JP2010081308A5 - - Google Patents

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Publication number
JP2010081308A5
JP2010081308A5 JP2008247495A JP2008247495A JP2010081308A5 JP 2010081308 A5 JP2010081308 A5 JP 2010081308A5 JP 2008247495 A JP2008247495 A JP 2008247495A JP 2008247495 A JP2008247495 A JP 2008247495A JP 2010081308 A5 JP2010081308 A5 JP 2010081308A5
Authority
JP
Japan
Prior art keywords
resin
electronic component
piece
protrusion
resin protrusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008247495A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010081308A (ja
JP4760884B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008247495A priority Critical patent/JP4760884B2/ja
Priority claimed from JP2008247495A external-priority patent/JP4760884B2/ja
Priority to US12/561,287 priority patent/US8107252B2/en
Publication of JP2010081308A publication Critical patent/JP2010081308A/ja
Publication of JP2010081308A5 publication Critical patent/JP2010081308A5/ja
Application granted granted Critical
Publication of JP4760884B2 publication Critical patent/JP4760884B2/ja
Priority to US13/345,928 priority patent/US8867224B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2008247495A 2008-09-26 2008-09-26 水晶振動子パッケージ、電子部品の実装構造体、及び電子部品の製造方法 Expired - Fee Related JP4760884B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008247495A JP4760884B2 (ja) 2008-09-26 2008-09-26 水晶振動子パッケージ、電子部品の実装構造体、及び電子部品の製造方法
US12/561,287 US8107252B2 (en) 2008-09-26 2009-09-17 Mounting structure of electronic component and method of manufacturing electronic component
US13/345,928 US8867224B2 (en) 2008-09-26 2012-01-09 Mounting structure of electronic component and method of manufacturing electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008247495A JP4760884B2 (ja) 2008-09-26 2008-09-26 水晶振動子パッケージ、電子部品の実装構造体、及び電子部品の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011124173A Division JP5206842B2 (ja) 2011-06-02 2011-06-02 水晶振動子パッケージ

Publications (3)

Publication Number Publication Date
JP2010081308A JP2010081308A (ja) 2010-04-08
JP2010081308A5 true JP2010081308A5 (enExample) 2011-05-19
JP4760884B2 JP4760884B2 (ja) 2011-08-31

Family

ID=42057256

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008247495A Expired - Fee Related JP4760884B2 (ja) 2008-09-26 2008-09-26 水晶振動子パッケージ、電子部品の実装構造体、及び電子部品の製造方法

Country Status (2)

Country Link
US (2) US8107252B2 (enExample)
JP (1) JP4760884B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011142374A (ja) 2010-01-05 2011-07-21 Seiko Epson Corp 圧電デバイス、圧電デバイスの製造方法
JP2011205425A (ja) 2010-03-25 2011-10-13 Seiko Epson Corp 電子部品及び電子部品の製造方法
EP2624450B1 (en) * 2011-02-25 2015-02-11 Daishinku Corporation Piezoelectric vibrating reed, piezoelectric vibrator, method for manufacturing piezoelectric vibrating reed, and method for manufacturing piezoelectric vibrator
US10133428B2 (en) * 2015-05-29 2018-11-20 Samsung Display Co., Ltd. Flexible display device including a flexible substrate having a bending part and a conductive pattern at least partially disposed on the bending part

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5867074A (en) * 1994-03-02 1999-02-02 Seiko Epson Corporation Surface acoustic wave resonator, surface acoustic wave resonator unit, surface mounting type surface acoustic wave resonator unit
WO1995024075A1 (en) 1994-03-02 1995-09-08 Seiko Epson Corporation Surface acoustic wave resonator element, surface acoustic wave resonator, surface-mount surface acoustic wave resonator, and method of manufacture thereof
JP3825475B2 (ja) * 1995-06-30 2006-09-27 株式会社 東芝 電子部品の製造方法
CN1111950C (zh) * 1997-01-13 2003-06-18 精工爱普生株式会社 压电振子、压电振子的制造方法及压电振子单元
JPH11261360A (ja) 1998-03-10 1999-09-24 Seiko Epson Corp 圧電振動子の製造方法
US20030062969A1 (en) * 2001-09-25 2003-04-03 Tdk Corporation Saw element and saw device
JP2003158440A (ja) * 2001-11-19 2003-05-30 Daishinku Corp 接合部材および当該接合部材を用いた圧電振動デバイスおよび圧電振動デバイスの製造方法
JP2003163563A (ja) 2001-11-26 2003-06-06 Kyocera Corp 圧電装置
US7185085B2 (en) * 2002-02-27 2007-02-27 Webtrends, Inc. On-line web traffic sampling
JP2004215226A (ja) * 2002-12-17 2004-07-29 Seiko Epson Corp 弾性表面波装置の周波数調整方法および電子機器
JP2004241594A (ja) * 2003-02-05 2004-08-26 Sony Corp 半導体パッケージ
JP3901130B2 (ja) * 2003-06-18 2007-04-04 株式会社村田製作所 共振器、フィルタおよび通信装置
JP4587732B2 (ja) * 2004-07-28 2010-11-24 京セラ株式会社 弾性表面波装置
EP1845453A4 (en) * 2004-10-28 2010-06-16 Univ Fukui DATABASE MANAGEMENT DEVICE, PROCESS AND PROGRAM
JP4254720B2 (ja) * 2005-02-04 2009-04-15 セイコーエプソン株式会社 絶縁化処理前基板、および基板の製造方法
JP2006332122A (ja) * 2005-05-23 2006-12-07 Fujitsu Ltd 電子回路装置、その製造方法、バリスタの製造方法、及び半導体装置の製造方法
JP2007013444A (ja) 2005-06-29 2007-01-18 Daishinku Corp 圧電振動デバイス及びその製造方法
US20070013444A1 (en) * 2005-07-12 2007-01-18 Porco Ronald L Parallel path pre-distorted amplifier
JP4637669B2 (ja) * 2005-07-13 2011-02-23 京セラ株式会社 フィルタ装置とこれを用いたマルチバンドフィルタ、分波器及び通信装置
JP2007103737A (ja) * 2005-10-05 2007-04-19 Sharp Corp 半導体装置
JP4784304B2 (ja) * 2005-12-27 2011-10-05 セイコーエプソン株式会社 電子部品、電子部品の製造方法、回路基板及び電子機器
JP2008091691A (ja) 2006-10-03 2008-04-17 Seiko Epson Corp 半導体装置、電子デバイス、及び、電子デバイスの製造方法
JP2008131549A (ja) * 2006-11-24 2008-06-05 Daishinku Corp 水晶振動デバイス
US7495927B2 (en) * 2007-01-24 2009-02-24 Epson Imaging Devices Corporation Mount structure, electro-optical device, and electronic apparatus

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