MY187303A - Ic handler - Google Patents

Ic handler

Info

Publication number
MY187303A
MY187303A MYPI2016702028A MYPI2016702028A MY187303A MY 187303 A MY187303 A MY 187303A MY PI2016702028 A MYPI2016702028 A MY PI2016702028A MY PI2016702028 A MYPI2016702028 A MY PI2016702028A MY 187303 A MY187303 A MY 187303A
Authority
MY
Malaysia
Prior art keywords
contact head
power
movable arm
ports
supply
Prior art date
Application number
MYPI2016702028A
Inventor
Matsumoto Shouhei
Arai Yoshinori
Ueno Satoshi
Harada Keitaro
Yokoo Masayoshi
Original Assignee
Happyjapan Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Happyjapan Inc filed Critical Happyjapan Inc
Publication of MY187303A publication Critical patent/MY187303A/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

An IC handler (4) of the present invention is provided with: a contact head (7), which holds a plurality of IC devices, and which presses the IC devices to a plurality of sockets (3); and a movable arm (6) that moves the contact head (7). The movable arm (6) has power supply ports (VO, HO) that are connected to supply sources (VS, HS) of power for generating operations of the contact head (7), and the contact head (7) has a plurality of operating sections (70) that operate with the power, and a supporting section (71), which supports the operating sections (70), and which is removably attached to the movable arm (6). The supporting section (71) of the contact head (7) has: connecting ports (VC, HC) that are removably connected to the supply ports (VO, HO); and supply paths (71a, 71d) for supplying the power to the operating sections (70) from the connecting ports (VC, HC) connected to the supply ports (VO, HO). (Figure 4)
MYPI2016702028A 2013-12-03 2013-12-03 Ic handler MY187303A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2013/082485 WO2015083240A1 (en) 2013-12-03 2013-12-03 Ic handler

Publications (1)

Publication Number Publication Date
MY187303A true MY187303A (en) 2021-09-20

Family

ID=53273037

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2016702028A MY187303A (en) 2013-12-03 2013-12-03 Ic handler

Country Status (6)

Country Link
US (1) US10473715B2 (en)
JP (1) JP6462586B2 (en)
KR (1) KR102069113B1 (en)
CN (1) CN105992955B (en)
MY (1) MY187303A (en)
WO (1) WO2015083240A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB201212629D0 (en) * 2012-07-16 2012-08-29 Prec Engineering Technologies Ltd A machine tool
TWI761752B (en) * 2020-01-15 2022-04-21 鴻勁精密股份有限公司 The crimping mechanism for electronic component and the application thereof in the crimping device and in the testing classification equipment
JP2022021241A (en) * 2020-07-21 2022-02-02 株式会社アドバンテスト Electronic component handling device and electronic component testing device
TWI748577B (en) * 2020-07-24 2021-12-01 鴻勁精密股份有限公司 Detection unit for connecting apparatus and handler having the same

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3225227B2 (en) 1998-07-15 2001-11-05 株式会社しなのエレクトロニクス IC test handler
US6888343B1 (en) * 1999-01-13 2005-05-03 Intest Ip Corporation Test head manipulator
EP1145018B1 (en) 1999-01-13 2004-08-04 inTEST IP Corp. Test head manipulator
US7409611B2 (en) * 2003-06-27 2008-08-05 Texas Instruments Incorporated Wrapper instruction/data register controls from test access or wrapper ports
WO2007094034A1 (en) 2006-02-13 2007-08-23 Advantest Corporation Contact pusher, contact arm and electronic component testing apparatus
WO2007105435A1 (en) * 2006-03-02 2007-09-20 Advantest Corporation Moving apparatus and electronic component testing apparatus
US20090018963A1 (en) * 2007-07-10 2009-01-15 Motorola, Inc. System and method to re-sell digital content with advertisement
JP5255403B2 (en) 2008-10-30 2013-08-07 日本無線株式会社 How to create a service plan
WO2011007419A1 (en) * 2009-07-14 2011-01-20 株式会社アドバンテスト Electronic part pressing device, electronic part test device, and interface device
JP5375528B2 (en) 2009-10-30 2013-12-25 セイコーエプソン株式会社 Electronic component inspection equipment
JP5942459B2 (en) * 2012-02-14 2016-06-29 セイコーエプソン株式会社 Handler and parts inspection device
JP6478920B2 (en) * 2013-12-03 2019-03-06 株式会社ハッピージャパン IC handler

Also Published As

Publication number Publication date
US20160370424A1 (en) 2016-12-22
JP6462586B2 (en) 2019-01-30
KR20160093033A (en) 2016-08-05
KR102069113B1 (en) 2020-01-22
JPWO2015083240A1 (en) 2017-03-16
CN105992955A (en) 2016-10-05
WO2015083240A1 (en) 2015-06-11
US10473715B2 (en) 2019-11-12
CN105992955B (en) 2019-06-18

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