JP2010141865A - イメージセンサカメラモジュール及びその製造方法 - Google Patents
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- H01L27/144—Devices controlled by radiation
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- H—ELECTRICITY
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- H01L2224/02—Bonding areas; Manufacturing methods related thereto
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Abstract
【解決手段】レンズと、前記レンズが配置されるレンズハウジングと、前記レンズハウジングの内側面の一部と貼り合わせられるイメージセンサパッケージと、前記レンズと前記イメージセンサパッケージとの間の間隔を維持する突出部と、を備え、前記イメージセンサパッケージは、前記突出部の先端において前記レンズハウジングと貼り合わせられることを特徴とするイメージセンサカメラモジュール。
【選択図】図1
Description
110……ガラス基板
120……イメージセンサチップ
200……プリント回路基板
300……レンズハウジング
310……水平部
320……延長部
330……レンズ載置部
340、340a……突出部
350a、350b……接着剤
360……レンズ
400……ソケット
500……シールド缶
Claims (16)
- レンズと、
前記レンズが配置されるレンズハウジングと、
前記レンズハウジングの内側面の一部と貼り合わせるイメージセンサパッケージと、
前記レンズと前記イメージセンサパッケージとの間の間隔を維持する突出部と、
を備え、
前記イメージセンサパッケージは、前記突出部の先端において前記レンズハウジングと貼り合わせられることを特徴とするイメージセンサカメラモジュール。 - 前記レンズハウジングは、
前記イメージセンサパッケージと並ぶように位置する水平部と、
前記水平部の内周縁から上向きに延びて前記レンズを載置するレンズ載置部と、
を備えることを特徴とする請求項1に記載のイメージセンサカメラモジュール。 - 前記レンズハウジングは、前記水平部の外周縁から下向きに延びる延長部をさらに備えることを特徴とする請求項2に記載のイメージセンサカメラモジュール。
- 前記突出部は、前記水平部の内側から下向きに延びることを特徴とする請求項2に記載のイメージセンサカメラモジュール。
- 前記突出部は、前記レンズから下向きに延びることを特徴とする請求項1に記載のイメージセンサカメラモジュール。
- 前記イメージセンサパッケージが実装されるプリント回路基板をさらに備えることを特徴とする請求項3に記載のイメージセンサカメラモジュール。
- 前記延長部の下面と前記プリント回路基板の上面を貼り合わせることを特徴とする請求項6に記載のイメージセンサカメラモジュール。
- 前記プリント回路基板上の作業領域に設けられた受動素子をさらに備えることを特徴とする請求項4に記載のイメージセンサカメラモジュール。
- 前記イメージセンサパッケージは、
イメージセンサチップと、
前記イメージセンサチップと電気的に接続され、前記イメージセンサチップの上面に設けられたガラス基板と、
を備えることを特徴とする請求項1に記載のイメージセンサカメラモジュール。 - 前記ガラス基板の上にコーティングされたIRカットオフフィルタまたはガラス基板の上に貼り付けられたIRフィルムをさらに備えることを特徴とする請求項9に記載のイメージセンサカメラモジュール。
- イメージセンサパッケージをプリント回路基板に実装し、
前記イメージセンサパッケージとレンズハウジングとを接着剤を用いて貼り合わせ、
前記接着剤を硬化し、
前記レンズハウジングは、前記接着剤が突出部の先端に位置するように取り付けることを特徴とするイメージセンサカメラモジュールの製造方法。 - 前記イメージセンサパッケージの上に前記レンズハウジングを貼り合わせる際には、前記イメージセンサパッケージの上に前記接着剤を塗布した後、前記レンズハウジングを取り付ける工程を含むことを特徴とする請求項11に記載のイメージセンサカメラモジュールの製造方法。
- 前記イメージセンサパッケージの上に前記レンズハウジングを貼り合わせる際には、前記レンズハウジングを前記イメージセンサパッケージの上に取り付けた後、前記レンズハウジングと前記イメージセンサパッケージとの間に前記接着剤を注入する工程を含むことを特徴とする請求項11に記載のイメージセンサカメラモジュールの製造方法。
- 前記レンズハウジングは、前記イメージセンサパッケージの外側を取り囲む延長部を有することを特徴とする請求項11に記載のイメージセンサカメラモジュールの製造方法。
- 前記延長部の下面に接着剤を塗布した後、前記レンズハウジングを取り付けることを特徴とする請求項14に記載のイメージセンサカメラモジュールの製造方法。
- 前記レンズハウジングをイメージセンサパッケージに取り付けた後、前記延長部と前記プリント回路基板との間に接着剤を注入する工程をさらに含むことを特徴とする請求項14に記載のイメージセンサカメラモジュールの製造方法。
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KR1020080124977A KR100915134B1 (ko) | 2008-12-10 | 2008-12-10 | 이미지 센서 카메라 모듈 및 그 제조 방법 |
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JP2010141865A true JP2010141865A (ja) | 2010-06-24 |
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US (1) | US8063982B2 (ja) |
JP (1) | JP2010141865A (ja) |
KR (1) | KR100915134B1 (ja) |
CN (1) | CN101752323A (ja) |
TW (1) | TW201023640A (ja) |
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Also Published As
Publication number | Publication date |
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KR100915134B1 (ko) | 2009-09-03 |
TW201023640A (en) | 2010-06-16 |
US20100141825A1 (en) | 2010-06-10 |
CN101752323A (zh) | 2010-06-23 |
US8063982B2 (en) | 2011-11-22 |
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