JP2010205851A - 半導体装置及びその製造方法、並びに電子装置 - Google Patents

半導体装置及びその製造方法、並びに電子装置 Download PDF

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JP2010205851A
JP2010205851A JP2009048491A JP2009048491A JP2010205851A JP 2010205851 A JP2010205851 A JP 2010205851A JP 2009048491 A JP2009048491 A JP 2009048491A JP 2009048491 A JP2009048491 A JP 2009048491A JP 2010205851 A JP2010205851 A JP 2010205851A
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Prior art keywords
sealing resin
electronic component
support
connection
semiconductor device
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JP2009048491A
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JP2010205851A5 (enExample
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Yuji Kunimoto
裕治 国本
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Priority to JP2009048491A priority Critical patent/JP2010205851A/ja
Priority to US12/715,008 priority patent/US20100219522A1/en
Publication of JP2010205851A publication Critical patent/JP2010205851A/ja
Publication of JP2010205851A5 publication Critical patent/JP2010205851A5/ja
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  • Engineering & Computer Science (AREA)
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  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
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