JP2010503211A5 - - Google Patents

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Publication number
JP2010503211A5
JP2010503211A5 JP2009526691A JP2009526691A JP2010503211A5 JP 2010503211 A5 JP2010503211 A5 JP 2010503211A5 JP 2009526691 A JP2009526691 A JP 2009526691A JP 2009526691 A JP2009526691 A JP 2009526691A JP 2010503211 A5 JP2010503211 A5 JP 2010503211A5
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JP
Japan
Prior art keywords
chemical mechanical
polishing composition
mechanical polishing
adjusting agent
group
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JP2009526691A
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English (en)
Japanese (ja)
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JP5313900B2 (ja
JP2010503211A (ja
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Priority claimed from US11/673,399 external-priority patent/US7803203B2/en
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Publication of JP2010503211A5 publication Critical patent/JP2010503211A5/ja
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JP2009526691A 2006-08-30 2007-08-29 半導体材料のｃｍｐのための組成物と研磨方法 Active JP5313900B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US84100506P 2006-08-30 2006-08-30
US60/841,005 2006-08-30
US11/673,399 US7803203B2 (en) 2005-09-26 2007-02-09 Compositions and methods for CMP of semiconductor materials
US11/673,399 2007-02-09
PCT/US2007/018980 WO2008027421A1 (en) 2006-08-30 2007-08-29 Compositions and methods for cmp of semiconductor materials

Publications (3)

Publication Number Publication Date
JP2010503211A JP2010503211A (ja) 2010-01-28
JP2010503211A5 true JP2010503211A5 (https=) 2010-10-14
JP5313900B2 JP5313900B2 (ja) 2013-10-09

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JP2009526691A Active JP5313900B2 (ja) 2006-08-30 2007-08-29 半導体材料のｃｍｐのための組成物と研磨方法

Country Status (6)

Country Link
US (2) US7803203B2 (https=)
JP (1) JP5313900B2 (https=)
KR (1) KR101356222B1 (https=)
CN (1) CN101506325B (https=)
TW (1) TWI414573B (https=)
WO (1) WO2008027421A1 (https=)

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