JP2010147153A - 半導体装置及びその製造方法 - Google Patents

半導体装置及びその製造方法 Download PDF

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Publication number
JP2010147153A
JP2010147153A JP2008321038A JP2008321038A JP2010147153A JP 2010147153 A JP2010147153 A JP 2010147153A JP 2008321038 A JP2008321038 A JP 2008321038A JP 2008321038 A JP2008321038 A JP 2008321038A JP 2010147153 A JP2010147153 A JP 2010147153A
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Prior art keywords
semiconductor chip
resin
wiring board
wiring
adhesion layer
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JP2008321038A
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Japanese (ja)
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JP2010147153A5 (enExample
Inventor
Atsunori Kajiki
篤典 加治木
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Priority to JP2008321038A priority Critical patent/JP2010147153A/ja
Priority to US12/639,421 priority patent/US8106495B2/en
Publication of JP2010147153A publication Critical patent/JP2010147153A/ja
Publication of JP2010147153A5 publication Critical patent/JP2010147153A5/ja
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