JP2009505423A5 - - Google Patents
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- Publication number
- JP2009505423A5 JP2009505423A5 JP2008526997A JP2008526997A JP2009505423A5 JP 2009505423 A5 JP2009505423 A5 JP 2009505423A5 JP 2008526997 A JP2008526997 A JP 2008526997A JP 2008526997 A JP2008526997 A JP 2008526997A JP 2009505423 A5 JP2009505423 A5 JP 2009505423A5
- Authority
- JP
- Japan
- Prior art keywords
- potassium
- polishing system
- polishing
- substrate
- water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 claims 20
- 229910052913 potassium silicate Inorganic materials 0.000 claims 8
- 235000019353 potassium silicate Nutrition 0.000 claims 8
- 239000000758 substrate Substances 0.000 claims 8
- 238000000034 method Methods 0.000 claims 7
- 239000004111 Potassium silicate Substances 0.000 claims 6
- NNHHDJVEYQHLHG-UHFFFAOYSA-N potassium silicate Chemical compound [K+].[K+].[O-][Si]([O-])=O NNHHDJVEYQHLHG-UHFFFAOYSA-N 0.000 claims 6
- -1 silicate compound Chemical class 0.000 claims 6
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims 4
- 239000004115 Sodium Silicate Substances 0.000 claims 4
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 claims 4
- VCJMYUPGQJHHFU-UHFFFAOYSA-N iron(3+);trinitrate Chemical compound [Fe+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O VCJMYUPGQJHHFU-UHFFFAOYSA-N 0.000 claims 4
- 239000007800 oxidant agent Substances 0.000 claims 4
- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical compound [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 claims 4
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 claims 4
- 229910052911 sodium silicate Inorganic materials 0.000 claims 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 3
- BHPQYMZQTOCNFJ-UHFFFAOYSA-N Calcium cation Chemical compound [Ca+2] BHPQYMZQTOCNFJ-UHFFFAOYSA-N 0.000 claims 2
- 229910004298 SiO 2 Inorganic materials 0.000 claims 2
- APUPEJJSWDHEBO-UHFFFAOYSA-P ammonium molybdate Chemical compound [NH4+].[NH4+].[O-][Mo]([O-])(=O)=O APUPEJJSWDHEBO-UHFFFAOYSA-P 0.000 claims 2
- 235000018660 ammonium molybdate Nutrition 0.000 claims 2
- 239000011609 ammonium molybdate Substances 0.000 claims 2
- 229940010552 ammonium molybdate Drugs 0.000 claims 2
- 229910001870 ammonium persulfate Inorganic materials 0.000 claims 2
- 229910001424 calcium ion Inorganic materials 0.000 claims 2
- 230000001590 oxidative effect Effects 0.000 claims 2
- 239000002245 particle Substances 0.000 claims 2
- JLKDVMWYMMLWTI-UHFFFAOYSA-M potassium iodate Chemical compound [K+].[O-]I(=O)=O JLKDVMWYMMLWTI-UHFFFAOYSA-M 0.000 claims 2
- 239000001230 potassium iodate Substances 0.000 claims 2
- 235000006666 potassium iodate Nutrition 0.000 claims 2
- 229940093930 potassium iodate Drugs 0.000 claims 2
- 235000010333 potassium nitrate Nutrition 0.000 claims 2
- 239000004323 potassium nitrate Substances 0.000 claims 2
- 239000012286 potassium permanganate Substances 0.000 claims 2
- OKBMCNHOEMXPTM-UHFFFAOYSA-M potassium peroxymonosulfate Chemical compound [K+].OOS([O-])(=O)=O OKBMCNHOEMXPTM-UHFFFAOYSA-M 0.000 claims 2
- 235000019795 sodium metasilicate Nutrition 0.000 claims 2
- 235000019794 sodium silicate Nutrition 0.000 claims 2
- 239000000126 substance Substances 0.000 claims 2
- 229910052715 tantalum Inorganic materials 0.000 claims 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/205,428 US20070039926A1 (en) | 2005-08-17 | 2005-08-17 | Abrasive-free polishing system |
| US11/205,428 | 2005-08-17 | ||
| PCT/US2006/030982 WO2007021716A2 (en) | 2005-08-17 | 2006-08-09 | Abrasive-free polishing system |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009505423A JP2009505423A (ja) | 2009-02-05 |
| JP2009505423A5 true JP2009505423A5 (https=) | 2009-09-17 |
| JP5144516B2 JP5144516B2 (ja) | 2013-02-13 |
Family
ID=37499371
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008526997A Expired - Fee Related JP5144516B2 (ja) | 2005-08-17 | 2006-08-09 | 砥材を有しない研磨システム |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US20070039926A1 (https=) |
| EP (1) | EP1924666B1 (https=) |
| JP (1) | JP5144516B2 (https=) |
| KR (1) | KR101109334B1 (https=) |
| CN (1) | CN101263209B (https=) |
| AT (1) | ATE528364T1 (https=) |
| IL (1) | IL189504A (https=) |
| MY (1) | MY146300A (https=) |
| SG (1) | SG178632A1 (https=) |
| TW (1) | TWI343296B (https=) |
| WO (1) | WO2007021716A2 (https=) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070117497A1 (en) * | 2005-11-22 | 2007-05-24 | Cabot Microelectronics Corporation | Friction reducing aid for CMP |
| CN101333419B (zh) * | 2008-08-05 | 2011-06-29 | 清华大学 | 一种集成电路铜布线的无磨粒化学机械抛光液 |
| CN103493183B (zh) * | 2011-04-26 | 2016-06-08 | 旭硝子株式会社 | 非氧化物单晶基板的研磨方法 |
| DE112012004193T5 (de) | 2011-10-07 | 2014-07-03 | Asahi Glass Co., Ltd. | Siliziumcarbid-Einkristallsubstrat und Polierlösung |
| JP7125386B2 (ja) * | 2017-03-23 | 2022-08-24 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| EP4022002A4 (en) * | 2019-08-30 | 2023-08-23 | Saint-Gobain Ceramics and Plastics, Inc. | FLUID COMPOSITION AND METHOD OF PERFORMING A MATERIAL REMOVAL PROCESS |
| CN114341286B (zh) | 2019-08-30 | 2023-10-20 | 圣戈本陶瓷及塑料股份有限公司 | 用于进行材料去除操作的组合物和方法 |
| TWI873902B (zh) * | 2022-10-11 | 2025-02-21 | 美商Ｃｍｃ材料有限責任公司 | 用於高度摻雜硼之矽膜之化學機械拋光組合物 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4277355A (en) * | 1979-09-28 | 1981-07-07 | Alexander Farcnik | Insulative fireproof textured coating |
| US5352277A (en) * | 1988-12-12 | 1994-10-04 | E. I. Du Pont De Nemours & Company | Final polishing composition |
| MY133700A (en) * | 1996-05-15 | 2007-11-30 | Kobe Steel Ltd | Polishing fluid composition and polishing method |
| JPH09306881A (ja) * | 1996-05-15 | 1997-11-28 | Kobe Steel Ltd | シリコン用研磨液組成物および研磨方法 |
| US20040134873A1 (en) * | 1996-07-25 | 2004-07-15 | Li Yao | Abrasive-free chemical mechanical polishing composition and polishing process containing same |
| SG54606A1 (en) * | 1996-12-05 | 1998-11-16 | Fujimi Inc | Polishing composition |
| US6276996B1 (en) * | 1998-11-10 | 2001-08-21 | Micron Technology, Inc. | Copper chemical-mechanical polishing process using a fixed abrasive polishing pad and a copper layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad |
| US6429133B1 (en) * | 1999-08-31 | 2002-08-06 | Micron Technology, Inc. | Composition compatible with aluminum planarization and methods therefore |
| WO2001019935A1 (en) * | 1999-09-15 | 2001-03-22 | Rodel Holdings, Inc. | Slurry for forming insoluble silicate during chemical-mechanical polishing |
| JP2001144042A (ja) * | 1999-11-11 | 2001-05-25 | Hitachi Chem Co Ltd | 金属研磨方法 |
| US6551935B1 (en) * | 2000-08-31 | 2003-04-22 | Micron Technology, Inc. | Slurry for use in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods |
| US6602117B1 (en) * | 2000-08-30 | 2003-08-05 | Micron Technology, Inc. | Slurry for use with fixed-abrasive polishing pads in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods |
| US6709316B1 (en) * | 2000-10-27 | 2004-03-23 | Applied Materials, Inc. | Method and apparatus for two-step barrier layer polishing |
| US6800218B2 (en) * | 2001-08-23 | 2004-10-05 | Advanced Technology Materials, Inc. | Abrasive free formulations for chemical mechanical polishing of copper and associated materials and method of using same |
| US20030189186A1 (en) * | 2002-03-29 | 2003-10-09 | Everlight Usa, Inc. | Chemical-mechanical polishing composition for metal layers |
| US6974777B2 (en) * | 2002-06-07 | 2005-12-13 | Cabot Microelectronics Corporation | CMP compositions for low-k dielectric materials |
| JP4152218B2 (ja) * | 2003-02-25 | 2008-09-17 | Ｎｅｃエレクトロニクス株式会社 | 化学的機械的研磨用スラリー |
| JP2004276219A (ja) * | 2003-03-18 | 2004-10-07 | Ebara Corp | 電解加工液、電解加工装置及び配線加工方法 |
| US7485241B2 (en) * | 2003-09-11 | 2009-02-03 | Cabot Microelectronics Corporation | Chemical-mechanical polishing composition and method for using the same |
-
2005
- 2005-08-17 US US11/205,428 patent/US20070039926A1/en not_active Abandoned
-
2006
- 2006-08-09 EP EP06813337A patent/EP1924666B1/en not_active Not-in-force
- 2006-08-09 WO PCT/US2006/030982 patent/WO2007021716A2/en not_active Ceased
- 2006-08-09 JP JP2008526997A patent/JP5144516B2/ja not_active Expired - Fee Related
- 2006-08-09 SG SG2010059459A patent/SG178632A1/en unknown
- 2006-08-09 KR KR1020087006318A patent/KR101109334B1/ko not_active Expired - Fee Related
- 2006-08-09 CN CN200680033516XA patent/CN101263209B/zh not_active Expired - Fee Related
- 2006-08-09 AT AT06813337T patent/ATE528364T1/de not_active IP Right Cessation
- 2006-08-15 MY MYPI20063944A patent/MY146300A/en unknown
- 2006-08-17 TW TW095130290A patent/TWI343296B/zh not_active IP Right Cessation
-
2008
- 2008-02-13 IL IL189504A patent/IL189504A/en not_active IP Right Cessation
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