JP2010507089A5 - - Google Patents

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Publication number
JP2010507089A5
JP2010507089A5 JP2009532834A JP2009532834A JP2010507089A5 JP 2010507089 A5 JP2010507089 A5 JP 2010507089A5 JP 2009532834 A JP2009532834 A JP 2009532834A JP 2009532834 A JP2009532834 A JP 2009532834A JP 2010507089 A5 JP2010507089 A5 JP 2010507089A5
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JP
Japan
Prior art keywords
light radiation
measured
processing unit
detector
normal
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JP2009532834A
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English (en)
Japanese (ja)
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JP5155325B2 (ja
JP2010507089A (ja
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Priority claimed from FI20065669A external-priority patent/FI119259B/fi
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Publication of JP2010507089A5 publication Critical patent/JP2010507089A5/ja
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Publication of JP5155325B2 publication Critical patent/JP5155325B2/ja
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JP2009532834A 2006-10-18 2007-10-17 表面および厚みの決定 Active JP5155325B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FI20065669 2006-10-18
FI20065669A FI119259B (fi) 2006-10-18 2006-10-18 Pinnan ja paksuuden määrittäminen
PCT/FI2007/050561 WO2008046966A1 (en) 2006-10-18 2007-10-17 Determining surface and thickness

Publications (3)

Publication Number Publication Date
JP2010507089A JP2010507089A (ja) 2010-03-04
JP2010507089A5 true JP2010507089A5 (enExample) 2010-12-16
JP5155325B2 JP5155325B2 (ja) 2013-03-06

Family

ID=37232275

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009532834A Active JP5155325B2 (ja) 2006-10-18 2007-10-17 表面および厚みの決定

Country Status (7)

Country Link
US (1) US7936464B2 (enExample)
EP (1) EP2076733B1 (enExample)
JP (1) JP5155325B2 (enExample)
CN (1) CN101529200B (enExample)
ES (1) ES2400380T3 (enExample)
FI (1) FI119259B (enExample)
WO (1) WO2008046966A1 (enExample)

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US10684362B2 (en) 2011-06-30 2020-06-16 The Regents Of The University Of Colorado Remote measurement of shallow depths in semi-transparent media
US11313678B2 (en) 2011-06-30 2022-04-26 The Regents Of The University Of Colorado Remote measurement of shallow depths in semi-transparent media
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CN107326717B (zh) * 2017-07-12 2019-05-28 东莞福迈包装印刷有限公司 一种可以检测纸张厚度的造纸机
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CN108955549A (zh) * 2018-09-11 2018-12-07 深圳立仪科技有限公司 一种透光材料双面测厚装置
DE102018130901A1 (de) 2018-12-04 2020-06-04 Precitec Optronik Gmbh Optische Messeinrichtung
JP7160779B2 (ja) * 2019-10-03 2022-10-25 信越半導体株式会社 薄膜付ウェーハの膜厚分布の測定方法
CN110836642A (zh) * 2019-12-23 2020-02-25 海伯森技术（深圳）有限公司 一种基于三角测量法的彩色三角位移传感器及其测量方法
EP4443120A3 (en) 2020-02-13 2024-12-25 Hamamatsu Photonics K.K. Imaging unit and measurement device
WO2021195190A1 (en) * 2020-03-27 2021-09-30 Lam Research Corporation In-situ wafer thickness and gap monitoring using through beam laser sensor
KR20230011403A (ko) 2020-06-19 2023-01-20 프레시텍 옵트로닉 게엠베하 크로마틱 공초점 측정장치
CN112162296B (zh) * 2020-09-29 2024-05-31 香港中文大学（深圳） 一种激光测距系统
FI130557B (en) * 2020-09-29 2023-11-17 Lmi Tech Inc Device for determining a distance, surface thickness and optical properties of an object and related method
CN116325068A (zh) 2020-10-01 2023-06-23 Asml荷兰有限公司 检查装置和方法
FI20215460A1 (en) 2021-04-19 2022-10-20 Lmi Tech Oy Illumination device and method for generating measurement light and optical measurement device
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CN120008488A (zh) * 2025-01-17 2025-05-16 海伯森技术（深圳）有限公司 表面轮廓检测装置及方法

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