JP2010193133A - 屈曲振動片および屈曲振動子 - Google Patents
屈曲振動片および屈曲振動子 Download PDFInfo
- Publication number
- JP2010193133A JP2010193133A JP2009034861A JP2009034861A JP2010193133A JP 2010193133 A JP2010193133 A JP 2010193133A JP 2009034861 A JP2009034861 A JP 2009034861A JP 2009034861 A JP2009034861 A JP 2009034861A JP 2010193133 A JP2010193133 A JP 2010193133A
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- JP
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- Prior art keywords
- bending vibration
- groove
- vibration piece
- hole
- bending
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000005452 bending Methods 0.000 title claims abstract description 163
- 239000000758 substrate Substances 0.000 claims description 13
- 239000010453 quartz Substances 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 238000001514 detection method Methods 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 238000005530 etching Methods 0.000 description 26
- 238000004519 manufacturing process Methods 0.000 description 21
- 239000000463 material Substances 0.000 description 15
- 229910052751 metal Inorganic materials 0.000 description 13
- 239000002184 metal Substances 0.000 description 13
- 230000000694 effects Effects 0.000 description 10
- 239000013078 crystal Substances 0.000 description 9
- 238000001039 wet etching Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 238000012986 modification Methods 0.000 description 7
- 230000004048 modification Effects 0.000 description 7
- 238000000059 patterning Methods 0.000 description 7
- 230000005684 electric field Effects 0.000 description 5
- 239000010931 gold Substances 0.000 description 4
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- 238000001312 dry etching Methods 0.000 description 3
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/21—Crystal tuning forks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
- H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H2003/026—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks the resonators or networks being of the tuning fork type
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
- H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
- H03H2009/241—Bulk-mode MEMS resonators
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009034861A JP2010193133A (ja) | 2009-02-18 | 2009-02-18 | 屈曲振動片および屈曲振動子 |
| US12/706,728 US8018127B2 (en) | 2009-02-18 | 2010-02-17 | Flexural resonator element and flexural resonator for reducing energy loss due to heat dissipation |
| US13/194,288 US20110278992A1 (en) | 2009-02-18 | 2011-07-29 | Flexural resonator element and flexural resonator for reducing energy loss due to heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009034861A JP2010193133A (ja) | 2009-02-18 | 2009-02-18 | 屈曲振動片および屈曲振動子 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010018327A Division JP5299645B2 (ja) | 2010-01-29 | 2010-01-29 | 屈曲振動片および屈曲振動子の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010193133A true JP2010193133A (ja) | 2010-09-02 |
| JP2010193133A5 JP2010193133A5 (enExample) | 2012-03-15 |
Family
ID=42559268
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009034861A Withdrawn JP2010193133A (ja) | 2009-02-18 | 2009-02-18 | 屈曲振動片および屈曲振動子 |
Country Status (2)
| Country | Link |
|---|---|
| US (2) | US8018127B2 (enExample) |
| JP (1) | JP2010193133A (enExample) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013118633A (ja) * | 2011-12-01 | 2013-06-13 | Samsung Electro-Mechanics Co Ltd | 圧電振動子及びその製造方法 |
| JP2013190307A (ja) * | 2012-03-13 | 2013-09-26 | Seiko Epson Corp | ジャイロセンサーおよび電子機器 |
| JP2013190306A (ja) * | 2012-03-13 | 2013-09-26 | Seiko Epson Corp | ジャイロセンサーおよび電子機器 |
| JP2013190305A (ja) * | 2012-03-13 | 2013-09-26 | Seiko Epson Corp | ジャイロセンサーおよび電子機器 |
| JP2013190304A (ja) * | 2012-03-13 | 2013-09-26 | Seiko Epson Corp | ジャイロセンサーおよび電子機器 |
| JP2013251672A (ja) * | 2012-05-31 | 2013-12-12 | Seiko Epson Corp | 振動片、電子デバイス、電子機器および振動片の製造方法 |
| JP2014103572A (ja) * | 2012-11-21 | 2014-06-05 | Daishinku Corp | 音叉型圧電振動片、音叉型圧電振動デバイス、及び、音叉型圧電振動片の製造方法 |
| JP2014107817A (ja) * | 2012-11-29 | 2014-06-09 | Daishinku Corp | 音叉型圧電振動片、及び音叉型圧電振動デバイス |
| JP2015033075A (ja) * | 2013-08-06 | 2015-02-16 | 京セラクリスタルデバイス株式会社 | 水晶振動素子及びその製造方法 |
| US9819328B2 (en) | 2013-01-29 | 2017-11-14 | Murata Manufacturing Co., Ltd. | Tuning-fork type quartz vibrator |
| JP2019165358A (ja) * | 2018-03-20 | 2019-09-26 | エスアイアイ・クリスタルテクノロジー株式会社 | 双音叉型圧電振動片 |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010193133A (ja) * | 2009-02-18 | 2010-09-02 | Epson Toyocom Corp | 屈曲振動片および屈曲振動子 |
| JP5272880B2 (ja) * | 2009-04-30 | 2013-08-28 | セイコーエプソン株式会社 | 屈曲振動片 |
| JP5482541B2 (ja) * | 2009-10-01 | 2014-05-07 | セイコーエプソン株式会社 | 振動片、振動子、発振器、及び電子機器 |
| US20110227450A1 (en) * | 2010-03-18 | 2011-09-22 | Seiko Epson Corporation | Resonator body, resonator device, and electronic device |
| US20110227451A1 (en) * | 2010-03-18 | 2011-09-22 | Seiko Epson Corporation | Resonator body, resonator device, and electronic device |
| US8368476B2 (en) * | 2010-03-19 | 2013-02-05 | Seiko Epson Corporation | Resonator element, resonator device and electronic device |
| US9222776B2 (en) * | 2012-03-13 | 2015-12-29 | Seiko Epson Corporation | Gyro sensor and electronic apparatus |
| US8971556B2 (en) * | 2012-06-10 | 2015-03-03 | Apple Inc. | Remotely controlling a hearing device |
| JP5742868B2 (ja) | 2013-04-11 | 2015-07-01 | 株式会社大真空 | 音叉型水晶振動片、及び水晶振動デバイス |
| JP6435596B2 (ja) * | 2013-08-09 | 2018-12-12 | セイコーエプソン株式会社 | 振動素子、振動デバイス、電子機器、および移動体 |
| JP2015179933A (ja) * | 2014-03-19 | 2015-10-08 | セイコーエプソン株式会社 | 振動素子、ジャイロセンサー素子、電子デバイス、電子機器および移動体 |
| JP6582501B2 (ja) * | 2015-04-02 | 2019-10-02 | セイコーエプソン株式会社 | 振動素子、振動子、電子機器および移動体 |
| US10110198B1 (en) * | 2015-12-17 | 2018-10-23 | Hrl Laboratories, Llc | Integrated quartz MEMS tuning fork resonator/oscillator |
| WO2019036010A1 (en) * | 2017-08-17 | 2019-02-21 | University Of Florida Research Foundation, Incorporated | VOLUME WAVE VOLTAGE RESONATOR TECHNOLOGY FOR UHF AND SHF SIGNAL PROCESSING |
| US11754452B2 (en) * | 2018-08-17 | 2023-09-12 | Schlumberger Technology Corporation | Resonating sensor for high-pressure and high-temperature environments |
| US12391546B1 (en) * | 2021-01-07 | 2025-08-19 | Skyworks Global Pte. Ltd. | Method of making acoustic devices with directional reinforcement |
| JP2023048349A (ja) * | 2021-09-28 | 2023-04-07 | セイコーエプソン株式会社 | 振動素子の製造方法 |
| JP2023048348A (ja) * | 2021-09-28 | 2023-04-07 | セイコーエプソン株式会社 | 振動素子の製造方法 |
Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5665517A (en) * | 1979-10-15 | 1981-06-03 | Ebauches Sa | Piezoelectric vibrator |
| JPH06112760A (ja) * | 1992-09-25 | 1994-04-22 | Seiko Electronic Components Ltd | 捩り水晶振動子 |
| JP2004088706A (ja) * | 2002-07-02 | 2004-03-18 | Daishinku Corp | エッチング方法及びその方法によって成形されたエッチング成形品 |
| JP2004120556A (ja) * | 2002-09-27 | 2004-04-15 | Daishinku Corp | 音叉型振動片及び音叉型振動子 |
| JP2004120351A (ja) * | 2002-09-26 | 2004-04-15 | Seiko Epson Corp | 圧電振動片の製造方法 |
| JP2004129181A (ja) * | 2002-10-03 | 2004-04-22 | Herutsu Kk | 水晶振動子の電極構造 |
| JP2004248237A (ja) * | 2003-02-12 | 2004-09-02 | Herutsu Kk | 音叉型水晶振動子 |
| JP2006060727A (ja) * | 2004-08-24 | 2006-03-02 | River Eletec Kk | 音叉型水晶振動子及びその製造方法 |
| JP2006217603A (ja) * | 2006-01-30 | 2006-08-17 | Nippon Dempa Kogyo Co Ltd | 圧電振動子 |
| JP2006270335A (ja) * | 2005-03-23 | 2006-10-05 | River Eletec Kk | 音叉型屈曲振動子 |
| JP2007013384A (ja) * | 2005-06-29 | 2007-01-18 | Seiko Epson Corp | 圧電振動片の製造方法、圧電振動片 |
| JP2007163244A (ja) * | 2005-12-13 | 2007-06-28 | Epson Toyocom Corp | 加速度センサ素子、加速度センサ |
| JP2007329879A (ja) * | 2006-06-09 | 2007-12-20 | Kyocera Kinseki Hertz Corp | 音叉型屈曲水晶振動片とその製造方法 |
| JP2008167171A (ja) * | 2006-12-28 | 2008-07-17 | Nippon Dempa Kogyo Co Ltd | 圧電振動片の製造方法、圧電振動片および圧電デバイス |
| JP2008306468A (ja) * | 2007-06-07 | 2008-12-18 | Epson Toyocom Corp | 圧電振動片及び圧電振動子 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55138916A (en) * | 1979-04-18 | 1980-10-30 | Seiko Instr & Electronics Ltd | Composite crystal resonator |
| JP2625511B2 (ja) | 1988-07-21 | 1997-07-02 | 株式会社クボタ | 穀粒選別装置用穀粒分布検出装置 |
| JP4001029B2 (ja) * | 2002-03-25 | 2007-10-31 | セイコーエプソン株式会社 | 音叉型圧電振動片及びその製造方法、圧電デバイス |
| JP2004282230A (ja) | 2003-03-13 | 2004-10-07 | Seiko Epson Corp | 圧電振動片、及びこれを利用した圧電デバイス、並びにこれを利用した携帯電話装置、電子機器 |
| JP2004336207A (ja) | 2003-05-01 | 2004-11-25 | Seiko Epson Corp | 圧電振動片と圧電振動片を利用した圧電デバイス、ならびに圧電デバイスを利用した携帯電話装置および圧電デバイスを利用した電子機器 |
| JP4020010B2 (ja) | 2003-05-20 | 2007-12-12 | セイコーエプソン株式会社 | 圧電振動片と圧電振動片を利用した圧電デバイス、ならびに圧電デバイスを利用した携帯電話装置および圧電デバイスを利用した電子機器 |
| JP3941736B2 (ja) | 2003-05-22 | 2007-07-04 | セイコーエプソン株式会社 | 水晶振動片とその製造方法及び水晶振動片を利用した水晶デバイス、ならびに水晶デバイスを利用した携帯電話装置および水晶デバイスを利用した電子機器 |
| JP2005123828A (ja) | 2003-10-15 | 2005-05-12 | Seiko Epson Corp | 音叉型圧電振動片及び圧電デバイス |
| JP4265499B2 (ja) | 2004-05-12 | 2009-05-20 | セイコーエプソン株式会社 | 圧電振動片および圧電デバイス |
| JP2006086726A (ja) | 2004-09-15 | 2006-03-30 | Seiko Epson Corp | 圧電振動片と圧電デバイスおよび圧電デバイスの製造方法 |
| JP2006086996A (ja) | 2004-09-17 | 2006-03-30 | Seiko Epson Corp | 圧電振動片と圧電デバイスおよび圧電デバイスの製造方法 |
| JP4214412B2 (ja) * | 2004-10-21 | 2009-01-28 | セイコーエプソン株式会社 | 圧電振動片と圧電デバイスならびにジャイロセンサ |
| JP4591035B2 (ja) | 2004-10-21 | 2010-12-01 | セイコーエプソン株式会社 | 圧電振動片ならびに圧電デバイスの製造方法 |
| JP4539708B2 (ja) * | 2007-11-02 | 2010-09-08 | エプソントヨコム株式会社 | 圧電振動片、圧電振動子および加速度センサ |
| US8234774B2 (en) * | 2007-12-21 | 2012-08-07 | Sitime Corporation | Method for fabricating a microelectromechanical system (MEMS) resonator |
| JP2009212670A (ja) * | 2008-03-03 | 2009-09-17 | Citizen Holdings Co Ltd | 水晶デバイスの製造方法 |
| JP2010010734A (ja) * | 2008-06-24 | 2010-01-14 | Nippon Dempa Kogyo Co Ltd | 圧電振動片及び圧電デバイス |
| JP2010193133A (ja) * | 2009-02-18 | 2010-09-02 | Epson Toyocom Corp | 屈曲振動片および屈曲振動子 |
-
2009
- 2009-02-18 JP JP2009034861A patent/JP2010193133A/ja not_active Withdrawn
-
2010
- 2010-02-17 US US12/706,728 patent/US8018127B2/en not_active Expired - Fee Related
-
2011
- 2011-07-29 US US13/194,288 patent/US20110278992A1/en not_active Abandoned
Patent Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5665517A (en) * | 1979-10-15 | 1981-06-03 | Ebauches Sa | Piezoelectric vibrator |
| JPH06112760A (ja) * | 1992-09-25 | 1994-04-22 | Seiko Electronic Components Ltd | 捩り水晶振動子 |
| JP2004088706A (ja) * | 2002-07-02 | 2004-03-18 | Daishinku Corp | エッチング方法及びその方法によって成形されたエッチング成形品 |
| JP2004120351A (ja) * | 2002-09-26 | 2004-04-15 | Seiko Epson Corp | 圧電振動片の製造方法 |
| JP2004120556A (ja) * | 2002-09-27 | 2004-04-15 | Daishinku Corp | 音叉型振動片及び音叉型振動子 |
| JP2004129181A (ja) * | 2002-10-03 | 2004-04-22 | Herutsu Kk | 水晶振動子の電極構造 |
| JP2004248237A (ja) * | 2003-02-12 | 2004-09-02 | Herutsu Kk | 音叉型水晶振動子 |
| JP2006060727A (ja) * | 2004-08-24 | 2006-03-02 | River Eletec Kk | 音叉型水晶振動子及びその製造方法 |
| JP2006270335A (ja) * | 2005-03-23 | 2006-10-05 | River Eletec Kk | 音叉型屈曲振動子 |
| JP2007013384A (ja) * | 2005-06-29 | 2007-01-18 | Seiko Epson Corp | 圧電振動片の製造方法、圧電振動片 |
| JP2007163244A (ja) * | 2005-12-13 | 2007-06-28 | Epson Toyocom Corp | 加速度センサ素子、加速度センサ |
| JP2006217603A (ja) * | 2006-01-30 | 2006-08-17 | Nippon Dempa Kogyo Co Ltd | 圧電振動子 |
| JP2007329879A (ja) * | 2006-06-09 | 2007-12-20 | Kyocera Kinseki Hertz Corp | 音叉型屈曲水晶振動片とその製造方法 |
| JP2008167171A (ja) * | 2006-12-28 | 2008-07-17 | Nippon Dempa Kogyo Co Ltd | 圧電振動片の製造方法、圧電振動片および圧電デバイス |
| JP2008306468A (ja) * | 2007-06-07 | 2008-12-18 | Epson Toyocom Corp | 圧電振動片及び圧電振動子 |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013118633A (ja) * | 2011-12-01 | 2013-06-13 | Samsung Electro-Mechanics Co Ltd | 圧電振動子及びその製造方法 |
| JP2013190307A (ja) * | 2012-03-13 | 2013-09-26 | Seiko Epson Corp | ジャイロセンサーおよび電子機器 |
| JP2013190306A (ja) * | 2012-03-13 | 2013-09-26 | Seiko Epson Corp | ジャイロセンサーおよび電子機器 |
| JP2013190305A (ja) * | 2012-03-13 | 2013-09-26 | Seiko Epson Corp | ジャイロセンサーおよび電子機器 |
| JP2013190304A (ja) * | 2012-03-13 | 2013-09-26 | Seiko Epson Corp | ジャイロセンサーおよび電子機器 |
| JP2013251672A (ja) * | 2012-05-31 | 2013-12-12 | Seiko Epson Corp | 振動片、電子デバイス、電子機器および振動片の製造方法 |
| CN103457570A (zh) * | 2012-05-31 | 2013-12-18 | 精工爱普生株式会社 | 振动片、电子装置、电子设备以及振动片的制造方法 |
| JP2014103572A (ja) * | 2012-11-21 | 2014-06-05 | Daishinku Corp | 音叉型圧電振動片、音叉型圧電振動デバイス、及び、音叉型圧電振動片の製造方法 |
| JP2014107817A (ja) * | 2012-11-29 | 2014-06-09 | Daishinku Corp | 音叉型圧電振動片、及び音叉型圧電振動デバイス |
| US9819328B2 (en) | 2013-01-29 | 2017-11-14 | Murata Manufacturing Co., Ltd. | Tuning-fork type quartz vibrator |
| JP2015033075A (ja) * | 2013-08-06 | 2015-02-16 | 京セラクリスタルデバイス株式会社 | 水晶振動素子及びその製造方法 |
| JP2019165358A (ja) * | 2018-03-20 | 2019-09-26 | エスアイアイ・クリスタルテクノロジー株式会社 | 双音叉型圧電振動片 |
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| Publication number | Publication date |
|---|---|
| US20110278992A1 (en) | 2011-11-17 |
| US8018127B2 (en) | 2011-09-13 |
| US20100207495A1 (en) | 2010-08-19 |
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