JP2010157746A5 - - Google Patents
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- Publication number
- JP2010157746A5 JP2010157746A5 JP2010015598A JP2010015598A JP2010157746A5 JP 2010157746 A5 JP2010157746 A5 JP 2010157746A5 JP 2010015598 A JP2010015598 A JP 2010015598A JP 2010015598 A JP2010015598 A JP 2010015598A JP 2010157746 A5 JP2010157746 A5 JP 2010157746A5
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- substrate
- group
- electrode
- material according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000000463 material Substances 0.000 claims 10
- 239000000758 substrate Substances 0.000 claims 8
- 150000002894 organic compounds Chemical class 0.000 claims 4
- -1 phosphate ester compound Chemical class 0.000 claims 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 2
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 2
- 230000009477 glass transition Effects 0.000 claims 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- 239000000203 mixture Substances 0.000 claims 2
- 229910052709 silver Inorganic materials 0.000 claims 2
- 239000004332 silver Substances 0.000 claims 2
- 229910052718 tin Inorganic materials 0.000 claims 2
- 239000011135 tin Substances 0.000 claims 2
- 229910019142 PO4 Inorganic materials 0.000 claims 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate group Chemical group C(C=C)(=O)[O-] NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims 1
- 125000001931 aliphatic group Chemical group 0.000 claims 1
- 125000003118 aryl group Chemical group 0.000 claims 1
- 125000004122 cyclic group Chemical group 0.000 claims 1
- 125000004185 ester group Chemical group 0.000 claims 1
- 239000003999 initiator Substances 0.000 claims 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M methacrylate group Chemical group C(C(=C)C)(=O)[O-] CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 239000010452 phosphate Substances 0.000 claims 1
- JOYRKODLDBILNP-UHFFFAOYSA-N urethane group Chemical group NC(=O)OCC JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010015598A JP4900490B2 (ja) | 2010-01-27 | 2010-01-27 | 回路接続材料、回路部材の接続構造及び回路部材の接続方法。 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010015598A JP4900490B2 (ja) | 2010-01-27 | 2010-01-27 | 回路接続材料、回路部材の接続構造及び回路部材の接続方法。 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005137627A Division JP4844003B2 (ja) | 2005-05-10 | 2005-05-10 | 回路接続材料、回路部材の接続構造及び回路部材の接続方法。 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010157746A JP2010157746A (ja) | 2010-07-15 |
| JP2010157746A5 true JP2010157746A5 (enExample) | 2010-10-28 |
| JP4900490B2 JP4900490B2 (ja) | 2012-03-21 |
Family
ID=42575360
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010015598A Expired - Fee Related JP4900490B2 (ja) | 2010-01-27 | 2010-01-27 | 回路接続材料、回路部材の接続構造及び回路部材の接続方法。 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4900490B2 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5668636B2 (ja) * | 2010-08-24 | 2015-02-12 | 日立化成株式会社 | 回路接続構造体の製造方法 |
| WO2018181589A1 (ja) * | 2017-03-29 | 2018-10-04 | 日立化成株式会社 | 接着剤組成物及び構造体 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0776185A (ja) * | 1993-06-17 | 1995-03-20 | Sony Corp | ラミネートフィルム |
| JPH11110747A (ja) * | 1997-10-07 | 1999-04-23 | Toyobo Co Ltd | 磁気記録カード用基材 |
| US6762249B1 (en) * | 1999-08-25 | 2004-07-13 | Hitachi Chemical Company, Ltd. | Wiring-connecting material and process for producing circuit board with the same |
| JP4158080B2 (ja) * | 2002-01-30 | 2008-10-01 | 東洋紡績株式会社 | 導電性ペースト |
| JP4470091B2 (ja) * | 2003-08-11 | 2010-06-02 | 東洋紡績株式会社 | ポリウレタン樹脂組成物、積層体およびフレキシブルプリント配線板 |
-
2010
- 2010-01-27 JP JP2010015598A patent/JP4900490B2/ja not_active Expired - Fee Related
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