JP2010062522A - セラミック多層回路基板及びその製造方法 - Google Patents
セラミック多層回路基板及びその製造方法 Download PDFInfo
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- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
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- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
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- C04B2237/59—Aspects relating to the structure of the interlayer
- C04B2237/595—Aspects relating to the structure of the interlayer whereby the interlayer is continuous, but heterogeneous on macro-scale, e.g. one part of the interlayer being a joining material, another part being an electrode material
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- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
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- C04B2237/708—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the interlayers
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
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- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
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- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
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- H05K2203/14—Related to the order of processing steps
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- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
- H05K3/1291—Firing or sintering at relative high temperatures for patterns on inorganic boards, e.g. co-firing of circuits on green ceramic sheets
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Abstract
【解決手段】ビア電極を含む少なくともひとつのセラミックグリーンシートが積層された複数のセラミックブロックを形成する段階、複数のセラミックブロックを夫々焼成する段階、焼成された複数のセラミックブロックを整列する段階、複数のセラミックブロックに含まれたビア電極と対応する位置に接合電極が形成された接合グリーンシートを少なくともひとつ以上備える段階、整列された複数のセラミックブロックのうち互いに向かい合うセラミックブロックに接合グリーンシートを挿入する段階、及び複数のセラミックブロック及び上記接合グリーンシートを接合して焼成する段階を含むセラミック多層回路基板の製造方法を提供する。
【選択図】図2c
Description
110 第1セラミックブロック
120 第2セラミックブロック
130 第3セラミックブロック
140 第4セラミックブロック
150 第5セラミックブロック
310 第1接合グリーンシート
320 第2接合グリーンシート
330 第3接合グリーンシート
340 第4接合グリーンシート
Claims (8)
- ビア電極を含む少なくともひとつのセラミックグリーンシートが積層された複数のセラミックブロックを形成する段階と、
前記複数のセラミックブロックを夫々焼成する段階と、
前記焼成された複数のセラミックブロックを整列する段階と、
前記複数のセラミックブロックに含まれたビア電極と対応する位置に接合電極が形成された接合グリーンシートを少なくともひとつ備える段階と、
前記整列された複数のセラミックブロックのうち互いに向かい合うセラミックブロックに前記接合グリーンシートを挿入する段階と、
前記複数のセラミックブロック及び前記接合グリーンシートを接合して焼成する段階と、
を含むセラミック多層回路基板の製造方法。 - 前記複数のセラミックブロックを焼成する段階は、
前記複数のセラミックブロックの夫々の両面に前記複数のセラミックブロックの焼成温度で焼成されない無機粉末を含む拘束層を形成する段階と、
前記拘束層が形成された複数のセラミックブロックを個別に焼成する段階と、
前記焼成された複数のセラミックブロック上において前記拘束層を除去する段階と、
を含むことを特徴とする請求項1に記載のセラミック多層回路基板の製造方法。 - 前記複数のセラミックブロックは、夫々1.5mm以下の厚さで形成されることを特徴とする請求項1に記載のセラミック多層回路基板の製造方法。
- 前記接合グリーンシートを少なくともひとつ備える段階は、
セラミック組成物を利用してセラミックグリーンシートを製造する段階と、
前記セラミックグリーンシートにおいて前記複数のセラミックブロックに含まれたビア電極と対応する位置を打ち抜いて少なくともひとつ以上のビアホールを形成する段階と、
前記ビアホールに金属物質を充填させて前記接合電極を形成する段階と、
を含むことを特徴とする請求項1に記載のセラミック多層回路基板の製造方法。 - 前記金属物質は、銀ペーストであることを特徴とする請求項4に記載のセラミック多層回路基板の製造方法。
- 前記接合グリーンシートは夫々、40〜100μmの厚さを有することを特徴とする請求項1に記載のセラミック多層回路基板の製造方法。
- 前記接合電極は、夫々45〜130μmの厚さを有することを特徴とする請求項6に記載のセラミック多層回路基板の製造方法。
- ビア電極を含む少なくともひとつのセラミックグリーンシートが積層された複数のセラミックブロックと、
前記複数のセラミックブロックのうち互いに向かい合うセラミックブロックの間に挿入され、前記複数のブロックに含まれたビア電極に対応される位置に形成された接合電極を含む接合グリーンシートと、を含むセラミック多層回路基板。
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KR1020080087827A KR101004843B1 (ko) | 2008-09-05 | 2008-09-05 | 세라믹 다층 회로 기판 및 그의 제조 방법 |
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JP (1) | JP2010062522A (ja) |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2008029847A1 (ja) * | 2006-09-06 | 2010-01-21 | 株式会社トクヤマ | セラミック基板の製造方法、および、セラミック基板 |
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US9009954B2 (en) | 2011-08-31 | 2015-04-21 | Lexmark International, Inc. | Process for manufacturing a Z-directed component for a printed circuit board using a sacrificial constraining material |
US8822840B2 (en) | 2012-03-29 | 2014-09-02 | Lexmark International, Inc. | Z-directed printed circuit board components having conductive channels for controlling transmission line impedance |
US8822838B2 (en) | 2012-03-29 | 2014-09-02 | Lexmark International, Inc. | Z-directed printed circuit board components having conductive channels for reducing radiated emissions |
US8912452B2 (en) | 2012-03-29 | 2014-12-16 | Lexmark International, Inc. | Z-directed printed circuit board components having different dielectric regions |
US8830692B2 (en) | 2012-03-29 | 2014-09-09 | Lexmark International, Inc. | Ball grid array systems for surface mounting an integrated circuit using a Z-directed printed circuit board component |
PL2956310T3 (pl) | 2013-02-13 | 2019-12-31 | Composecure, Llc | Karta o dużej wytrzymałości |
EP3146476A4 (en) | 2014-05-22 | 2017-12-13 | Composecure LLC | Transaction and id cards having selected texture and coloring |
US10783422B2 (en) | 2014-11-03 | 2020-09-22 | Composecure, Llc | Ceramic-containing and ceramic composite transaction cards |
KR101855275B1 (ko) * | 2016-12-27 | 2018-05-08 | 에스케이씨 주식회사 | 세라믹 다층회로 기판의 제조방법 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS505374B1 (ja) * | 1970-03-23 | 1975-03-03 | ||
JPS62244197A (ja) * | 1986-04-17 | 1987-10-24 | 株式会社 タムラ製作所 | 焼成済セラミツク板を使つた多層基板製造法 |
JPS63220598A (ja) * | 1987-03-10 | 1988-09-13 | 三菱鉱業セメント株式会社 | セラミック多層配線基板の製法 |
JPH02210894A (ja) * | 1989-02-10 | 1990-08-22 | Mitsubishi Metal Corp | 内部に導体、抵抗体を配線したAlN多層基板の製造方法 |
JPH05267854A (ja) * | 1992-03-24 | 1993-10-15 | Mitsubishi Materials Corp | セラミック多層配線基板及びその製造方法 |
JP2003158375A (ja) * | 2001-11-22 | 2003-05-30 | Sumitomo Metal Electronics Devices Inc | セラミック多層基板の製造方法及び半導体装置 |
JP2006253435A (ja) * | 2005-03-11 | 2006-09-21 | Tdk Corp | 積層セラミック基板の製造方法 |
JP3912153B2 (ja) * | 2002-03-20 | 2007-05-09 | 株式会社村田製作所 | セラミック多層基板の製造方法 |
JP2008034828A (ja) * | 2006-06-30 | 2008-02-14 | Ngk Spark Plug Co Ltd | Ic検査用治具に用いる多層セラミック基板及び多層セラミック基板の製造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS505374A (ja) | 1973-05-28 | 1975-01-21 | ||
JP2002271038A (ja) * | 2001-03-12 | 2002-09-20 | Matsushita Electric Ind Co Ltd | 複合多層基板およびその製造方法ならびに電子部品 |
KR20040030803A (ko) | 2001-07-19 | 2004-04-09 | 이비덴 가부시키가이샤 | 세라믹 접합체 및 그 접합방법, 세라믹 구조체 |
KR100649580B1 (ko) * | 2003-12-15 | 2006-11-28 | 삼성전기주식회사 | 스핀코팅에 의한 적층세라믹 커패시터의 제조방법 및적층세라믹 커패시터 |
JP4731340B2 (ja) | 2006-02-02 | 2011-07-20 | 富士通株式会社 | 半導体装置の製造方法 |
WO2008018227A1 (fr) * | 2006-08-07 | 2008-02-14 | Murata Manufacturing Co., Ltd. | Procédé de production d'un substrat céramique multicouche |
-
2008
- 2008-09-05 KR KR1020080087827A patent/KR101004843B1/ko not_active IP Right Cessation
-
2009
- 2009-03-17 US US12/405,729 patent/US8106306B2/en not_active Expired - Fee Related
- 2009-03-26 TW TW098109849A patent/TW201012335A/zh unknown
- 2009-03-27 JP JP2009079752A patent/JP2010062522A/ja active Pending
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS505374B1 (ja) * | 1970-03-23 | 1975-03-03 | ||
JPS62244197A (ja) * | 1986-04-17 | 1987-10-24 | 株式会社 タムラ製作所 | 焼成済セラミツク板を使つた多層基板製造法 |
JPS63220598A (ja) * | 1987-03-10 | 1988-09-13 | 三菱鉱業セメント株式会社 | セラミック多層配線基板の製法 |
JPH02210894A (ja) * | 1989-02-10 | 1990-08-22 | Mitsubishi Metal Corp | 内部に導体、抵抗体を配線したAlN多層基板の製造方法 |
JPH05267854A (ja) * | 1992-03-24 | 1993-10-15 | Mitsubishi Materials Corp | セラミック多層配線基板及びその製造方法 |
JP2003158375A (ja) * | 2001-11-22 | 2003-05-30 | Sumitomo Metal Electronics Devices Inc | セラミック多層基板の製造方法及び半導体装置 |
JP3912153B2 (ja) * | 2002-03-20 | 2007-05-09 | 株式会社村田製作所 | セラミック多層基板の製造方法 |
JP2006253435A (ja) * | 2005-03-11 | 2006-09-21 | Tdk Corp | 積層セラミック基板の製造方法 |
JP2008034828A (ja) * | 2006-06-30 | 2008-02-14 | Ngk Spark Plug Co Ltd | Ic検査用治具に用いる多層セラミック基板及び多層セラミック基板の製造方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2008029847A1 (ja) * | 2006-09-06 | 2010-01-21 | 株式会社トクヤマ | セラミック基板の製造方法、および、セラミック基板 |
Also Published As
Publication number | Publication date |
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US8106306B2 (en) | 2012-01-31 |
KR101004843B1 (ko) | 2010-12-28 |
TW201012335A (en) | 2010-03-16 |
US20100059266A1 (en) | 2010-03-11 |
KR20100028883A (ko) | 2010-03-15 |
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