Storage Devices (AREA)
JP2009540521A 2006-12-08 2007-12-10 フラットパネルディスプレイのための環境隔絶システム Pending JP2010512292A (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US87389206P 2006-12-08 2006-12-08
US90697207P 2007-03-14 2007-03-14
US11/953,020 US20080156679A1 (en) 2006-12-08 2007-12-08 Environmental isolation system for flat panel displays
PCT/US2007/087034 WO2008070876A2 (en) 2006-12-08 2007-12-10 Environmental isolation system for flat panel displays

Publications (1)

Publication Number Publication Date
JP2010512292A true JP2010512292A (ja) 2010-04-22

Family

ID=39493116

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009540521A Pending JP2010512292A (ja) 2006-12-08 2007-12-10 フラットパネルディスプレイのための環境隔絶システム

Country Status (5)

Country Link
US (1) US20080156679A1 (zh)
JP (1) JP2010512292A (zh)
KR (1) KR20090086257A (zh)
TW (1) TW200842089A (zh)
WO (1) WO2008070876A2 (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013103771A (ja) * 2011-11-10 2013-05-30 Ihi Corp 薄板状ワーク保管装置
WO2014103808A1 (ja) * 2012-12-24 2014-07-03 淀川ヒューテック株式会社 板体収容用ボックス
JP2014236164A (ja) * 2013-06-04 2014-12-15 シンフォニアテクノロジー株式会社 ロードポート装置
JP6159496B1 (ja) * 2014-01-21 2017-07-05 カティーバ， インコーポレイテッド 電子デバイスのカプセル化のための装置および技術

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090016862A1 (en) * 2007-07-12 2009-01-15 Gould Richard H Method and apparatus for providing flat panel display environmental isolation
TW200911166A (en) * 2007-09-14 2009-03-16 Univ Nat Taiwan Science Tech Receiving device
JP5386137B2 (ja) * 2008-10-06 2014-01-15 株式会社日立ハイテクノロジーズ 試料測定装置
JP5410794B2 (ja) * 2009-03-17 2014-02-05 東京エレクトロン株式会社 基板処理装置
JP5279576B2 (ja) * 2009-03-27 2013-09-04 大日本スクリーン製造株式会社 基板処理装置
EP2840599B1 (en) * 2012-04-16 2021-03-31 Rorze Corporation Accommodating container and wafer stocker using same
DE102012010252A1 (de) * 2012-05-25 2013-11-28 Checkpoint Systems, Inc. Vorrichtung und Verfahren zum Schreiben einer Vielzahl von Transpondern
CN103213771B (zh) * 2013-05-06 2015-04-29 深圳市华星光电技术有限公司 平板玻璃包装箱及其拆包方法
US10087021B2 (en) * 2015-06-22 2018-10-02 Cornerstone Automation Systems, Llc Secure tote for order fulfillment and method of operation thereof
US10242897B2 (en) * 2015-12-14 2019-03-26 Solarcity Corporation Micro-environment container for photovoltaic cells
US10790177B2 (en) * 2017-11-14 2020-09-29 Taiwan Semiconductor Manufacturing Co., Ltd. Systems, devices, and methods for using a real time environment sensor in a FOUP
US10784136B2 (en) * 2018-07-27 2020-09-22 Onto Innovation Inc. FOUP purge shield
EP4092722B1 (en) * 2021-05-21 2023-04-12 Semsysco GmbH Handling system for fetching a substrate

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US556394A (en) * 1896-03-17 Curtain-cabinet
JPH0736418B2 (ja) * 1986-05-19 1995-04-19 富士通株式会社 ウエーハキャリア
US4815515A (en) * 1987-05-27 1989-03-28 Lee Song L Structure of window shade
US5467266A (en) * 1991-09-03 1995-11-14 Lutron Electronics Co., Inc. Motor-operated window cover
US5255970A (en) * 1992-05-26 1993-10-26 Theosabrata Yos S Storage cabinet
US5249616A (en) * 1992-09-30 1993-10-05 Chou Yen Double-layer window with shade roller unit for regulating the light
FR2710685B1 (fr) * 1993-09-29 1995-12-22 Louis Plumer Dispositif d'entraînement et de mise sous tension d'un élément souple de protection, tel qu'une bande, un rideau ou un tablier.
US5423422A (en) * 1994-03-14 1995-06-13 Empak, Inc. Flat panel display container
WO1999028968A1 (fr) * 1997-12-02 1999-06-10 Kabushiki Kaisha Toshiba Preservation de la proprete des substrats et boite de rangement de substrats
JP4389318B2 (ja) * 2000-01-25 2009-12-24 大成建設株式会社 ドラフトチャンバ
US6276744B1 (en) * 2000-06-21 2001-08-21 Technical Products Group, Inc. Roll-type door opener
JP3871508B2 (ja) * 2000-11-15 2007-01-24 株式会社荏原製作所 基板搬送容器の給電装置
US6752476B2 (en) * 2001-06-15 2004-06-22 Chung Jen Lin Structure of a garbage-box
US6540467B1 (en) * 2001-06-18 2003-04-01 Lsi Logic Corporation Apparatus and method of semiconductor wafer protection
JP2003093825A (ja) * 2001-09-27 2003-04-02 Ebara Corp ガス除去方法及びガス除去フィルタ
US6724476B1 (en) * 2002-10-01 2004-04-20 Advanced Micro Devices, Inc. Low defect metrology approach on clean track using integrated metrology
NO320850B1 (no) * 2004-01-09 2006-02-06 Hagen Persiennesystemer As Strammeanordning for motorisert rullegardin innsatt mellom isolerglass samt anvendelse derav.
US7111895B2 (en) * 2004-12-02 2006-09-26 Patriot Lift Co., Llc Apparatus for pneumatic operation of transport container sliding door

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013103771A (ja) * 2011-11-10 2013-05-30 Ihi Corp 薄板状ワーク保管装置
WO2014103808A1 (ja) * 2012-12-24 2014-07-03 淀川ヒューテック株式会社 板体収容用ボックス
JP2014236164A (ja) * 2013-06-04 2014-12-15 シンフォニアテクノロジー株式会社 ロードポート装置
JP6159496B1 (ja) * 2014-01-21 2017-07-05 カティーバ， インコーポレイテッド 電子デバイスのカプセル化のための装置および技術
JP2017147230A (ja) * 2014-01-21 2017-08-24 カティーバ， インコーポレイテッド 電子デバイスのカプセル化のための装置および技術
JP2017212212A (ja) * 2014-01-21 2017-11-30 カティーバ， インコーポレイテッド 電子デバイスのカプセル化のための装置および技術

Also Published As

Publication number Publication date
KR20090086257A (ko) 2009-08-11
WO2008070876A2 (en) 2008-06-12
WO2008070876A9 (en) 2008-08-21
US20080156679A1 (en) 2008-07-03
TW200842089A (en) 2008-11-01
WO2008070876A3 (en) 2008-10-02

Similar Documents

Publication Publication Date Title
JP2010512292A (ja) フラットパネルディスプレイのための環境隔絶システム
US10354903B2 (en) Load port and load port atmosphere replacing method
JP4093376B2 (ja) 吸引一体型ｓｍｉｆシステム
JP4642608B2 (ja) 基板処理装置および基板処理システム
US6120229A (en) Substrate carrier as batchloader
JP2011517134A (ja) クリーン移送ロボット
US20090016862A1 (en) Method and apparatus for providing flat panel display environmental isolation
KR102474585B1 (ko) 박판형상 기판 유지 핑거 및 이 핑거를 구비하는 반송 로봇
WO2000067334A1 (en) Universal tool interface and/or workpiece transfer apparatus for smif and open pod applications
KR20160108141A (ko) 도어 개폐 장치, 반송 장치, 소터 장치, 수납 용기의 개방 방법
US10403528B2 (en) Substrate-processing apparatus and method of manufacturing semiconductor device
JP7134928B2 (ja) 基板処理装置、基板キャリア及び基板処理システム
KR20070015945A (ko) 물품 처리 방법 및 장치
JP2004207279A (ja) 薄板状物製造設備
TWI237289B (en) System and method for providing defect free rapid thermal processing
KR100852468B1 (ko) 로드락 챔버 직결식 로드포트
KR101688842B1 (ko) 기판 처리 장치
JP2001093957A (ja) 電子部品の製造装置および電子部品の製造方法
JPH1084034A (ja) 半導体基板キャリアの搬送および使用方法および装置
JP2009170726A (ja) ロードポートおよびカセット位置調整方法
KR100854410B1 (ko) 반도체 자재 처리를 위한 이송 시스템
WO2009009780A2 (en) Method and apparatus for providing flat panel display environmental isolation
KR100654772B1 (ko) 패널이송장치
JP2002203887A (ja) ミニエンバイロンメントシステムおよびその操作方法
JP3983219B2 (ja) ウェーハマッピング装置