JP2010109264A - 半導体集積回路装置 - Google Patents
半導体集積回路装置 Download PDFInfo
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Abstract
【解決手段】例えば、複数の半導体チップCHIP0〜CHIPnが積層搭載され、互いのデータ送受信端子P_DIOが貫通ビアTSVを介してバス接続された半導体集積回路装置を設け、CHIP0〜CHIPnの内部コア回路の電源電圧のうち最も低い電源電圧を用いてこのバスを介したデータ送受信を行わせる。これに伴い、この最も低い電源電圧となるCHIPnの電源電圧端子P_VDDnを、貫通ビアTSVを介して他の半導体チップCHIP0,CHIP1のデータ送受信回路用の電源電圧端子P_VDDL0,P_VDDL1に接続する。
【選択図】図2
Description
図1は、本発明の実施の形態1による半導体集積回路装置において、その外形の一例を示す断面図である。図1に示す半導体集積回路装置SIPは、パッケージ基板PKBD上に複数((n+1)個)の半導体チップCHIP0〜CHIPnが順次積層搭載されたシステムインパッケージの構造となっている。CHIP0〜CHIPnは、それぞれ、トランジスタ形成面TR0〜TRnが下向きに配置される。CHIP0のトランジスタ形成面TR0には、端子(バンプ)BP0が形成され、これがPKBD上面の端子に接続される。PKBD上面の端子は、内部に形成された配線層を介して下面に形成された端子(ボール)BLに接続され、このBLが図示しないマザーボード等に接続される。
前述した実施の形態1では、各半導体チップの内部コア回路で用いる電源電圧の中から最も低い電源電圧をデータ通信用の電源電圧として用いたが、本実施の形態2では、この最も低い電源電圧よりも更に低い電圧でデータ通信を行う例を示す。
BF_DO データ送信回路
BL ボール
BP バンプ
BUS バス
CHIP 半導体チップ
CK クロック信号
CSI 受信選択信号
CSO 送信選択信号
DI 受信データ信号
DO 送信データ信号
GND 接地電圧
IV インバータ回路
LGC 内部コア回路
ML 配線層
MN NMISトランジスタ
MP PMISトランジスタ
ND ナンド回路
NR ノア回路
P_DIO データ送受信端子
P_VDD,P_VDDH,P_VDDL 電源電圧端子
PKBD パッケージ基板
REF リファレンス電圧
SA センスアンプ回路
SAEN センスアンプ活性化信号
SIP 半導体集積回路装置
TR トランジスタ形成面
TSV 貫通ビア
VDD,VDDL,VDDH 電源電圧
Claims (10)
- 所定の処理機能を実現し第1電源電圧で動作する第1内部コア回路と、外部との間のインタフェースを担う第1データ送受信回路とを備えた第1半導体チップと、
所定の処理機能を実現し第2電源電圧で動作する第2内部コア回路と、外部との間のインタフェースを担う第2データ送受信回路とを備えた第2半導体チップとを備え、
前記第1半導体チップおよび前記第2半導体チップの一方は、他方に積層搭載され、
前記第1電源電圧は、前記第2電源電圧よりも高く、
前記第1データ送受信回路と前記第2データ送受信回路は、第1貫通ビアで接続され、前記第2電源電圧を用いて前記第1貫通ビアを介したデータ送受信を行うことを特徴とする半導体集積回路装置。 - 請求項1記載の半導体集積回路装置において、
前記第1半導体チップは、第1電源電圧端子を備え、
前記第2半導体チップは、第2電源電圧端子を備え、
前記第1電源電圧端子と前記第2電源電圧端子は、第2貫通ビアで接続され、
前記第2貫通ビアには、前記第2電源電圧が供給されることを特徴とする半導体集積回路装置。 - 請求項2記載の半導体集積回路装置において、
前記第1内部コア回路で使用されるMISトランジスタのゲート絶縁膜の厚さは、前記第1データ送受信回路で使用されるMISトランジスタのゲート絶縁膜の厚さと同じであり、
前記第2内部コア回路で使用されるMISトランジスタのゲート絶縁膜の厚さは、前記第2データ送受信回路で使用されるMISトランジスタのゲート絶縁膜の厚さと同じであることを特徴とする半導体集積回路装置。 - 請求項2記載の半導体集積回路装置において、
前記第1データ送受信回路および前記第2データ送受信回路のそれぞれは、プリチャージ回路を備え、
前記プリチャージ回路は、各クロックサイクル毎に、前記第1貫通ビアを前記第2電源電圧にプリチャージすることを特徴とする半導体集積回路装置。 - 所定の処理機能を実現し第1電源電圧で動作する第1内部コア回路と、外部との間のインタフェースを担う第1データ送受信回路とを備えた第1半導体チップと、
所定の処理機能を実現し第2電源電圧で動作する第2内部コア回路と、外部との間のインタフェースを担う第2データ送受信回路とを備えた第2半導体チップと、
所定の処理機能を実現し第3電源電圧で動作する第3内部コア回路と、外部との間のインタフェースを担う第3データ送受信回路とを備えた第3半導体チップとを備え、
前記第1半導体チップと前記第2半導体チップと前記第3半導体チップは、互いに積層搭載され、
前記第1電源電圧および前記第2電源電圧は、前記第3電源電圧よりも高く、
前記第1データ送受信回路と前記第2データ送受信回路と前記第3データ送受信回路は、第1貫通ビアで接続され、前記第3電源電圧を用いて前記第1貫通ビアを介したデータ送受信を行うことを特徴とする半導体集積回路装置。 - 請求項5記載の半導体集積回路装置において、
前記第1半導体チップは、第1電源電圧端子を備え、
前記第2半導体チップは、第2電源電圧端子を備え、
前記第3半導体チップは、第3電源電圧端子を備え、
前記第1電源電圧端子と前記第2電源電圧端子と前記第3電源電圧端子は、第2貫通ビアで接続され、
前記第2貫通ビアには、前記第3電源電圧が供給されることを特徴とする半導体集積回路装置。 - 請求項6記載の半導体集積回路装置において、
前記第1内部コア回路で使用されるMISトランジスタのゲート絶縁膜の厚さは、前記第1データ送受信回路で使用されるMISトランジスタのゲート絶縁膜の厚さと同じであり、
前記第2内部コア回路で使用されるMISトランジスタのゲート絶縁膜の厚さは、前記第2データ送受信回路で使用されるMISトランジスタのゲート絶縁膜の厚さと同じであり、
前記第3内部コア回路で使用されるMISトランジスタのゲート絶縁膜の厚さは、前記第3データ送受信回路で使用されるMISトランジスタのゲート絶縁膜の厚さと同じであることを特徴とする半導体集積回路装置。 - 所定の処理機能を実現し第1電源電圧で動作する第1内部コア回路と、外部との間のインタフェースを担う第1データ送受信回路とを備えた第1半導体チップと、
所定の処理機能を実現し第2電源電圧で動作する第2内部コア回路と、外部との間のインタフェースを担う第2データ送受信回路とを備えた第2半導体チップと、
所定の処理機能を実現し第3電源電圧で動作する第3内部コア回路と、外部との間のインタフェースを担う第3データ送受信回路とを備えた第3半導体チップとを備え、
前記第1半導体チップと前記第2半導体チップと前記第3半導体チップは、互いに積層搭載され、
前記第1データ送受信回路と前記第2データ送受信回路と前記第3データ送受信回路は、第1貫通ビアで接続され、前記第1電源電圧かつ前記第2電源電圧かつ前記第3電源電圧よりも低い第4電源電圧を用いて、前記第1貫通ビアを介して高電位側となる論理レベルのデータ送受信を行うことを特徴とする半導体集積回路装置。 - 請求項8記載の半導体集積回路装置において、
前記第1半導体チップは、第1電源電圧端子を備え、
前記第2半導体チップは、第2電源電圧端子を備え、
前記第3半導体チップは、第3電源電圧端子を備え、
前記第1電源電圧端子と前記第2電源電圧端子と前記第3電源電圧端子は、第2貫通ビアで接続され、
前記第2貫通ビアには、前記第4電源電圧が供給されることを特徴とする半導体集積回路装置。 - 請求項9記載の半導体集積回路装置において、
前記第1内部コア回路で使用されるMISトランジスタのゲート絶縁膜の厚さは、前記第1データ送受信回路で使用されるMISトランジスタのゲート絶縁膜の厚さと同じであり、
前記第2内部コア回路で使用されるMISトランジスタのゲート絶縁膜の厚さは、前記第2データ送受信回路で使用されるMISトランジスタのゲート絶縁膜の厚さと同じであり、
前記第3内部コア回路で使用されるMISトランジスタのゲート絶縁膜の厚さは、前記第3データ送受信回路で使用されるMISトランジスタのゲート絶縁膜の厚さと同じであることを特徴とする半導体集積回路装置。
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