JP4900490B2 - 回路接続材料、回路部材の接続構造及び回路部材の接続方法。 - Google Patents

回路接続材料、回路部材の接続構造及び回路部材の接続方法。 Download PDF

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Publication number
JP4900490B2
JP4900490B2 JP2010015598A JP2010015598A JP4900490B2 JP 4900490 B2 JP4900490 B2 JP 4900490B2 JP 2010015598 A JP2010015598 A JP 2010015598A JP 2010015598 A JP2010015598 A JP 2010015598A JP 4900490 B2 JP4900490 B2 JP 4900490B2
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Japan
Prior art keywords
circuit
group
substrate
connection
circuit member
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Expired - Fee Related
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JP2010015598A
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English (en)
Japanese (ja)
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JP2010157746A5 (enExample
JP2010157746A (ja
Inventor
征宏 有福
日臣 望月
孝 中澤
宏治 小林
貢 藤縄
貴 立澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
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Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Priority to JP2010015598A priority Critical patent/JP4900490B2/ja
Publication of JP2010157746A publication Critical patent/JP2010157746A/ja
Publication of JP2010157746A5 publication Critical patent/JP2010157746A5/ja
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  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
JP2010015598A 2010-01-27 2010-01-27 回路接続材料、回路部材の接続構造及び回路部材の接続方法。 Expired - Fee Related JP4900490B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010015598A JP4900490B2 (ja) 2010-01-27 2010-01-27 回路接続材料、回路部材の接続構造及び回路部材の接続方法。

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010015598A JP4900490B2 (ja) 2010-01-27 2010-01-27 回路接続材料、回路部材の接続構造及び回路部材の接続方法。

Related Parent Applications (1)

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JP2005137627A Division JP4844003B2 (ja) 2005-05-10 2005-05-10 回路接続材料、回路部材の接続構造及び回路部材の接続方法。

Publications (3)

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JP2010157746A JP2010157746A (ja) 2010-07-15
JP2010157746A5 JP2010157746A5 (enExample) 2010-10-28
JP4900490B2 true JP4900490B2 (ja) 2012-03-21

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JP2010015598A Expired - Fee Related JP4900490B2 (ja) 2010-01-27 2010-01-27 回路接続材料、回路部材の接続構造及び回路部材の接続方法。

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5668636B2 (ja) * 2010-08-24 2015-02-12 日立化成株式会社 回路接続構造体の製造方法
WO2018181589A1 (ja) * 2017-03-29 2018-10-04 日立化成株式会社 接着剤組成物及び構造体

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0776185A (ja) * 1993-06-17 1995-03-20 Sony Corp ラミネートフィルム
JPH11110747A (ja) * 1997-10-07 1999-04-23 Toyobo Co Ltd 磁気記録カード用基材
US6762249B1 (en) * 1999-08-25 2004-07-13 Hitachi Chemical Company, Ltd. Wiring-connecting material and process for producing circuit board with the same
JP4158080B2 (ja) * 2002-01-30 2008-10-01 東洋紡績株式会社 導電性ペースト
JP4470091B2 (ja) * 2003-08-11 2010-06-02 東洋紡績株式会社 ポリウレタン樹脂組成物、積層体およびフレキシブルプリント配線板

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Publication number Publication date
JP2010157746A (ja) 2010-07-15

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