JP2010104217A - 電力変換装置 - Google Patents
電力変換装置 Download PDFInfo
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- JP2010104217A JP2010104217A JP2009071138A JP2009071138A JP2010104217A JP 2010104217 A JP2010104217 A JP 2010104217A JP 2009071138 A JP2009071138 A JP 2009071138A JP 2009071138 A JP2009071138 A JP 2009071138A JP 2010104217 A JP2010104217 A JP 2010104217A
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- main circuit
- terminal block
- power
- circuit board
- power semiconductor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
- H05K7/1432—Housings specially adapted for power drive units or power converters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
- H05K7/1432—Housings specially adapted for power drive units or power converters
- H05K7/14322—Housings specially adapted for power drive units or power converters wherein the control and power circuits of a power converter are arranged within the same casing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
- H05K1/0256—Electrical insulation details, e.g. around high voltage areas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Inverter Devices (AREA)
Abstract
小型化されているとともに、リード端子の短絡を防止して信頼性の向上させた電力変換装置を提供することにある。
【解決手段】
主回路端子台が備えられているとともに、一端が前記主回路端子台に電気的に接続された銅箔パターンを備える主回路基板と、前記主回路端子台と電気的に接続するためのリード端子が備えられたパワー半導体と、を備え、前記主回路端子台の配線の入出力がなされる側の前記主回路基板の端部と前記銅箔パターンの他端の間に前記リード端子を貫通させるための開口が形成されている。
【選択図】 図2
Description
本発明の目的は、例えば、電力変換装置の小型化を図ることにある。
本実施例においては16U、16V、16Wを主回路端子台17よりも下側に接続するようにしたが、本発明は、これに限定されるものではなく、スルーホール18U、18V、18Wを主回路端子台17よりも上側に設けて、リード端子16U、16V、16Wを接続する構成としてもよい。
また、順変換器又は逆変換器をディスクリート部品のパワー半導体により構成している場合にはこれらのパワー半導体のいずれかを主回路端子台の近傍において主回路基板と接続されるようにすることで同様に銅箔パターンを短くすることが可能である。
Claims (4)
- 主回路端子台が備えられているとともに、一端が前記主回路端子台に電気的に接続された銅箔パターンを備える主回路基板と、
前記主回路端子台と電気的に接続するためのリード端子が備えられたパワー半導体と、を備え、
前記主回路端子台の配線の入出力がなされる側の前記主回路基板の端部と前記銅箔パターンの他端の間に前記リード端子を貫通させるための開口が形成されていることを特徴とする電力変換装置。 - 前記開口は、前記主回路端子台の近傍に形成されていることを特徴とする請求項1に記載の電力変換装置。
- 主回路端子台が備えられているとともに、一端が前記主回路端子台に電気的に接続された銅箔パターンを備える主回路基板と、
前記主回路端子台と電気的に接続するためのリード端子が備えられたパワー半導体と、を備える電力変換装置であって、
前記主回路端子台の配線の入出力がなされる側の前記主回路基板の端部と前記銅箔パターンの他端の間に前記リード端子を貫通させるための開口が形成されているとともに、主回路端子台の配線の入出力がなされる側の端部と前記開口の間に隔壁が設けられていることを特徴とする電力変換装置。 - 前記リード端子を前記開口に貫通させた場合に、前記リード端子が前記隔壁に接触しないように前記隔壁が設けられていることを特徴とする請求項3に記載の電力変換装置。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009071138A JP5586866B2 (ja) | 2008-09-29 | 2009-03-24 | 電力変換装置 |
EP09251936.2A EP2170025B1 (en) | 2008-09-29 | 2009-08-05 | Power transducer |
US12/537,281 US8385078B2 (en) | 2008-09-29 | 2009-08-07 | Power transducer |
CN2009101659231A CN101714823B (zh) | 2008-09-29 | 2009-08-18 | 电力变换装置 |
CN201210065444.4A CN102629819B (zh) | 2008-09-29 | 2009-08-18 | 电力变换装置 |
CN201210392387.0A CN102931852B (zh) | 2008-09-29 | 2009-08-18 | 电力变换装置 |
US13/713,621 US8848384B2 (en) | 2008-09-29 | 2012-12-13 | Power transducer |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008249512 | 2008-09-29 | ||
JP2008249512 | 2008-09-29 | ||
JP2009071138A JP5586866B2 (ja) | 2008-09-29 | 2009-03-24 | 電力変換装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014104849A Division JP5802798B2 (ja) | 2008-09-29 | 2014-05-21 | 電力変換装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010104217A true JP2010104217A (ja) | 2010-05-06 |
JP5586866B2 JP5586866B2 (ja) | 2014-09-10 |
Family
ID=41124234
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009071138A Active JP5586866B2 (ja) | 2008-09-29 | 2009-03-24 | 電力変換装置 |
Country Status (4)
Country | Link |
---|---|
US (2) | US8385078B2 (ja) |
EP (1) | EP2170025B1 (ja) |
JP (1) | JP5586866B2 (ja) |
CN (3) | CN102931852B (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012010560A (ja) * | 2010-06-28 | 2012-01-12 | Toshiba Mitsubishi-Electric Industrial System Corp | 自冷式電力変換装置 |
WO2012090307A1 (ja) * | 2010-12-28 | 2012-07-05 | 三菱電機株式会社 | 電力変換装置 |
Families Citing this family (16)
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US8081462B2 (en) * | 2007-09-13 | 2011-12-20 | Rockwell Automation Technologies, Inc. | Modular liquid cooling system |
TWI445483B (zh) * | 2010-12-23 | 2014-07-11 | Compal Electronics Inc | 殼體結構及具有其之電子裝置 |
DE112011105213T5 (de) * | 2011-05-02 | 2014-05-15 | Toyota Jidosha Kabushiki Kaisha | Brennstoffzellenfahrzeug |
CN103182756A (zh) * | 2011-12-28 | 2013-07-03 | 富泰华工业(深圳)有限公司 | 供料系统 |
WO2013183011A2 (en) * | 2012-06-07 | 2013-12-12 | Intal Tech Ltd. | Electronic equipment building blocks for rack mounting |
JP5657716B2 (ja) * | 2013-01-15 | 2015-01-21 | ファナック株式会社 | 放熱器を備えたモータ駆動装置 |
CN104682457B (zh) * | 2013-11-26 | 2017-08-29 | 台达电子企业管理(上海)有限公司 | 电子装置及汽车的充电装置 |
US9420724B2 (en) * | 2014-11-04 | 2016-08-16 | Ge Aviation Systems Llc | Power converter assembly |
TWI558049B (zh) * | 2015-01-14 | 2016-11-11 | 緯創資通股份有限公司 | 具有電路防護之電子裝置及其組裝方法 |
JP6449694B2 (ja) * | 2015-03-18 | 2019-01-09 | 日立オートモティブシステムズ株式会社 | 電子制御装置 |
US9652008B2 (en) * | 2015-04-02 | 2017-05-16 | Det International Holding Limited | Power module |
CN110915313B (zh) * | 2017-06-07 | 2021-03-09 | Abb电网瑞士股份公司 | 功率半导体模块 |
KR102083139B1 (ko) * | 2017-06-15 | 2020-02-28 | 닛산 지도우샤 가부시키가이샤 | 전력 변환 장치 |
CN113141122A (zh) * | 2020-01-20 | 2021-07-20 | 珠海格力电器股份有限公司 | 一种智能功率模块及其制备方法 |
JP2022037532A (ja) * | 2020-08-25 | 2022-03-09 | パナソニックIpマネジメント株式会社 | 電力変換装置及び移動体 |
EP4017229A1 (de) * | 2020-12-15 | 2022-06-22 | Siemens Aktiengesellschaft | Vorrichtung zur einfassung einer leistungseinheit und zur zentrierung einer ansteuerungseinheit bezüglich der leistungseinheit |
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2009
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- 2009-08-18 CN CN201210392387.0A patent/CN102931852B/zh not_active Expired - Fee Related
- 2009-08-18 CN CN2009101659231A patent/CN101714823B/zh not_active Expired - Fee Related
- 2009-08-18 CN CN201210065444.4A patent/CN102629819B/zh not_active Expired - Fee Related
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2012
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JPH0284269U (ja) * | 1988-12-20 | 1990-06-29 | ||
JPH02270273A (ja) * | 1989-04-10 | 1990-11-05 | Matsushita Electric Ind Co Ltd | 接続器 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012010560A (ja) * | 2010-06-28 | 2012-01-12 | Toshiba Mitsubishi-Electric Industrial System Corp | 自冷式電力変換装置 |
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Also Published As
Publication number | Publication date |
---|---|
CN102931852B (zh) | 2016-02-24 |
JP5586866B2 (ja) | 2014-09-10 |
EP2170025B1 (en) | 2020-04-08 |
US20100079956A1 (en) | 2010-04-01 |
US20130100632A1 (en) | 2013-04-25 |
CN102629819B (zh) | 2015-10-28 |
US8385078B2 (en) | 2013-02-26 |
EP2170025A1 (en) | 2010-03-31 |
CN102931852A (zh) | 2013-02-13 |
US8848384B2 (en) | 2014-09-30 |
CN101714823A (zh) | 2010-05-26 |
CN101714823B (zh) | 2012-12-05 |
CN102629819A (zh) | 2012-08-08 |
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