JP2010153882A5 - - Google Patents
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- Publication number
- JP2010153882A5 JP2010153882A5 JP2010015596A JP2010015596A JP2010153882A5 JP 2010153882 A5 JP2010153882 A5 JP 2010153882A5 JP 2010015596 A JP2010015596 A JP 2010015596A JP 2010015596 A JP2010015596 A JP 2010015596A JP 2010153882 A5 JP2010153882 A5 JP 2010153882A5
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- substrate
- material according
- group
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010015596A JP4844677B2 (ja) | 2010-01-27 | 2010-01-27 | 回路接続材料、回路部材の接続構造及び回路部材の接続方法。 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010015596A JP4844677B2 (ja) | 2010-01-27 | 2010-01-27 | 回路接続材料、回路部材の接続構造及び回路部材の接続方法。 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005137627A Division JP4844003B2 (ja) | 2005-05-10 | 2005-05-10 | 回路接続材料、回路部材の接続構造及び回路部材の接続方法。 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010153882A JP2010153882A (ja) | 2010-07-08 |
| JP2010153882A5 true JP2010153882A5 (enExample) | 2010-10-28 |
| JP4844677B2 JP4844677B2 (ja) | 2011-12-28 |
Family
ID=42572530
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010015596A Expired - Fee Related JP4844677B2 (ja) | 2010-01-27 | 2010-01-27 | 回路接続材料、回路部材の接続構造及び回路部材の接続方法。 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4844677B2 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20120068751A (ko) * | 2010-07-26 | 2012-06-27 | 히다치 가세고교 가부시끼가이샤 | 접착제 조성물, 접속 구조체, 접속 구조체의 제조 방법 및 접착제 조성물의 용도 |
| CN105176471A (zh) * | 2010-07-26 | 2015-12-23 | 日立化成工业株式会社 | 粘接剂组合物、连接结构体、连接结构体的制造方法、以及粘接剂组合物的应用 |
| TWI580745B (zh) * | 2011-12-16 | 2017-05-01 | 日立化成股份有限公司 | 接著劑組成物、膜狀接著劑、接著片、連接結構體及連接結構體的製造方法 |
| TWI579360B (zh) * | 2011-12-16 | 2017-04-21 | 日立化成股份有限公司 | 接著劑組成物、膜狀接著劑、接著片、連接結構體及連接結構體的製造方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000239642A (ja) * | 1999-02-23 | 2000-09-05 | Toyobo Co Ltd | 反応性ホットメルト接着剤組成物 |
| US6762249B1 (en) * | 1999-08-25 | 2004-07-13 | Hitachi Chemical Company, Ltd. | Wiring-connecting material and process for producing circuit board with the same |
| JP4235895B2 (ja) * | 2002-04-18 | 2009-03-11 | 東洋紡績株式会社 | 昇華型感熱転写記録材用ポリエステルフィルムおよびその製造方法 |
| JP4470091B2 (ja) * | 2003-08-11 | 2010-06-02 | 東洋紡績株式会社 | ポリウレタン樹脂組成物、積層体およびフレキシブルプリント配線板 |
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2010
- 2010-01-27 JP JP2010015596A patent/JP4844677B2/ja not_active Expired - Fee Related