JP2010138433A5 - - Google Patents

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Publication number
JP2010138433A5
JP2010138433A5 JP2008314219A JP2008314219A JP2010138433A5 JP 2010138433 A5 JP2010138433 A5 JP 2010138433A5 JP 2008314219 A JP2008314219 A JP 2008314219A JP 2008314219 A JP2008314219 A JP 2008314219A JP 2010138433 A5 JP2010138433 A5 JP 2010138433A5
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JP
Japan
Prior art keywords
cathode
dielectrics
semiconductor device
device manufacturing
projection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008314219A
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English (en)
Japanese (ja)
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JP2010138433A (ja
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Publication date
Application filed filed Critical
Priority to JP2008314219A priority Critical patent/JP2010138433A/ja
Priority claimed from JP2008314219A external-priority patent/JP2010138433A/ja
Publication of JP2010138433A publication Critical patent/JP2010138433A/ja
Publication of JP2010138433A5 publication Critical patent/JP2010138433A5/ja
Pending legal-status Critical Current

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JP2008314219A 2008-12-10 2008-12-10 半導体装置製造装置及び半導体装置製造方法 Pending JP2010138433A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008314219A JP2010138433A (ja) 2008-12-10 2008-12-10 半導体装置製造装置及び半導体装置製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008314219A JP2010138433A (ja) 2008-12-10 2008-12-10 半導体装置製造装置及び半導体装置製造方法

Publications (2)

Publication Number Publication Date
JP2010138433A JP2010138433A (ja) 2010-06-24
JP2010138433A5 true JP2010138433A5 (https=) 2012-01-19

Family

ID=42348807

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008314219A Pending JP2010138433A (ja) 2008-12-10 2008-12-10 半導体装置製造装置及び半導体装置製造方法

Country Status (1)

Country Link
JP (1) JP2010138433A (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101472637B1 (ko) * 2012-12-27 2014-12-15 삼성전기주식회사 전해도금 차폐판 및 이를 갖는 전해도금 장치
US11542624B2 (en) * 2020-10-01 2023-01-03 Ebara Corporation Plating apparatus
JP7555308B2 (ja) * 2020-10-01 2024-09-24 株式会社荏原製作所 めっき装置
CN114829681B (zh) * 2020-11-16 2023-09-05 株式会社荏原制作所 板、镀敷装置和板的制造方法
JP7630758B1 (ja) * 2024-06-27 2025-02-17 株式会社荏原製作所 めっき装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5633500A (en) * 1979-08-28 1981-04-03 Fujitsu Ltd Averaging apparatus of distribution of plating electric current
JPS63176500A (ja) * 1987-01-16 1988-07-20 Shinko Electric Ind Co Ltd 電気めつき用遮蔽板
JPH02145791A (ja) * 1988-11-28 1990-06-05 Eagle Ind Co Ltd めっき装置とめっき方法およびめっき用遮蔽板
JPH10140392A (ja) * 1996-11-08 1998-05-26 Hitachi Cable Ltd 電気めっき装置
JP4027491B2 (ja) * 1998-03-03 2007-12-26 株式会社荏原製作所 ウエハのメッキ方法及び装置
JP4024991B2 (ja) * 2000-04-21 2007-12-19 株式会社荏原製作所 電解処理装置及びその電場状態制御方法
JP2004225129A (ja) * 2003-01-24 2004-08-12 Ebara Corp めっき方法及びめっき装置

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