JP2010506733A5 - - Google Patents

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Publication number
JP2010506733A5
JP2010506733A5 JP2009533505A JP2009533505A JP2010506733A5 JP 2010506733 A5 JP2010506733 A5 JP 2010506733A5 JP 2009533505 A JP2009533505 A JP 2009533505A JP 2009533505 A JP2009533505 A JP 2009533505A JP 2010506733 A5 JP2010506733 A5 JP 2010506733A5
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JP
Japan
Prior art keywords
solder
melting point
low melting
solar cell
alloy
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JP2009533505A
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English (en)
Japanese (ja)
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JP2010506733A (ja
JP5266235B2 (ja
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Priority claimed from PCT/US2007/081650 external-priority patent/WO2008049006A2/en
Publication of JP2010506733A publication Critical patent/JP2010506733A/ja
Publication of JP2010506733A5 publication Critical patent/JP2010506733A5/ja
Application granted granted Critical
Publication of JP5266235B2 publication Critical patent/JP5266235B2/ja
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JP2009533505A 2006-10-17 2007-10-17 電気装置において電気的接続を設ける方法 Active JP5266235B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US85221006P 2006-10-17 2006-10-17
US60/852,210 2006-10-17
US86691306P 2006-11-22 2006-11-22
US60/866,913 2006-11-22
PCT/US2007/081650 WO2008049006A2 (en) 2006-10-17 2007-10-17 Materials for use with interconnects of electrical devices and related methods

Publications (3)

Publication Number Publication Date
JP2010506733A JP2010506733A (ja) 2010-03-04
JP2010506733A5 true JP2010506733A5 (https=) 2010-12-02
JP5266235B2 JP5266235B2 (ja) 2013-08-21

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ID=39314814

Family Applications (1)

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JP2009533505A Active JP5266235B2 (ja) 2006-10-17 2007-10-17 電気装置において電気的接続を設ける方法

Country Status (5)

Country Link
US (1) US10123430B2 (https=)
EP (1) EP2081729A4 (https=)
JP (1) JP5266235B2 (https=)
CA (1) CA2666363C (https=)
WO (1) WO2008049006A2 (https=)

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