JP2010252302A - 屈曲振動片およびそれを用いた発振器 - Google Patents
屈曲振動片およびそれを用いた発振器 Download PDFInfo
- Publication number
- JP2010252302A JP2010252302A JP2010002669A JP2010002669A JP2010252302A JP 2010252302 A JP2010252302 A JP 2010252302A JP 2010002669 A JP2010002669 A JP 2010002669A JP 2010002669 A JP2010002669 A JP 2010002669A JP 2010252302 A JP2010252302 A JP 2010252302A
- Authority
- JP
- Japan
- Prior art keywords
- heat conduction
- region
- bending vibration
- vibrating
- vibration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000005452 bending Methods 0.000 title claims description 96
- 230000005284 excitation Effects 0.000 claims abstract description 76
- 239000000463 material Substances 0.000 claims description 53
- 239000012811 non-conductive material Substances 0.000 claims description 6
- 230000010355 oscillation Effects 0.000 claims description 5
- 239000013078 crystal Substances 0.000 abstract description 58
- 239000010453 quartz Substances 0.000 abstract description 25
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 25
- 230000007423 decrease Effects 0.000 abstract description 14
- 239000000758 substrate Substances 0.000 description 16
- 230000004048 modification Effects 0.000 description 12
- 238000012986 modification Methods 0.000 description 12
- 230000000694 effects Effects 0.000 description 9
- 230000006835 compression Effects 0.000 description 7
- 238000007906 compression Methods 0.000 description 7
- 239000010408 film Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000615 nonconductor Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910013641 LiNbO 3 Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- PSHMSSXLYVAENJ-UHFFFAOYSA-N dilithium;[oxido(oxoboranyloxy)boranyl]oxy-oxoboranyloxyborinate Chemical compound [Li+].[Li+].O=BOB([O-])OB([O-])OB=O PSHMSSXLYVAENJ-UHFFFAOYSA-N 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- PBCFLUZVCVVTBY-UHFFFAOYSA-N tantalum pentoxide Inorganic materials O=[Ta](=O)O[Ta](=O)=O PBCFLUZVCVVTBY-UHFFFAOYSA-N 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/21—Crystal tuning forks
- H03H9/215—Crystal tuning forks consisting of quartz
Landscapes
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010002669A JP2010252302A (ja) | 2009-03-25 | 2010-01-08 | 屈曲振動片およびそれを用いた発振器 |
| US12/729,759 US8362854B2 (en) | 2009-03-25 | 2010-03-23 | Flexural vibration piece and oscillator using the same |
| CN2010101483190A CN101847978B (zh) | 2009-03-25 | 2010-03-25 | 弯曲振动片及利用该弯曲振动片的振荡器 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009073739 | 2009-03-25 | ||
| JP2010002669A JP2010252302A (ja) | 2009-03-25 | 2010-01-08 | 屈曲振動片およびそれを用いた発振器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010252302A true JP2010252302A (ja) | 2010-11-04 |
| JP2010252302A5 JP2010252302A5 (enExample) | 2013-02-14 |
Family
ID=42772462
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010002669A Withdrawn JP2010252302A (ja) | 2009-03-25 | 2010-01-08 | 屈曲振動片およびそれを用いた発振器 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US8362854B2 (enExample) |
| JP (1) | JP2010252302A (enExample) |
| CN (1) | CN101847978B (enExample) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8482358B2 (en) | 2010-07-09 | 2013-07-09 | Seiko Epson Corporation | Flexural resonator element, resonator, oscillator, and electronic device |
| US8525606B2 (en) | 2011-02-02 | 2013-09-03 | Seiko Epson Corporation | Vibrator element, vibrator, oscillator, and electronic device |
| US8581669B2 (en) | 2011-02-02 | 2013-11-12 | Seiko Epson Corporation | Vibrator element, vibrator, oscillator, and electronic apparatus |
| US8760235B2 (en) | 2010-07-09 | 2014-06-24 | Seiko Epson Corporation | Resonator element, resonator, and oscillator |
| US8816572B2 (en) | 2010-04-08 | 2014-08-26 | Seiko Epson Corporation | Resonator element and resonator having a tapered arm next to the base |
| US9354128B2 (en) | 2013-12-27 | 2016-05-31 | Seiko Epson Corporation | Resonator element, resonator, oscillator, electronic apparatus, sensor, and mobile object |
| US9461615B2 (en) | 2013-07-19 | 2016-10-04 | Seiko Epson Corporation | Vibrator element, vibrator, oscillator, electronic apparatus, and moving object |
| US9705472B2 (en) | 2013-06-24 | 2017-07-11 | Seiko Epson Corporation | Resonator element, resonator, electronic device, electronic apparatus, and moving object |
| JP2018160802A (ja) * | 2017-03-23 | 2018-10-11 | セイコーエプソン株式会社 | 振動素子、電子デバイス、電子機器および移動体 |
| WO2019059187A1 (ja) * | 2017-09-21 | 2019-03-28 | 住友精密工業株式会社 | 角速度センサ |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105210295B (zh) | 2013-05-13 | 2017-10-03 | 株式会社村田制作所 | 振动装置 |
| SG11201508860QA (en) * | 2013-05-13 | 2015-11-27 | Murata Manufacturing Co | Vibrating device |
| CN107453649B (zh) * | 2017-08-17 | 2023-06-16 | 浙江师范大学 | 一种压电振子单向弯曲的车载俘能器 |
| DE102017130527A1 (de) * | 2017-12-19 | 2019-06-19 | Endress+Hauser SE+Co. KG | Vibronischer Sensor |
| US10797681B1 (en) * | 2019-07-25 | 2020-10-06 | Zhuhai Crystal Resonance Technologies Co., Ltd. | Method of fabricating novel packages for electronic components |
| DE102020116299A1 (de) * | 2020-06-19 | 2021-12-23 | Endress+Hauser SE+Co. KG | Symmetrierung eines vibronischen Sensors |
| JP7689421B2 (ja) * | 2020-11-30 | 2025-06-06 | エスアイアイ・クリスタルテクノロジー株式会社 | 圧電振動片の製造方法 |
| CN120979381A (zh) * | 2023-12-29 | 2025-11-18 | 天津大学 | 一种音叉型压电振动片及振荡器 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07139953A (ja) * | 1993-11-19 | 1995-06-02 | Toyota Central Res & Dev Lab Inc | 角速度検出素子の振動数調整方法と角速度検出素子 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0232229U (enExample) | 1988-08-23 | 1990-02-28 | ||
| JP2002261575A (ja) | 2000-12-25 | 2002-09-13 | Seiko Epson Corp | 振動片、振動子、発振器及び電子機器 |
| US6587009B2 (en) | 2000-12-25 | 2003-07-01 | Seiko Epson Corporation | Vibrating piece, vibrator, oscillator, and electronic equipment |
| JP2004260718A (ja) | 2003-02-27 | 2004-09-16 | Seiko Epson Corp | 音叉型振動片及び音叉型振動片の製造方法並びに圧電デバイス |
| JP4301200B2 (ja) * | 2004-10-20 | 2009-07-22 | セイコーエプソン株式会社 | 圧電振動片および圧電デバイス |
| JP4277818B2 (ja) * | 2005-03-22 | 2009-06-10 | セイコーエプソン株式会社 | 圧電振動片および圧電デバイス |
| CH700716B1 (fr) | 2006-10-09 | 2010-10-15 | Suisse Electronique Microtech | Résonateur en silicium de type diapason. |
| US8067880B2 (en) * | 2008-12-27 | 2011-11-29 | Seiko Epson Corporation | Flexural vibration element and electronic component |
| JP5446839B2 (ja) * | 2009-02-17 | 2014-03-19 | セイコーエプソン株式会社 | 振動片および振動子 |
| JP2010252303A (ja) * | 2009-03-25 | 2010-11-04 | Seiko Epson Corp | 屈曲振動片およびそれを用いた発振器 |
-
2010
- 2010-01-08 JP JP2010002669A patent/JP2010252302A/ja not_active Withdrawn
- 2010-03-23 US US12/729,759 patent/US8362854B2/en not_active Expired - Fee Related
- 2010-03-25 CN CN2010101483190A patent/CN101847978B/zh not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07139953A (ja) * | 1993-11-19 | 1995-06-02 | Toyota Central Res & Dev Lab Inc | 角速度検出素子の振動数調整方法と角速度検出素子 |
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8816572B2 (en) | 2010-04-08 | 2014-08-26 | Seiko Epson Corporation | Resonator element and resonator having a tapered arm next to the base |
| US9257961B2 (en) | 2010-04-08 | 2016-02-09 | Seiko Epson Corporation | Resonator element and resonator having a tapered arm next to the base |
| US9252741B2 (en) | 2010-04-08 | 2016-02-02 | Seiko Epson Corporation | Resonator element and resonator having a tapered arm next to the base |
| US9325278B2 (en) | 2010-07-09 | 2016-04-26 | Seiko Epson Corporation | Resonator element, resonator, and oscillator |
| US9166554B2 (en) | 2010-07-09 | 2015-10-20 | Seiko Epson Corporation | Flexural resonator element, resonator, oscillator, and electronic device |
| US8482358B2 (en) | 2010-07-09 | 2013-07-09 | Seiko Epson Corporation | Flexural resonator element, resonator, oscillator, and electronic device |
| US8760235B2 (en) | 2010-07-09 | 2014-06-24 | Seiko Epson Corporation | Resonator element, resonator, and oscillator |
| US8581669B2 (en) | 2011-02-02 | 2013-11-12 | Seiko Epson Corporation | Vibrator element, vibrator, oscillator, and electronic apparatus |
| US8525606B2 (en) | 2011-02-02 | 2013-09-03 | Seiko Epson Corporation | Vibrator element, vibrator, oscillator, and electronic device |
| US9705472B2 (en) | 2013-06-24 | 2017-07-11 | Seiko Epson Corporation | Resonator element, resonator, electronic device, electronic apparatus, and moving object |
| US10659006B2 (en) | 2013-06-24 | 2020-05-19 | Seiko Epson Corporation | Resonator element, resonator, electronic device, electronic apparatus, and moving object |
| US9461615B2 (en) | 2013-07-19 | 2016-10-04 | Seiko Epson Corporation | Vibrator element, vibrator, oscillator, electronic apparatus, and moving object |
| US9354128B2 (en) | 2013-12-27 | 2016-05-31 | Seiko Epson Corporation | Resonator element, resonator, oscillator, electronic apparatus, sensor, and mobile object |
| JP2018160802A (ja) * | 2017-03-23 | 2018-10-11 | セイコーエプソン株式会社 | 振動素子、電子デバイス、電子機器および移動体 |
| WO2019059187A1 (ja) * | 2017-09-21 | 2019-03-28 | 住友精密工業株式会社 | 角速度センサ |
| JPWO2019059187A1 (ja) * | 2017-09-21 | 2020-11-19 | 住友精密工業株式会社 | 角速度センサ |
| JP7258760B2 (ja) | 2017-09-21 | 2023-04-17 | 住友精密工業株式会社 | 角速度センサ |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101847978B (zh) | 2013-09-04 |
| US8362854B2 (en) | 2013-01-29 |
| CN101847978A (zh) | 2010-09-29 |
| US20100244989A1 (en) | 2010-09-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2010252302A (ja) | 屈曲振動片およびそれを用いた発振器 | |
| US8232707B2 (en) | Flexural vibration piece and oscillator using the same | |
| JP5617392B2 (ja) | 振動片、振動子及び発振器 | |
| JP5381694B2 (ja) | 振動片、振動子、センサー及び電子部品 | |
| JP5593979B2 (ja) | 振動片、振動子、発振器、センサー及び電子機器 | |
| JP2010226608A (ja) | 屈曲振動片およびそれを用いた発振器 | |
| KR101074975B1 (ko) | 굴곡 진동편, 굴곡 진동자, 및 전자 디바이스 | |
| JP2009065270A (ja) | メサ型振動片およびメサ型振動デバイス | |
| CN102025342A (zh) | 振动片、振子、振荡器、以及电子仪器 | |
| JP4930381B2 (ja) | 圧電振動装置 | |
| JP5445114B2 (ja) | 振動片および発振器 | |
| JP2010226610A (ja) | 屈曲振動片およびそれを用いた発振器 | |
| JP2011228980A (ja) | 振動片、振動子、発振器、および電子機器 | |
| JP2010226609A (ja) | 振動片および振動子 | |
| JP2012165467A (ja) | 振動片、振動デバイス、発振器、及び電子機器 | |
| JP7029114B2 (ja) | 高q mems共振子 | |
| JP5621285B2 (ja) | 振動片、振動子および発振器 | |
| CN104410382B (zh) | 振动片、振子、振荡器、以及电子仪器 | |
| JP2011254351A (ja) | 圧電振動片、圧電振動子および圧電発振器 | |
| JP5761429B2 (ja) | 振動片、振動子、発振器、および電子機器 | |
| JP2011082841A (ja) | 振動片 | |
| JP2008283665A (ja) | 輪郭振動子 | |
| JP2015027093A (ja) | 振動片、振動子及び発振器 | |
| JP2011254352A (ja) | 振動片、振動子および発振器 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20121219 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20121219 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20130815 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130820 |
|
| A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20131016 |