JP2010138433A5 - - Google Patents
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- Publication number
- JP2010138433A5 JP2010138433A5 JP2008314219A JP2008314219A JP2010138433A5 JP 2010138433 A5 JP2010138433 A5 JP 2010138433A5 JP 2008314219 A JP2008314219 A JP 2008314219A JP 2008314219 A JP2008314219 A JP 2008314219A JP 2010138433 A5 JP2010138433 A5 JP 2010138433A5
- Authority
- JP
- Japan
- Prior art keywords
- cathode
- dielectrics
- semiconductor device
- device manufacturing
- projection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003989 dielectric material Substances 0.000 claims 4
- 238000004519 manufacturing process Methods 0.000 claims 3
- 239000004065 semiconductor Substances 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 2
- 238000012544 monitoring process Methods 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008314219A JP2010138433A (ja) | 2008-12-10 | 2008-12-10 | 半導体装置製造装置及び半導体装置製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008314219A JP2010138433A (ja) | 2008-12-10 | 2008-12-10 | 半導体装置製造装置及び半導体装置製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010138433A JP2010138433A (ja) | 2010-06-24 |
| JP2010138433A5 true JP2010138433A5 (https=) | 2012-01-19 |
Family
ID=42348807
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008314219A Pending JP2010138433A (ja) | 2008-12-10 | 2008-12-10 | 半導体装置製造装置及び半導体装置製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2010138433A (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101472637B1 (ko) * | 2012-12-27 | 2014-12-15 | 삼성전기주식회사 | 전해도금 차폐판 및 이를 갖는 전해도금 장치 |
| US11542624B2 (en) * | 2020-10-01 | 2023-01-03 | Ebara Corporation | Plating apparatus |
| JP7555308B2 (ja) * | 2020-10-01 | 2024-09-24 | 株式会社荏原製作所 | めっき装置 |
| KR102388661B1 (ko) * | 2020-11-16 | 2022-04-20 | 가부시키가이샤 에바라 세이사꾸쇼 | 플레이트, 도금 장치 및 플레이트의 제조 방법 |
| JP7630758B1 (ja) * | 2024-06-27 | 2025-02-17 | 株式会社荏原製作所 | めっき装置 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5633500A (en) * | 1979-08-28 | 1981-04-03 | Fujitsu Ltd | Averaging apparatus of distribution of plating electric current |
| JPS63176500A (ja) * | 1987-01-16 | 1988-07-20 | Shinko Electric Ind Co Ltd | 電気めつき用遮蔽板 |
| JPH02145791A (ja) * | 1988-11-28 | 1990-06-05 | Eagle Ind Co Ltd | めっき装置とめっき方法およびめっき用遮蔽板 |
| JPH10140392A (ja) * | 1996-11-08 | 1998-05-26 | Hitachi Cable Ltd | 電気めっき装置 |
| JP4027491B2 (ja) * | 1998-03-03 | 2007-12-26 | 株式会社荏原製作所 | ウエハのメッキ方法及び装置 |
| JP4024991B2 (ja) * | 2000-04-21 | 2007-12-19 | 株式会社荏原製作所 | 電解処理装置及びその電場状態制御方法 |
| JP2004225129A (ja) * | 2003-01-24 | 2004-08-12 | Ebara Corp | めっき方法及びめっき装置 |
-
2008
- 2008-12-10 JP JP2008314219A patent/JP2010138433A/ja active Pending
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