JP2010283418A - ステレオマイクロホン装置 - Google Patents
ステレオマイクロホン装置 Download PDFInfo
- Publication number
- JP2010283418A JP2010283418A JP2009132823A JP2009132823A JP2010283418A JP 2010283418 A JP2010283418 A JP 2010283418A JP 2009132823 A JP2009132823 A JP 2009132823A JP 2009132823 A JP2009132823 A JP 2009132823A JP 2010283418 A JP2010283418 A JP 2010283418A
- Authority
- JP
- Japan
- Prior art keywords
- sound
- mems
- sound pickup
- signal processing
- processing unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
- H04R1/32—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only
- H04R1/40—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by combining a number of identical transducers
- H04R1/406—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by combining a number of identical transducers microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R5/00—Stereophonic arrangements
- H04R5/027—Spatial or constructional arrangements of microphones, e.g. in dummy heads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/146—Mixed devices
- H01L2924/1461—MEMS
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
Landscapes
- Health & Medical Sciences (AREA)
- Otolaryngology (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
- Pressure Sensors (AREA)
- Micromachines (AREA)
- Stereophonic Arrangements (AREA)
Abstract
【解決手段】各MEMS収音素子の直下の実装基板に音孔を設けることで、MEMS収音素子自体が第1側(L側)、第2側(R側)の音声を互いに遮断する。このため、隔壁を設けることなく独立した音響パスを確保することが可能となる。
【選択図】図1
Description
<基本構成>
図1において、実装基板41Pに音孔42L、42Rが形成されており、各音孔の上に収音素子10L、10Rが実装されている。収音素子10L、10Rは、半導体プロセスのMEMS(微小電気機械システム)技術によって作成されたMEMSチップである。MEMSチップの基材にはシリコン基板を用い、これに貫通エッチング処理することにより作成された台座部11の上に絶縁体が形成され、その上に導電性のポリシリコンで形成された振動膜12が形成されている。
本実施形態では、実装基板41P上に信号処理部21を実装した後、収音素子10L、10Rの実装を行い、次いで電源配線45、GND配線32L、32R、46、出力配線31L、31R、43、44のワイヤ配線を行い、カバー41Cの実装を行った。
次に、本実施形態の動作を説明する。音源51からの音が音孔42L、42Rを介して、振動膜12に到達すると、振動膜12が振動し、ギャップが変化することによりコンデンサ容量値が変化する。
VOUT = Vm×G
Vm ∝ 1/(Sb+So)
ここで、VOUTは感度、VmはMEMS出力、Gはゲイン、Sbは背気室スティフネス(stiffness)、Soは振動膜スティフネスである。
図2(a)は、本発明の実施の形態2に示すMEMSマイクロホン装置を上部から見た平面図である。本実施形態のMEMSマイクロホン装置は、実施の形態1の収音素子を3個以上実装することにより、さらに臨場感のある収音を可能としたものである。
図3(a)は、本発明の実施の形態3に示すMEMSマイクロホン装置を上部から見た平面図であり、図3(b)は、図3(a)のB−B断面による構造概略図である。本実施形態のMEMSマイクロホン装置は、実施の形態1の第1の収音素子と第2の収音素子と信号処理部とを1チップ化したものである。
図4(a)は、本発明の実施の形態4に示すMEMSマイクロホン装置を上部から見た平面図であり、図4(b)、図4(c)は、それぞれ図4(a)のC−C断面、D−D断面による構造概略図である。
図5(a)は、本発明の実施の形態5に示すMEMSマイクロホン装置を上部から見た平面図であり、図5(b)は、図5(a)のE−E断面による構造概略図である。
10R 第2の収音素子(MEMSチップ)
11 台座部
12 振動膜
13 固定膜
14 背面孔
21 信号処理部(アンプ)
30 ワイヤ配線
31L 第1の出力配線
31R 第2の出力配線
31T 第3の出力配線
31U 第4の出力配線
32L 第1のGND配線
32R 第2のGND配線
32T 第3のGND配線
32U 第4のGND配線
35 絶縁部
40C 接合材(カバー用)
40M 接合材(MEMS用)
41C カバー
41P 実装基板
42L 第1側音孔
42R 第2側音孔
43 出力配線1
44 出力配線2
45 電源配線
46 GND配線
47 出力配線3
48 出力配線4
51 音源
52L 第1側 音経路
52R 第2側 音経路
Claims (8)
- 半導体製造プロセスを用いて製造される第1及び第2のMEMS収音素子と、
前記第1及び第2のMEMS収音素子が実装される実装基板を有し、
前記実装基板は、前記第1及び第2のMEMS収音素子の直下にそれぞれ第1の音孔、第2の音孔を有するマイクロホン装置。 - 前記第1及び第2のMEMS収音素子を覆うカバーを有し、前記第1及び第2のMEMS収音素子は、前記カバーと前記実装基板により区切られる一つの空間内に配置される請求項1記載のマイクロホン装置。
- 前記実装基板に実装される第3および第4のMEMS収音素子をさらに有し、前記実装基板は、前記第3及び第4のMEMS収音素子の直下にそれぞれ第3の音孔、第4の音孔を有し、前記第1の音孔の中心と第2の音孔の中心を結ぶ線が、前記第3の音孔の中心と第4の音孔の中心を結ぶ線と直交するように、前記第1〜第4の音孔が配置される請求項1または2記載のマイクロホン装置。
- 前記MEMS収音素子は、前記実装基板に、接合材によって周囲を固定されている請求項1〜3のいずれかに記載のマイクロホン装置。
- 前記MEMS収音素子の出力信号に基づいて所定の演算処理を行う信号処理部を有し、前記信号処理部が前記実装基板上に実装されている請求項1〜4のいずれかに記載のマイクロホン装置。
- 前記MEMS収音素子の振動膜の一部は、エレクトレット材により形成されている請求項1〜5のいずれかに記載のマイクロホン装置。
- 前記MEMS収音素子と前記信号処理部とが半導体プロセスにより1チップに集積化されている請求項1〜6のいずれかに記載のマイクロホン装置。
- 前記信号処理部と前記実装基板とは、貫通電極により電気的に接続していることを特徴とする請求項7に記載のマイクロホン装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009132823A JP4505035B1 (ja) | 2009-06-02 | 2009-06-02 | ステレオマイクロホン装置 |
US12/708,587 US7933428B2 (en) | 2009-06-02 | 2010-02-19 | Microphone apparatus |
CN2010101940853A CN101909229A (zh) | 2009-06-02 | 2010-05-31 | 立体声传声器装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009132823A JP4505035B1 (ja) | 2009-06-02 | 2009-06-02 | ステレオマイクロホン装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP4505035B1 JP4505035B1 (ja) | 2010-07-14 |
JP2010283418A true JP2010283418A (ja) | 2010-12-16 |
Family
ID=42575720
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009132823A Active JP4505035B1 (ja) | 2009-06-02 | 2009-06-02 | ステレオマイクロホン装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7933428B2 (ja) |
JP (1) | JP4505035B1 (ja) |
CN (1) | CN101909229A (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015035730A (ja) * | 2013-08-09 | 2015-02-19 | オムロン株式会社 | マイクロフォン、音響センサ及び音響センサの製造方法 |
US9120668B2 (en) | 2013-11-21 | 2015-09-01 | Samsung Electro-Mechanics Co., Ltd. | Microphone package and mounting structure thereof |
US9301033B2 (en) | 2013-05-29 | 2016-03-29 | Hyundai Motor Company | Directional microphone and operating method thereof |
Families Citing this family (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9406561B2 (en) | 2009-04-20 | 2016-08-02 | International Business Machines Corporation | Three dimensional integrated circuit integration using dielectric bonding first and through via formation last |
US20100303274A1 (en) * | 2009-05-18 | 2010-12-02 | William Ryan | Microphone Having Reduced Vibration Sensitivity |
WO2011161738A1 (ja) * | 2010-06-24 | 2011-12-29 | パナソニック株式会社 | センサー |
US20120207335A1 (en) * | 2011-02-14 | 2012-08-16 | Nxp B.V. | Ported mems microphone |
CN103563399B (zh) * | 2011-03-11 | 2017-06-09 | 歌尔股份有限公司 | Cmos兼容的硅差分电容器麦克风及其制造方法 |
US20120288130A1 (en) * | 2011-05-11 | 2012-11-15 | Infineon Technologies Ag | Microphone Arrangement |
US9232302B2 (en) * | 2011-05-31 | 2016-01-05 | Apple Inc. | Microphone assemblies with through-silicon vias |
US8879767B2 (en) * | 2011-08-19 | 2014-11-04 | Knowles Electronics, Llc | Acoustic apparatus and method of manufacturing |
JP5741487B2 (ja) * | 2012-02-29 | 2015-07-01 | オムロン株式会社 | マイクロフォン |
WO2013156539A1 (en) * | 2012-04-17 | 2013-10-24 | Stmicroelectronics S.R.L. | Assembly of a semiconductor integrated device including a mems acoustic transducer |
US8563403B1 (en) | 2012-06-27 | 2013-10-22 | International Business Machines Corporation | Three dimensional integrated circuit integration using alignment via/dielectric bonding first and through via formation last |
US8872288B2 (en) * | 2012-08-09 | 2014-10-28 | Infineon Technologies Ag | Apparatus comprising and a method for manufacturing an embedded MEMS device |
US9181086B1 (en) | 2012-10-01 | 2015-11-10 | The Research Foundation For The State University Of New York | Hinged MEMS diaphragm and method of manufacture therof |
US9167325B2 (en) * | 2012-10-23 | 2015-10-20 | Apple Inc. | Electronic devices with environmental sensors |
US9804003B2 (en) | 2012-10-23 | 2017-10-31 | Apple Inc. | Electronic devices with environmental sensors |
US8692340B1 (en) * | 2013-03-13 | 2014-04-08 | Invensense, Inc. | MEMS acoustic sensor with integrated back cavity |
US9809448B2 (en) | 2013-03-13 | 2017-11-07 | Invensense, Inc. | Systems and apparatus having MEMS acoustic sensors and other MEMS sensors and methods of fabrication of the same |
US20140270259A1 (en) * | 2013-03-13 | 2014-09-18 | Aliphcom | Speech detection using low power microelectrical mechanical systems sensor |
ITTO20130247A1 (it) * | 2013-03-26 | 2014-09-27 | St Microelectronics Srl | Metodo di incapsulamento di un dispositivo trasduttore mems e dispositivo trasduttore mems incapsulato |
US8958592B2 (en) * | 2013-05-23 | 2015-02-17 | Fortemedia, Inc. | Microphone array housing with acoustic extending structure and electronic device utilizing the same |
US9018723B2 (en) * | 2013-06-27 | 2015-04-28 | Stmicroelectronics Pte Ltd | Infrared camera sensor |
US9432759B2 (en) | 2013-07-22 | 2016-08-30 | Infineon Technologies Ag | Surface mountable microphone package, a microphone arrangement, a mobile phone and a method for recording microphone signals |
DE102014100464B4 (de) | 2014-01-16 | 2022-02-17 | Tdk Corporation | Multi-MEMS-Modul |
GB2526945B (en) * | 2014-06-06 | 2017-04-05 | Cirrus Logic Inc | Noise cancellation microphones with shared back volume |
US9532125B2 (en) * | 2014-06-06 | 2016-12-27 | Cirrus Logic, Inc. | Noise cancellation microphones with shared back volume |
KR101610145B1 (ko) * | 2014-11-28 | 2016-04-08 | 현대자동차 주식회사 | 마이크로폰 모듈 및 그 제어방법 |
US9866938B2 (en) * | 2015-02-19 | 2018-01-09 | Knowles Electronics, Llc | Interface for microphone-to-microphone communications |
KR101673347B1 (ko) | 2015-07-07 | 2016-11-07 | 현대자동차 주식회사 | 마이크로폰 |
US9924253B2 (en) * | 2015-07-07 | 2018-03-20 | Hyundai Motor Company | Microphone sensor |
DE112016003649T5 (de) * | 2015-08-10 | 2018-05-09 | Knowles Electronics, Llc | Vorrichtung mit mehreren MEMS-Motoren mit gemeinsamer Entlüftung |
CN105493522B (zh) * | 2015-10-30 | 2018-09-11 | 歌尔股份有限公司 | 带通声学滤波器及声学感测装置 |
TWI596950B (zh) * | 2016-02-03 | 2017-08-21 | 美律實業股份有限公司 | 指向性錄音模組 |
US20170240418A1 (en) * | 2016-02-18 | 2017-08-24 | Knowles Electronics, Llc | Low-cost miniature mems vibration sensor |
ITUA20162959A1 (it) * | 2016-04-28 | 2017-10-28 | St Microelectronics Srl | Modulo di trasduzione multi-camera, apparecchiatura includente il modulo di trasduzione multi-camera e metodo di fabbricazione del modulo di trasduzione multi-camera |
KR101807071B1 (ko) * | 2016-10-06 | 2017-12-08 | 현대자동차 주식회사 | 마이크로폰 및 그 제조 방법 |
CN106535072A (zh) * | 2016-12-05 | 2017-03-22 | 歌尔股份有限公司 | 一种mems麦克风芯片以及mems麦克风 |
US10455321B2 (en) * | 2017-04-28 | 2019-10-22 | Qualcomm Incorporated | Microphone configurations |
CN111742562B (zh) * | 2018-01-24 | 2022-02-08 | 舒尔获得控股公司 | 具有校正电路系统的方向性微机电系统麦克风 |
CN111964154B (zh) * | 2020-08-28 | 2021-09-21 | 邯郸美的制冷设备有限公司 | 空调器室内机、控制方法、运行控制装置及空调器 |
US11284187B1 (en) * | 2020-10-26 | 2022-03-22 | Fortemedia, Inc. | Small-array MEMS microphone apparatus and noise suppression method thereof |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001086588A (ja) * | 1999-09-10 | 2001-03-30 | Canon Inc | 音声信号処理装置及び方法、並びに電子機器 |
JP2004140629A (ja) * | 2002-10-18 | 2004-05-13 | Kenwood Corp | コンデンサマイクロホン |
JP2006211468A (ja) * | 2005-01-31 | 2006-08-10 | Sanyo Electric Co Ltd | 半導体センサ |
JP2007104556A (ja) * | 2005-10-07 | 2007-04-19 | Matsushita Electric Ind Co Ltd | マイクロホン装置 |
JP2007124449A (ja) * | 2005-10-31 | 2007-05-17 | Sanyo Electric Co Ltd | マイクロフォンおよびマイクロフォンモジュール |
JP2008002953A (ja) * | 2006-06-22 | 2008-01-10 | Yamaha Corp | 半導体装置及びその製造方法 |
JP2008199353A (ja) * | 2007-02-14 | 2008-08-28 | Matsushita Electric Ind Co Ltd | Memsマイクロホン装置 |
JP2008271426A (ja) * | 2007-04-24 | 2008-11-06 | Matsushita Electric Works Ltd | 音響センサ |
JP2009071813A (ja) * | 2007-08-20 | 2009-04-02 | Yamaha Corp | 振動トランスデューサ |
JP2009111622A (ja) * | 2007-10-29 | 2009-05-21 | Panasonic Corp | マイクロホン装置、その膜スチフネス測定装置、膜スチフネス測定方法及び電子機器の製造方法 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102004011149B3 (de) * | 2004-03-08 | 2005-11-10 | Infineon Technologies Ag | Mikrophon und Verfahren zur Herstellung eines Mikrophons |
US7936894B2 (en) * | 2004-12-23 | 2011-05-03 | Motorola Mobility, Inc. | Multielement microphone |
US7373835B2 (en) * | 2005-01-31 | 2008-05-20 | Sanyo Electric Industries, Ltd. | Semiconductor sensor |
TW200706052A (en) * | 2005-05-20 | 2007-02-01 | Fortemedia Inc | Multi-microphone capsule |
SG130158A1 (en) * | 2005-08-20 | 2007-03-20 | Bse Co Ltd | Silicon based condenser microphone and packaging method for the same |
US8351632B2 (en) * | 2005-08-23 | 2013-01-08 | Analog Devices, Inc. | Noise mitigating microphone system and method |
JP2007081614A (ja) * | 2005-09-13 | 2007-03-29 | Star Micronics Co Ltd | コンデンサマイクロホン |
JP4468280B2 (ja) | 2005-10-07 | 2010-05-26 | パナソニック株式会社 | マイクロホン装置 |
DE102005053765B4 (de) * | 2005-11-10 | 2016-04-14 | Epcos Ag | MEMS-Package und Verfahren zur Herstellung |
US20070158826A1 (en) * | 2005-12-27 | 2007-07-12 | Yamaha Corporation | Semiconductor device |
US20080192963A1 (en) * | 2007-02-09 | 2008-08-14 | Yamaha Corporation | Condenser microphone |
US20080205668A1 (en) * | 2007-02-26 | 2008-08-28 | Yamaha Corporation | Sensitive silicon microphone with wide dynamic range |
JP5114106B2 (ja) | 2007-06-21 | 2013-01-09 | 株式会社船井電機新応用技術研究所 | 音声入出力装置及び通話装置 |
EP2007167A3 (en) * | 2007-06-21 | 2013-01-23 | Funai Electric Advanced Applied Technology Research Institute Inc. | Voice input-output device and communication device |
DE112009002542A5 (de) * | 2008-10-14 | 2011-09-08 | Knowles Electronics, Llc | Mikrofon mit einer Mehrzahl von Wandlerelementen |
-
2009
- 2009-06-02 JP JP2009132823A patent/JP4505035B1/ja active Active
-
2010
- 2010-02-19 US US12/708,587 patent/US7933428B2/en active Active
- 2010-05-31 CN CN2010101940853A patent/CN101909229A/zh active Pending
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001086588A (ja) * | 1999-09-10 | 2001-03-30 | Canon Inc | 音声信号処理装置及び方法、並びに電子機器 |
JP2004140629A (ja) * | 2002-10-18 | 2004-05-13 | Kenwood Corp | コンデンサマイクロホン |
JP2006211468A (ja) * | 2005-01-31 | 2006-08-10 | Sanyo Electric Co Ltd | 半導体センサ |
JP2007104556A (ja) * | 2005-10-07 | 2007-04-19 | Matsushita Electric Ind Co Ltd | マイクロホン装置 |
JP2007124449A (ja) * | 2005-10-31 | 2007-05-17 | Sanyo Electric Co Ltd | マイクロフォンおよびマイクロフォンモジュール |
JP2008002953A (ja) * | 2006-06-22 | 2008-01-10 | Yamaha Corp | 半導体装置及びその製造方法 |
JP2008199353A (ja) * | 2007-02-14 | 2008-08-28 | Matsushita Electric Ind Co Ltd | Memsマイクロホン装置 |
JP2008271426A (ja) * | 2007-04-24 | 2008-11-06 | Matsushita Electric Works Ltd | 音響センサ |
JP2009071813A (ja) * | 2007-08-20 | 2009-04-02 | Yamaha Corp | 振動トランスデューサ |
JP2009111622A (ja) * | 2007-10-29 | 2009-05-21 | Panasonic Corp | マイクロホン装置、その膜スチフネス測定装置、膜スチフネス測定方法及び電子機器の製造方法 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9301033B2 (en) | 2013-05-29 | 2016-03-29 | Hyundai Motor Company | Directional microphone and operating method thereof |
JP2015035730A (ja) * | 2013-08-09 | 2015-02-19 | オムロン株式会社 | マイクロフォン、音響センサ及び音響センサの製造方法 |
US9120668B2 (en) | 2013-11-21 | 2015-09-01 | Samsung Electro-Mechanics Co., Ltd. | Microphone package and mounting structure thereof |
Also Published As
Publication number | Publication date |
---|---|
US7933428B2 (en) | 2011-04-26 |
JP4505035B1 (ja) | 2010-07-14 |
CN101909229A (zh) | 2010-12-08 |
US20100303273A1 (en) | 2010-12-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4505035B1 (ja) | ステレオマイクロホン装置 | |
US10477301B2 (en) | Top port multi-part surface mount silicon condenser microphone | |
US10015600B2 (en) | Multi-MEMS module | |
US9002040B2 (en) | Packages and methods for packaging MEMS microphone devices | |
US9150409B1 (en) | Methods of manufacture of bottom port surface mount MEMS microphones | |
US8759149B2 (en) | Encapsulated micro-electro-mechanical device, in particular a MEMS acoustic transducer | |
KR20150040307A (ko) | 마이크로폰 어셈블리 | |
US20150251898A1 (en) | Embedded Circuit In A MEMS Device | |
JP2007180201A (ja) | 半導体装置 | |
JP2008219435A (ja) | コンデンサマイクロホン。 | |
JP2011004109A (ja) | Memsデバイス |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20100423 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4505035 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130430 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130430 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140430 Year of fee payment: 4 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |