JP2010087509A - 縦型の誘電体層を有する半導体素子構造 - Google Patents
縦型の誘電体層を有する半導体素子構造 Download PDFInfo
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Abstract
【解決手段】本発明の半導体構造の製造方法は、第1面101および第2面102’を有する第1半導体ボディ100を、第1面101から垂直方向に第1半導体ボディ100の中を伸びて第1半導体ボディ100を各半導体区域11’、21’にサブ分割する、互いに間隔をおいて配置された各第1誘電体層31を有するように設ける工程と、第1面101に第2半導体ボディ200を設ける工程と、第1半導体ボディ100の厚みを、第2面102’から垂直方向において少なくとも各第1誘電体層31の位置まで低減する工程とを含む。
【選択図】図1C
Description
上述の各工程の間、例えばエピタキシー法の間に、誘電体層31の誘電特性が変化する、具体的には悪化することがある。従って、このような誘電体層31を、上述の工程の後または上記工程を行っている間に、例えばエッチング法によって除去し、改めて誘電体層31を形成することが都合がよい。
21’ 半導体区域
31 第1誘電体層
100 第1半導体ボディ
101 第1面
102’ 第2面
Claims (23)
- 第1面および第2面を有する第1半導体ボディを、上記第1面から垂直方向に上記第1半導体ボディの中を伸びて上記第1半導体ボディを複数の各半導体区域にサブ分割する、互いに間隔をおいて配置された複数の各第1誘電体層を有するように設ける工程と、
上記第1半導体ボディの第1面に、第2半導体ボディを設ける工程と、
上記第1半導体ボディの厚みを、上記第2面から垂直方向において少なくとも上記各第1誘電体層の位置まで低減する工程とを含む、半導体構造の製造方法。 - 上記第1半導体ボディは、上記誘電体層が配置された第1半導体層、多孔質の第2半導体層、および第3半導体層を少なくとも備える層構造を有し、
上記第1半導体ボディの厚みを低減する工程は、上記第3半導体層を、上記多孔質の第2半導体層に沿って分離する工程を含む、請求項1に記載の方法。 - 上記第1半導体ボディの厚みを低減する工程は、上記第2半導体層を除去した後に上記第1半導体層を侵食する工程を含む、請求項1に記載の方法。
- 上記第1半導体層を侵食する工程は、エッチング法または研削法を含む、請求項3に記載の方法。
- 上記複数の各半導体区域を、一群の各ドリフトゾーンおよび一群の各ドリフト制御ゾーンにサブ分割し、
上記各ドリフトゾーンと上記各ドリフト制御ゾーンとの間に、上記各第1誘電体層を配置する、請求項1に記載の方法。 - 上記第1半導体ボディの厚みを低減する工程の後に、
上記第1半導体ボディの厚みを低減した後に露出された面から、上記各ドリフトゾーンの各区域に、少なくとも1つのトランジスタ素子ゾーンをそれぞれ形成する工程を含む、請求項5に記載の方法。 - 上記各ドリフトゾーンの各区域に、
ソースゾーン、ボディゾーン、および、ソースゾーンおよびボディゾーンを形成した後に残ったドリフトゾーンの区域によって形成されるドリフトゾーン、および、上記ボディゾーンに隣接して配置され、上記ボディゾーンからゲート誘電体によって誘電的に絶縁されているゲート電極を有するトランジスタ素子ゾーンを形成する工程を含み、
上記ボディゾーンは、上記ソースゾーンと上記ドリフトゾーンとの間に配置されている、請求項6に記載の方法。 - 上記第1半導体ボディの厚みを低減する工程の後に、
上記第1半導体ボディの厚みを低減した後に露出された面から、上記各ドリフトゾーンの区域内に、それぞれ、少なくとも1つの接続ゾーンを形成する工程を含む、請求項5に記載の方法。 - 上記第2半導体ボディを堆積させる工程の前に、
上記第1半導体ボディの第1面の領域内における、上記各ドリフトゾーンの区域および上記各ドリフト制御ゾーンの区域の少なくとも一方の内に、ドープされた半導体層を形成する工程を含む、請求項5に記載の方法。 - 上記第1半導体ボディは、上記第1面から上記第1半導体ボディの中に伸びる各第2誘電体層を有し、
上記第2誘電体層は、上記第1誘電体層と共に、上記第1半導体ボディの水平方向において、上記各半導体区域の少なくとも一部を完全に包囲するように、配置されている、請求項1に記載の方法。 - 上記第2半導体ボディを堆積させる工程の前に、
上記第1面の領域において、上記各ドリフト制御ゾーンの区域の上または上記各ドリフト制御ゾーンの区域の中に絶縁構造を形成する工程を含む、請求項5に記載の方法。 - 上記絶縁構造を形成する工程は、
上記各ドリフトゾーンの区域上における上記第1半導体ボディの第1面上に、第3誘電体層を形成する工程を含む、請求項11に記載の方法。 - 上記第3誘電体層を形成する工程は、
上記各ドリフトゾーンの区域および上記各ドリフト制御ゾーンの区域における上記第1半導体ボディの第1面に、誘電体層を堆積させる工程と、
上記各ドリフトゾーンの区域の上方の上記誘電体層内に、各コンタクトホールを形成する工程とを含む、請求項12に記載の方法。 - 上記第2半導体ボディを堆積させる工程の前に、
上記第1半導体ボディの第2面に導電層を堆積させる工程を含む、請求項12に記載の方法。 - 上記導電層はドープされた多結晶性の半導体層である、請求項14に記載の方法。
- 上記第1半導体ボディはエッジ領域を有し、
上記第1半導体ボディの厚みを低減した後に露出した面の領域内において、上記第1半導体ボディのエッジ領域と上記各ドリフト制御ゾーンの区域との間に、各整流素子を形成する工程をさらに含む、請求項12に記載の方法。 - 上記第2半導体ボディを、上記第1半導体ボディの形成面の反対面から、少なくとも部分的に除去する、請求項1に記載の方法。
- 上記第2半導体ボディを、上記第1半導体ボディの形成面の反対面から、完全に除去する、請求項17に記載の方法。
- 上記第2半導体ボディを堆積させる工程の前に、
上記第1面の領域内において、上記各半導体区域の上または上記各半導体区域の中に絶縁構造を形成する工程を含む、請求項1に記載の方法。 - 上記絶縁構造を形成する工程は、上記第1面上に電気的絶縁層を形成する工程を含む、請求項19に記載の方法。
- 第1面および第2面、エッジおよび上記エッジに水平方向において隣接するエッジ領域を備える半導体ボディと、
上記半導体ボディの垂直方向に伸びる第1誘電体層によって互いに誘電的に絶縁されたドリフトゾーンおよびドリフト制御ゾーンと、
上記ドリフトゾーンおよび上記エッジゾーンに接触している、上記半導体ボディの第2面の領域にある第1の接続ゾーンと、
上記ドリフト制御ゾーンおよび上記接続ゾーンの間に配置された第3誘電体層と、
上記第1面の領域内にある上記ドリフト制御ゾーンのコンタクトゾーン、および上記第1面の領域内にある上記エッジ領域のコンタクトゾーンの間に接続された整流素子とを含み、
上記ドリフト制御ゾーンは、少なくとも上記エッジ領域から第2誘電体層によって誘電的に絶縁されている、半導体素子。 - 上記ドリフト制御ゾーンは、第1ドープ区域、および、上記第1ドープ区域よりも高濃度にドープされた第2ドープ区域を有し、
上記第2ドープ区域は、上記第3誘電体層に沿って伸びている、請求項21に記載の半導体素子。 - 上記ドリフト制御ゾーンは、上記コンタクトゾーンおよび上記第2ドープ区域の間に配置された第3ドープ区域を有する、請求項22に記載の半導体素子。
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JP2013214773A (ja) | 2013-10-17 |
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