WO2008070876A3 - Environmental isolation system for flat panel displays - Google Patents

Environmental isolation system for flat panel displays

Info

Publication number
WO2008070876A3
WO2008070876A3 PCT/US2007/087034 US2007087034W WO2008070876A3 WO 2008070876 A3 WO2008070876 A3 WO 2008070876A3 US 2007087034 W US2007087034 W US 2007087034W WO 2008070876 A3 WO2008070876 A3 WO 2008070876A3
Authority
WO
Grant status
Application
Patent type
Prior art keywords
system
fpd
includes
sealable
container
Prior art date
Application number
PCT/US2007/087034
Other languages
French (fr)
Other versions
WO2008070876A2 (en )
WO2008070876A9 (en )
Inventor
Anthony C Bonora
Michel Pharand
Robert Gould
Original Assignee
Asyst Technologies
Anthony C Bonora
Michel Pharand
Robert Gould
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/18Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient
    • B65D81/20Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient under vacuum or superatmospheric pressure, or in a special atmosphere, e.g. of inert gas
    • B65D81/2069Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient under vacuum or superatmospheric pressure, or in a special atmosphere, e.g. of inert gas in a special atmosphere
    • B65D81/2076Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient under vacuum or superatmospheric pressure, or in a special atmosphere, e.g. of inert gas in a special atmosphere in an at least partially rigid container
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6734Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735Closed carriers
    • H01L21/67363Closed carriers specially adapted for containing substrates other than wafers
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735Closed carriers
    • H01L21/67379Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735Closed carriers
    • H01L21/67383Closed carriers characterised by substrate supports
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735Closed carriers
    • H01L21/67389Closed carriers characterised by atmosphere control
    • H01L21/67393Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775Docking arrangements
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2585/00Containers, packaging elements or packages specially adapted for particular articles or materials
    • B65D2585/68Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form
    • B65D2585/6802Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form specific machines, engines or vehicles
    • B65D2585/6835Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form specific machines, engines or vehicles audio-visual devices
    • B65D2585/6837Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form specific machines, engines or vehicles audio-visual devices tv or computers

Abstract

The present invention generally comprises a system for FPD material storage and transport. The FPD system may contain environmental protection, material tracking and/or workstation loading capabilities. One of the components of the system includes a transportable, sealable container. Another component of the system includes a sealable load port against which a container is docked so that the substrates may be processed.
PCT/US2007/087034 2006-12-08 2007-12-10 Environmental isolation system for flat panel displays WO2008070876A3 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
US87389206 true 2006-12-08 2006-12-08
US60/873,892 2006-12-08
US90697207 true 2007-03-14 2007-03-14
US60/906,972 2007-03-14
US11953020 US20080156679A1 (en) 2006-12-08 2007-12-08 Environmental isolation system for flat panel displays
US11/953,020 2007-12-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009540521A JP2010512292A (en) 2006-12-08 2007-12-10 Environment isolation system for the flat panel display

Publications (3)

Publication Number Publication Date
WO2008070876A2 true WO2008070876A2 (en) 2008-06-12
WO2008070876A9 true WO2008070876A9 (en) 2008-08-21
WO2008070876A3 true true WO2008070876A3 (en) 2008-10-02

Family

ID=39493116

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/087034 WO2008070876A3 (en) 2006-12-08 2007-12-10 Environmental isolation system for flat panel displays

Country Status (4)

Country Link
US (1) US20080156679A1 (en)
JP (1) JP2010512292A (en)
KR (1) KR20090086257A (en)
WO (1) WO2008070876A3 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090016862A1 (en) * 2007-07-12 2009-01-15 Gould Richard H Method and apparatus for providing flat panel display environmental isolation
US20090072688A1 (en) * 2007-09-14 2009-03-19 National Taiwan University Of Science & Technology Receiving device
JP5386137B2 (en) * 2008-10-06 2014-01-15 株式会社日立ハイテクノロジーズ Sample measurement device
JP5410794B2 (en) * 2009-03-17 2014-02-05 東京エレクトロン株式会社 The substrate processing apparatus
JP5279576B2 (en) * 2009-03-27 2013-09-04 大日本スクリーン製造株式会社 The substrate processing apparatus
JP5773158B2 (en) * 2011-11-10 2015-09-02 株式会社Ihi Thin plate-shaped work storage devices
CN104221136B (en) * 2012-04-16 2017-05-31 日商乐华股份有限公司 Container, the container shutter opening and closing means, and the use thereof in the wafer stocker
DE102012010252A1 (en) * 2012-05-25 2013-11-28 Checkpoint Systems, Inc. Apparatus and method of writing a plurality of transponders
WO2014103808A1 (en) * 2012-12-24 2014-07-03 淀川ヒューテック株式会社 Box for accommodating plate body
CN103213771B (en) * 2013-05-06 2015-04-29 深圳市华星光电技术有限公司 Plate glass packaging box and unpacking method of same
JP6119436B2 (en) * 2013-06-04 2017-04-26 シンフォニアテクノロジー株式会社 Load port equipment
WO2015112454A1 (en) * 2014-01-21 2015-07-30 Kateeva, Inc. Apparatus and techniques for electronic device encapsulation
US20160368653A1 (en) * 2015-06-22 2016-12-22 Cornerstone Automation Systems, Llc Secure tote for order fulfillment and method of operation thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5255970A (en) * 1992-05-26 1993-10-26 Theosabrata Yos S Storage cabinet
JP2001205110A (en) * 2000-01-25 2001-07-31 Taisei Corp Draft chamber
US6752476B2 (en) * 2001-06-15 2004-06-22 Chung Jen Lin Structure of a garbage-box
US7111895B2 (en) * 2004-12-02 2006-09-26 Patriot Lift Co., Llc Apparatus for pneumatic operation of transport container sliding door

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US556394A (en) * 1896-03-17 Curtain-cabinet
JPH0736418B2 (en) * 1986-05-19 1995-04-19 富士通株式会社 Wafer carrier
US4815515A (en) * 1987-05-27 1989-03-28 Lee Song L Structure of window shade
US5467266A (en) * 1991-09-03 1995-11-14 Lutron Electronics Co., Inc. Motor-operated window cover
US5249616A (en) * 1992-09-30 1993-10-05 Chou Yen Double-layer window with shade roller unit for regulating the light
FR2710685B1 (en) * 1993-09-29 1995-12-22 Louis Plumer Device for driving and tensioning a flexible protection element, such as a tape, a curtain or an apron.
US5423422A (en) * 1994-03-14 1995-06-13 Empak, Inc. Flat panel display container
WO1999028968A1 (en) * 1997-12-02 1999-06-10 Kabushiki Kaisha Toshiba Method of maintaining cleanliness of substrates and box for accommodating substrates
US6276744B1 (en) * 2000-06-21 2001-08-21 Technical Products Group, Inc. Roll-type door opener
JP3871508B2 (en) * 2000-11-15 2007-01-24 株式会社荏原製作所 Substrate transport container feed device
US6540467B1 (en) * 2001-06-18 2003-04-01 Lsi Logic Corporation Apparatus and method of semiconductor wafer protection
US6723151B2 (en) * 2001-09-27 2004-04-20 Ebara Corporation Gas removal method and gas removal filter
US6724476B1 (en) * 2002-10-01 2004-04-20 Advanced Micro Devices, Inc. Low defect metrology approach on clean track using integrated metrology
EP1702131A1 (en) * 2004-01-09 2006-09-20 Hagen Persiennesystemer A/S Tightening device for blinds

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5255970A (en) * 1992-05-26 1993-10-26 Theosabrata Yos S Storage cabinet
JP2001205110A (en) * 2000-01-25 2001-07-31 Taisei Corp Draft chamber
US6752476B2 (en) * 2001-06-15 2004-06-22 Chung Jen Lin Structure of a garbage-box
US7111895B2 (en) * 2004-12-02 2006-09-26 Patriot Lift Co., Llc Apparatus for pneumatic operation of transport container sliding door

Also Published As

Publication number Publication date Type
US20080156679A1 (en) 2008-07-03 application
WO2008070876A2 (en) 2008-06-12 application
JP2010512292A (en) 2010-04-22 application
WO2008070876A9 (en) 2008-08-21 application
KR20090086257A (en) 2009-08-11 application

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