JP2010149482A - インプリント用モールドおよびパターン形成方法 - Google Patents
インプリント用モールドおよびパターン形成方法 Download PDFInfo
- Publication number
- JP2010149482A JP2010149482A JP2008333077A JP2008333077A JP2010149482A JP 2010149482 A JP2010149482 A JP 2010149482A JP 2008333077 A JP2008333077 A JP 2008333077A JP 2008333077 A JP2008333077 A JP 2008333077A JP 2010149482 A JP2010149482 A JP 2010149482A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- gas
- imprint
- pattern
- agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
- B29C37/0053—Moulding articles characterised by the shape of the surface, e.g. ribs, high polish
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
- B29C37/0003—Discharging moulded articles from the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
- B29C37/006—Degassing moulding material or draining off gas during moulding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/003—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor characterised by the choice of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
- B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
- B29C2043/023—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves
- B29C2043/025—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves forming a microstructure, i.e. fine patterning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
- B29C43/361—Moulds for making articles of definite length, i.e. discrete articles with pressing members independently movable of the parts for opening or closing the mould, e.g. movable pistons
- B29C2043/3615—Forming elements, e.g. mandrels or rams or stampers or pistons or plungers or punching devices
- B29C2043/3634—Forming elements, e.g. mandrels or rams or stampers or pistons or plungers or punching devices having specific surface shape, e.g. grooves, projections, corrugations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
- B29C2059/023—Microembossing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0888—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using transparant moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/0002—Condition, form or state of moulded material or of the material to be shaped monomers or prepolymers
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mechanical Engineering (AREA)
- Theoretical Computer Science (AREA)
- Mathematical Physics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Micromachines (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008333077A JP2010149482A (ja) | 2008-12-26 | 2008-12-26 | インプリント用モールドおよびパターン形成方法 |
| US12/646,683 US20100164146A1 (en) | 2008-12-26 | 2009-12-23 | Imprinting mold and pattern formation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008333077A JP2010149482A (ja) | 2008-12-26 | 2008-12-26 | インプリント用モールドおよびパターン形成方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011158229A Division JP5481438B2 (ja) | 2011-07-19 | 2011-07-19 | インプリント用モールドおよびパターン形成方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010149482A true JP2010149482A (ja) | 2010-07-08 |
| JP2010149482A5 JP2010149482A5 (enExample) | 2011-06-02 |
Family
ID=42283913
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008333077A Pending JP2010149482A (ja) | 2008-12-26 | 2008-12-26 | インプリント用モールドおよびパターン形成方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20100164146A1 (enExample) |
| JP (1) | JP2010149482A (enExample) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011096368A1 (ja) * | 2010-02-03 | 2011-08-11 | 旭硝子株式会社 | 微細凹凸構造を表面に有する物品の製造方法 |
| JP2011201083A (ja) * | 2010-03-24 | 2011-10-13 | Canon Inc | インプリント装置、型、および、物品の製造方法 |
| JP2012044090A (ja) * | 2010-08-23 | 2012-03-01 | Toshiba Corp | 検査方法、テンプレート製造方法、半導体集積回路製造方法および検査システム |
| JP2012204380A (ja) * | 2011-03-23 | 2012-10-22 | Toshiba Corp | インプリント方法およびインプリント装置 |
| JP2015005760A (ja) * | 2014-07-31 | 2015-01-08 | キヤノン株式会社 | インプリント装置、および物品の製造方法 |
| JP2015026847A (ja) * | 2014-09-10 | 2015-02-05 | キヤノン株式会社 | インプリント装置、および、物品の製造方法 |
| JP2015144315A (ja) * | 2015-04-20 | 2015-08-06 | キヤノン株式会社 | インプリント装置、および物品の製造方法 |
| US10583608B2 (en) | 2015-02-09 | 2020-03-10 | Canon Kabushiki Kaisha | Lithography apparatus, control method therefor, and method of manufacturing article |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5787691B2 (ja) * | 2011-09-21 | 2015-09-30 | キヤノン株式会社 | インプリント装置、それを用いた物品の製造方法 |
| TWM429700U (en) * | 2012-01-19 | 2012-05-21 | Benq Materials Corp | Engraving device |
| US9873218B2 (en) * | 2014-10-16 | 2018-01-23 | Shindengen Electric Manufacturing Co., Ltd. | Method of manufacturing resin sealing module, and resin sealing module |
| JP7403961B2 (ja) | 2019-03-19 | 2023-12-25 | キオクシア株式会社 | インプリント方法および半導体装置の製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006306674A (ja) * | 2005-04-28 | 2006-11-09 | Shinetsu Quartz Prod Co Ltd | ナノインプリントスタンパー用シリカ・チタニアガラス |
| JP2007283513A (ja) * | 2006-04-12 | 2007-11-01 | National Institute Of Advanced Industrial & Technology | 微細金型コア部材 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6780001B2 (en) * | 1999-07-30 | 2004-08-24 | Formfactor, Inc. | Forming tool for forming a contoured microelectronic spring mold |
| KR101610180B1 (ko) * | 2007-11-21 | 2016-04-07 | 캐논 나노테크놀로지즈 인코퍼레이티드 | 나노-임프린트 리소그래피용 다공성 주형 및 임프린팅 스택 |
-
2008
- 2008-12-26 JP JP2008333077A patent/JP2010149482A/ja active Pending
-
2009
- 2009-12-23 US US12/646,683 patent/US20100164146A1/en not_active Abandoned
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006306674A (ja) * | 2005-04-28 | 2006-11-09 | Shinetsu Quartz Prod Co Ltd | ナノインプリントスタンパー用シリカ・チタニアガラス |
| JP2007283513A (ja) * | 2006-04-12 | 2007-11-01 | National Institute Of Advanced Industrial & Technology | 微細金型コア部材 |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011096368A1 (ja) * | 2010-02-03 | 2011-08-11 | 旭硝子株式会社 | 微細凹凸構造を表面に有する物品の製造方法 |
| JP5806121B2 (ja) * | 2010-02-03 | 2015-11-10 | 旭硝子株式会社 | 微細凹凸構造を表面に有する物品の製造方法 |
| JP2011201083A (ja) * | 2010-03-24 | 2011-10-13 | Canon Inc | インプリント装置、型、および、物品の製造方法 |
| US9122149B2 (en) | 2010-03-24 | 2015-09-01 | Canon Kabushiki Kaisha | Imprint apparatus and method of manufacturing article |
| US9280048B2 (en) | 2010-03-24 | 2016-03-08 | Canon Kabushiki Kaisha | Imprint apparatus and method of manufacturing article |
| JP2012044090A (ja) * | 2010-08-23 | 2012-03-01 | Toshiba Corp | 検査方法、テンプレート製造方法、半導体集積回路製造方法および検査システム |
| JP2012204380A (ja) * | 2011-03-23 | 2012-10-22 | Toshiba Corp | インプリント方法およびインプリント装置 |
| US8906281B2 (en) | 2011-03-23 | 2014-12-09 | Kabushiki Kaisha Toshiba | Imprint method, imprinting equipment, and method for manufacturing semiconductor device |
| JP2015005760A (ja) * | 2014-07-31 | 2015-01-08 | キヤノン株式会社 | インプリント装置、および物品の製造方法 |
| JP2015026847A (ja) * | 2014-09-10 | 2015-02-05 | キヤノン株式会社 | インプリント装置、および、物品の製造方法 |
| US10583608B2 (en) | 2015-02-09 | 2020-03-10 | Canon Kabushiki Kaisha | Lithography apparatus, control method therefor, and method of manufacturing article |
| JP2015144315A (ja) * | 2015-04-20 | 2015-08-06 | キヤノン株式会社 | インプリント装置、および物品の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20100164146A1 (en) | 2010-07-01 |
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