JP4844677B2 - 回路接続材料、回路部材の接続構造及び回路部材の接続方法。 - Google Patents

回路接続材料、回路部材の接続構造及び回路部材の接続方法。 Download PDF

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Publication number
JP4844677B2
JP4844677B2 JP2010015596A JP2010015596A JP4844677B2 JP 4844677 B2 JP4844677 B2 JP 4844677B2 JP 2010015596 A JP2010015596 A JP 2010015596A JP 2010015596 A JP2010015596 A JP 2010015596A JP 4844677 B2 JP4844677 B2 JP 4844677B2
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Prior art keywords
circuit
group
substrate
circuit member
connection
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Expired - Fee Related
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JP2010015596A
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Japanese (ja)
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JP2010153882A5 (enExample
JP2010153882A (ja
Inventor
征宏 有福
日臣 望月
孝 中澤
宏治 小林
貢 藤縄
貴 立澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
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Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Priority to JP2010015596A priority Critical patent/JP4844677B2/ja
Publication of JP2010153882A publication Critical patent/JP2010153882A/ja
Publication of JP2010153882A5 publication Critical patent/JP2010153882A5/ja
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Publication of JP4844677B2 publication Critical patent/JP4844677B2/ja
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  • Adhesives Or Adhesive Processes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Conductive Materials (AREA)
JP2010015596A 2010-01-27 2010-01-27 回路接続材料、回路部材の接続構造及び回路部材の接続方法。 Expired - Fee Related JP4844677B2 (ja)

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Application Number Priority Date Filing Date Title
JP2010015596A JP4844677B2 (ja) 2010-01-27 2010-01-27 回路接続材料、回路部材の接続構造及び回路部材の接続方法。

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JP2010015596A JP4844677B2 (ja) 2010-01-27 2010-01-27 回路接続材料、回路部材の接続構造及び回路部材の接続方法。

Related Parent Applications (1)

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JP2005137627A Division JP4844003B2 (ja) 2005-05-10 2005-05-10 回路接続材料、回路部材の接続構造及び回路部材の接続方法。

Publications (3)

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JP2010153882A JP2010153882A (ja) 2010-07-08
JP2010153882A5 JP2010153882A5 (enExample) 2010-10-28
JP4844677B2 true JP4844677B2 (ja) 2011-12-28

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JP2010015596A Expired - Fee Related JP4844677B2 (ja) 2010-01-27 2010-01-27 回路接続材料、回路部材の接続構造及び回路部材の接続方法。

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103351838A (zh) * 2010-07-26 2013-10-16 日立化成工业株式会社 粘接剂组合物、连接结构体、连接结构体的制造方法以及粘接剂组合物的应用
CN103589384B (zh) * 2010-07-26 2016-03-02 日立化成株式会社 粘接剂组合物、连接结构体、连接结构体的制造方法、以及粘接剂组合物的应用
TWI579360B (zh) * 2011-12-16 2017-04-21 日立化成股份有限公司 接著劑組成物、膜狀接著劑、接著片、連接結構體及連接結構體的製造方法
JP5527395B2 (ja) * 2011-12-16 2014-06-18 日立化成株式会社 接着剤組成物、接着シート及び接続構造体

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000239642A (ja) * 1999-02-23 2000-09-05 Toyobo Co Ltd 反応性ホットメルト接着剤組成物
US6762249B1 (en) * 1999-08-25 2004-07-13 Hitachi Chemical Company, Ltd. Wiring-connecting material and process for producing circuit board with the same
JP4235895B2 (ja) * 2002-04-18 2009-03-11 東洋紡績株式会社 昇華型感熱転写記録材用ポリエステルフィルムおよびその製造方法
JP4470091B2 (ja) * 2003-08-11 2010-06-02 東洋紡績株式会社 ポリウレタン樹脂組成物、積層体およびフレキシブルプリント配線板

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Publication number Publication date
JP2010153882A (ja) 2010-07-08

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