JP2010147153A - 半導体装置及びその製造方法 - Google Patents

半導体装置及びその製造方法 Download PDF

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Publication number
JP2010147153A
JP2010147153A JP2008321038A JP2008321038A JP2010147153A JP 2010147153 A JP2010147153 A JP 2010147153A JP 2008321038 A JP2008321038 A JP 2008321038A JP 2008321038 A JP2008321038 A JP 2008321038A JP 2010147153 A JP2010147153 A JP 2010147153A
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Japan
Prior art keywords
semiconductor chip
resin
wiring board
wiring
adhesion layer
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Pending
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JP2008321038A
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English (en)
Japanese (ja)
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JP2010147153A5 (enExample
Inventor
Atsunori Kajiki
篤典 加治木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2008321038A priority Critical patent/JP2010147153A/ja
Priority to US12/639,421 priority patent/US8106495B2/en
Publication of JP2010147153A publication Critical patent/JP2010147153A/ja
Publication of JP2010147153A5 publication Critical patent/JP2010147153A5/ja
Pending legal-status Critical Current

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    • H10W74/016—
    • H10W74/117—
    • H10W76/40—
    • H10W90/00—
    • H10W70/60—
    • H10W72/072—
    • H10W72/073—
    • H10W72/30—
    • H10W72/877—
    • H10W74/00—
    • H10W74/012—
    • H10W74/15—
    • H10W90/722—
    • H10W90/724—
    • H10W90/734—

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2008321038A 2008-12-17 2008-12-17 半導体装置及びその製造方法 Pending JP2010147153A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008321038A JP2010147153A (ja) 2008-12-17 2008-12-17 半導体装置及びその製造方法
US12/639,421 US8106495B2 (en) 2008-12-17 2009-12-16 Semiconductor apparatus and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008321038A JP2010147153A (ja) 2008-12-17 2008-12-17 半導体装置及びその製造方法

Publications (2)

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JP2010147153A true JP2010147153A (ja) 2010-07-01
JP2010147153A5 JP2010147153A5 (enExample) 2011-10-06

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JP2008321038A Pending JP2010147153A (ja) 2008-12-17 2008-12-17 半導体装置及びその製造方法

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US (1) US8106495B2 (enExample)
JP (1) JP2010147153A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
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KR20140098694A (ko) * 2013-01-31 2014-08-08 신꼬오덴기 고교 가부시키가이샤 전자 부품 내장 기판 및 그 제조 방법
JP2015153844A (ja) * 2014-02-13 2015-08-24 日亜化学工業株式会社 発光装置
JP2017050310A (ja) * 2015-08-31 2017-03-09 新光電気工業株式会社 電子部品装置及びその製造方法
US10485098B2 (en) 2015-06-19 2019-11-19 Shinko Electric Industries Co., Ltd. Electronic component device

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US8436255B2 (en) * 2009-12-31 2013-05-07 Stmicroelectronics Pte Ltd. Fan-out wafer level package with polymeric layer for high reliability
US8466997B2 (en) * 2009-12-31 2013-06-18 Stmicroelectronics Pte Ltd. Fan-out wafer level package for an optical sensor and method of manufacture thereof
US8884422B2 (en) * 2009-12-31 2014-11-11 Stmicroelectronics Pte Ltd. Flip-chip fan-out wafer level package for package-on-package applications, and method of manufacture
US20110156240A1 (en) * 2009-12-31 2011-06-30 Stmicroelectronics Asia Pacific Pte. Ltd. Reliable large die fan-out wafer level package and method of manufacture
US8502394B2 (en) * 2009-12-31 2013-08-06 Stmicroelectronics Pte Ltd. Multi-stacked semiconductor dice scale package structure and method of manufacturing same
US8742603B2 (en) * 2010-05-20 2014-06-03 Qualcomm Incorporated Process for improving package warpage and connection reliability through use of a backside mold configuration (BSMC)
US8378477B2 (en) * 2010-09-14 2013-02-19 Stats Chippac Ltd. Integrated circuit packaging system with film encapsulation and method of manufacture thereof
KR101817159B1 (ko) * 2011-02-17 2018-02-22 삼성전자 주식회사 Ｔｓｖ를 가지는 인터포저를 포함하는 반도체 패키지 및 그 제조 방법
KR101740483B1 (ko) * 2011-05-02 2017-06-08 삼성전자 주식회사 고정 부재 및 할로겐-프리 패키지간 연결부를 포함하는 적층 패키지
US8461676B2 (en) 2011-09-09 2013-06-11 Qualcomm Incorporated Soldering relief method and semiconductor device employing same
US9013037B2 (en) 2011-09-14 2015-04-21 Stmicroelectronics Pte Ltd. Semiconductor package with improved pillar bump process and structure
US8916481B2 (en) 2011-11-02 2014-12-23 Stmicroelectronics Pte Ltd. Embedded wafer level package for 3D and package-on-package applications, and method of manufacture
US8779601B2 (en) 2011-11-02 2014-07-15 Stmicroelectronics Pte Ltd Embedded wafer level package for 3D and package-on-package applications, and method of manufacture
TWI418009B (zh) * 2011-12-08 2013-12-01 欣興電子股份有限公司 層疊封裝的封裝結構及其製法
US9659893B2 (en) * 2011-12-21 2017-05-23 Mediatek Inc. Semiconductor package
US8633588B2 (en) * 2011-12-21 2014-01-21 Mediatek Inc. Semiconductor package
US8680663B2 (en) * 2012-01-03 2014-03-25 Taiwan Semiconductor Manufacturing Company, Ltd. Methods and apparatus for package on package devices with reduced strain
US9704725B1 (en) 2012-03-06 2017-07-11 Amkor Technology, Inc. Semiconductor device with leadframe configured to facilitate reduced burr formation
US9385006B2 (en) * 2012-06-21 2016-07-05 STATS ChipPAC Pte. Ltd. Semiconductor device and method of forming an embedded SOP fan-out package
US8969730B2 (en) * 2012-08-16 2015-03-03 Apple Inc. Printed circuit solder connections
US20140210106A1 (en) * 2013-01-29 2014-07-31 Apple Inc. ULTRA THIN PoP PACKAGE
US20140225248A1 (en) * 2013-02-13 2014-08-14 Qualcomm Incorporated Power distribution and thermal solution for direct stacked integrated circuits
KR101486790B1 (ko) 2013-05-02 2015-01-28 앰코 테크놀로지 코리아 주식회사 강성보강부를 갖는 마이크로 리드프레임
TWI533421B (zh) 2013-06-14 2016-05-11 日月光半導體製造股份有限公司 半導體封裝結構及半導體製程
KR20150014701A (ko) * 2013-07-30 2015-02-09 삼성전자주식회사 반도체 패키지 및 이의 제조 방법
TWI520285B (zh) * 2013-08-12 2016-02-01 矽品精密工業股份有限公司 半導體封裝件及其製法
US9299650B1 (en) 2013-09-25 2016-03-29 Stats Chippac Ltd. Integrated circuit packaging system with single metal layer interposer and method of manufacture thereof
NL2011512C2 (en) * 2013-09-26 2015-03-30 Besi Netherlands B V Method for moulding and surface processing electronic components and electronic component produced with this method.
US9905491B1 (en) 2013-09-27 2018-02-27 STATS ChipPAC Pte. Ltd. Interposer substrate designs for semiconductor packages
KR101563911B1 (ko) 2013-10-24 2015-10-28 앰코 테크놀로지 코리아 주식회사 반도체 패키지
US20150221570A1 (en) * 2014-02-04 2015-08-06 Amkor Technology, Inc. Thin sandwich embedded package
US9693455B1 (en) 2014-03-27 2017-06-27 STATS ChipPAC Pte. Ltd. Integrated circuit packaging system with plated copper posts and method of manufacture thereof
US9673122B2 (en) 2014-05-02 2017-06-06 Amkor Technology, Inc. Micro lead frame structure having reinforcing portions and method
KR102154830B1 (ko) * 2014-08-05 2020-09-11 삼성전자주식회사 반도체 패키지 및 그 제조 방법
KR20160022603A (ko) * 2014-08-20 2016-03-02 삼성전기주식회사 플립칩 패키지 및 그 제조 방법
US9859200B2 (en) * 2014-12-29 2018-01-02 STATS ChipPAC Pte. Ltd. Integrated circuit packaging system with interposer support structure mechanism and method of manufacture thereof
US20170110392A1 (en) * 2015-10-15 2017-04-20 Advanced Semiconductor Engineering, Inc. Semiconductor package structure and method for manufacturing the same structure
KR102450576B1 (ko) * 2016-01-22 2022-10-07 삼성전자주식회사 전자 부품 패키지 및 그 제조방법
KR20180095371A (ko) * 2017-02-17 2018-08-27 엘지전자 주식회사 이동 단말기 및 인쇄 회로 기판
JP6917295B2 (ja) * 2017-12-25 2021-08-11 新光電気工業株式会社 電子部品内蔵基板、シート基板
US11101214B2 (en) * 2019-01-02 2021-08-24 Taiwan Semiconductor Manufacturing Co., Ltd. Package structure with dam structure and method for forming the same
US11094625B2 (en) * 2019-01-02 2021-08-17 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor package with improved interposer structure
US11721657B2 (en) 2019-06-14 2023-08-08 Stmicroelectronics Pte Ltd Wafer level chip scale package having varying thicknesses
KR102908318B1 (ko) * 2020-12-28 2026-01-05 삼성전기주식회사 패키지 내장기판
KR102760431B1 (ko) * 2021-02-25 2025-02-03 창신 메모리 테크놀로지즈 아이엔씨 반도체 구조 및 반도체 구조의 제조 방법
CN114975325B (zh) * 2021-02-25 2025-01-10 长鑫存储技术有限公司 半导体结构及半导体结构的制备方法
KR20220169284A (ko) 2021-06-18 2022-12-27 삼성전자주식회사 반도체 패키지 및 이의 제조 방법
US12107037B2 (en) * 2021-11-03 2024-10-01 Amkor Technology Singapore Holding Pte. Ltd. Semiconductor devices and methods of manufacturing electronic devices

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JPH0577423A (ja) * 1991-09-24 1993-03-30 Canon Inc インクジエツト記録ヘツド
JPH0621271A (ja) * 1992-07-02 1994-01-28 Sharp Corp 半導体パッケージ構造
JP2001015682A (ja) * 1999-06-28 2001-01-19 Hitachi Ltd 樹脂封止型電子装置
JP2002158316A (ja) * 2000-11-16 2002-05-31 Towa Corp 半導体装置及びその製造方法
JP2004296690A (ja) * 2003-03-26 2004-10-21 Shinko Electric Ind Co Ltd 半導体素子を内蔵した多層回路基板の製造方法
JP2007048860A (ja) * 2005-08-09 2007-02-22 Toshiba Corp 半導体装置とその製造方法
JP2008294330A (ja) * 2007-05-28 2008-12-04 Shinko Electric Ind Co Ltd チップ内蔵基板

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JPH0577423A (ja) * 1991-09-24 1993-03-30 Canon Inc インクジエツト記録ヘツド
JPH0621271A (ja) * 1992-07-02 1994-01-28 Sharp Corp 半導体パッケージ構造
JP2001015682A (ja) * 1999-06-28 2001-01-19 Hitachi Ltd 樹脂封止型電子装置
JP2002158316A (ja) * 2000-11-16 2002-05-31 Towa Corp 半導体装置及びその製造方法
JP2004296690A (ja) * 2003-03-26 2004-10-21 Shinko Electric Ind Co Ltd 半導体素子を内蔵した多層回路基板の製造方法
JP2007048860A (ja) * 2005-08-09 2007-02-22 Toshiba Corp 半導体装置とその製造方法
JP2008294330A (ja) * 2007-05-28 2008-12-04 Shinko Electric Ind Co Ltd チップ内蔵基板

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140098694A (ko) * 2013-01-31 2014-08-08 신꼬오덴기 고교 가부시키가이샤 전자 부품 내장 기판 및 그 제조 방법
JP2014150154A (ja) * 2013-01-31 2014-08-21 Shinko Electric Ind Co Ltd 電子部品内蔵基板及びその製造方法
KR102032844B1 (ko) * 2013-01-31 2019-10-16 신꼬오덴기 고교 가부시키가이샤 전자 부품 내장 기판 및 그 제조 방법
JP2015153844A (ja) * 2014-02-13 2015-08-24 日亜化学工業株式会社 発光装置
US10485098B2 (en) 2015-06-19 2019-11-19 Shinko Electric Industries Co., Ltd. Electronic component device
JP2017050310A (ja) * 2015-08-31 2017-03-09 新光電気工業株式会社 電子部品装置及びその製造方法

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