JP2010510542A - 光学積層体を採用したカメラシステムにおける迷光の制御およびその関連方法 - Google Patents
光学積層体を採用したカメラシステムにおける迷光の制御およびその関連方法 Download PDFInfo
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/02—Bodies
- G03B17/12—Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/0018—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 with means for preventing ghost images
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/021—Mountings, adjusting means, or light-tight connections, for optical elements for lenses for more than one lens
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
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Abstract
Description
Claims (36)
- 垂直方向において一体に固定された2つの基板と、露出した側面を有する2つの基板上にある光学部品とを有する光学的積層体と、
検出器基板上にある検出器と、
光学的積層体の少なくともいくつかの側面の上に直接的に形成された迷光遮光部材とを備えたことを特徴とするカメラシステム。 - 少なくともいくつかの側面は、光学的積層体のうちの検出器基板から最も離れた基板の側面を含むことを特徴とする請求項1に記載のカメラシステム。
- 迷光遮光部材は、光学的積層体のすべての側面の上にあることを特徴とする請求項1に記載のカメラシステム。
- 迷光遮光部材の屈折率は、上記いくつかの側面を有する基板の屈折率とほぼ同等であることを特徴とする請求項1に記載のカメラシステム。
- 光学的積層体の1つの基板が検出器基板より小さい表面積を有することを特徴とする請求項1に記載のカメラシステム。
- 迷光遮光部材は、封入部材であることを特徴とする請求項1に記載のカメラシステム。
- 迷光遮光部材は、コーティングであることを特徴とする請求項1に記載のカメラシステム。
- 迷光遮光部材は、検出器が検出できる波長光に対して不透明であることを特徴とする請求項1に記載のカメラシステム。
- 光学的積層体の基板は、同一の表面積を有することを特徴とする請求項1に記載のカメラシステム。
- 検出器基板は、少なくとも1つの方向において光学的積層体よりも大きく広がることを特徴とする請求項1に記載のカメラシステム。
- 光学的積層体よりも大きく広がる検出器基板上に接合パッドを有することを特徴とする請求項10に記載のカメラシステム。
- 接合パッドと電気的に接続される構成部品を有する基板を備えたことを特徴とする請求項11に記載のカメラシステム。
- 迷光遮光部材は、光学的積層体の上側表面から検出器基板まで延びる封入部材を有することを特徴とする請求項12に記載のカメラシステム。
- 封入部材は、接合パッド、および接合パッドと基板の間の電気的接続部品を覆うことを特徴とする請求項13に記載のカメラシステム。
- 封入部材を保持する構成部品を基板上に有することを特徴とする請求項13に記載のカメラシステム。
- 光学的積層体を包囲するハウジングを有することを特徴とする請求項1に記載のカメラシステム。
- 検出器基板は、少なくとも1つの方向において光学的積層体よりも大きく延びることを特徴とする請求項16に記載のカメラシステム。
- 光学的積層体よりも大きく延びる検出器基板の上にある接合パッドを有することを特徴とする請求項17に記載のカメラシステム。
- 接合パッドと電気的に接続される構成部品を有する基板を備えたことを特徴とする請求項18に記載のカメラシステム。
- 光学的積層体を包囲するハウジングが基板の下方まで延びることを特徴とする請求項19に記載のカメラシステム。
- 光学的積層体の基板は、同一の表面積を有さないことを特徴とする請求項20に記載のカメラシステム。
- ハウジングは、別の基板より広く延びる光学的積層体の上側部分を覆うように延びることを特徴とする請求項21に記載のカメラシステム。
- 迷光遮光部材は、ハウジングの上側表面にある開口部と、別の基板より広く延びる光学的積層体の上側部分との間にある封入部材を有することを特徴とする請求項22に記載のカメラシステム。
- 迷光遮光部材は、ハウジングと光学的積層体の間にある封入部材を有することを特徴とする請求項16に記載のカメラシステム。
- ハウジングは、検出器基板上のカバープレートを覆うことを特徴とする請求項16に記載のカメラシステム。
- 光学的積層体の基板は、同一の表面積を有さないことを特徴とする請求項1に記載のカメラシステム。
- 迷光遮光部材は、光学的積層体に沿った封入部材を有することを特徴とする請求項26に記載のカメラシステム。
- 光学的積層体の基板を離間させるスペーサは、露出した側面からの間隙を有することを特徴とする請求項1に記載のカメラシステム。
- 迷光遮光部材は、光学的積層体に沿った封入部材を有し、
封入部材は上記間隙を充填することを特徴とする請求項28に記載のカメラシステム。 - 検出器基板を介した電気的接続部材を有することを特徴とする請求項1に記載のカメラシステム。
- 検出器基板上のカバープレートは、少なくとも1つの方向において光学的積層体よりも大きく延びることを特徴とする請求項1に記載のカメラシステム。
- カバープレートの露出した表面の上に不透明な部材を有することを特徴とする請求項31に記載のカメラシステム。
- 不透明な部材は、迷光遮光部材と同一であることを特徴とする請求項32に記載のカメラシステム。
- カバープレートは傾斜した側壁を有し、
カバープレートの傾斜した側壁を覆う不透明部材を有することを特徴とする請求項31に記載のカメラシステム。 - 不透明部材は、迷光遮光部材と同一のものであることを特徴とする請求項34に記載のカメラシステム。
- カメラシステムの作製方法であって、
露出した側面を有する2つの基板と、これらの上にある光学部品とを有する光学的積層体を、検出器基板上にある検出器に垂直方向において一体に固定するステップと、
光学的積層体の少なくともいくつかの側面の上に迷光遮光部材を直接的に形成するステップとを有することを特徴とするカメラシステムの作製方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US11/600,282 US20080118241A1 (en) | 2006-11-16 | 2006-11-16 | Control of stray light in camera systems employing an optics stack and associated methods |
PCT/US2007/023961 WO2008063528A2 (en) | 2006-11-16 | 2007-11-15 | Control of stray light in camera systems employing an optics stack and associated methods |
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JP2010510542A true JP2010510542A (ja) | 2010-04-02 |
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JP2009537200A Pending JP2010510542A (ja) | 2006-11-16 | 2007-11-15 | 光学積層体を採用したカメラシステムにおける迷光の制御およびその関連方法 |
Country Status (7)
Country | Link |
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US (1) | US20080118241A1 (ja) |
EP (1) | EP2084896B1 (ja) |
JP (1) | JP2010510542A (ja) |
KR (1) | KR20090089421A (ja) |
CN (1) | CN101606381B (ja) |
TW (1) | TW200835306A (ja) |
WO (1) | WO2008063528A2 (ja) |
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Also Published As
Publication number | Publication date |
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TW200835306A (en) | 2008-08-16 |
EP2084896A2 (en) | 2009-08-05 |
WO2008063528A2 (en) | 2008-05-29 |
CN101606381A (zh) | 2009-12-16 |
EP2084896B1 (en) | 2014-10-29 |
US20080118241A1 (en) | 2008-05-22 |
KR20090089421A (ko) | 2009-08-21 |
WO2008063528A3 (en) | 2008-07-10 |
CN101606381B (zh) | 2012-06-13 |
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