JPS505374B1 - - Google Patents
Info
- Publication number
- JPS505374B1 JPS505374B1 JP45024206A JP2420670A JPS505374B1 JP S505374 B1 JPS505374 B1 JP S505374B1 JP 45024206 A JP45024206 A JP 45024206A JP 2420670 A JP2420670 A JP 2420670A JP S505374 B1 JPS505374 B1 JP S505374B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP45024206A JPS505374B1 (ja) | 1970-03-23 | 1970-03-23 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP45024206A JPS505374B1 (ja) | 1970-03-23 | 1970-03-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS505374B1 true JPS505374B1 (ja) | 1975-03-03 |
Family
ID=12131824
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP45024206A Pending JPS505374B1 (ja) | 1970-03-23 | 1970-03-23 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS505374B1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010062522A (ja) * | 2008-09-05 | 2010-03-18 | Samsung Electro-Mechanics Co Ltd | セラミック多層回路基板及びその製造方法 |
-
1970
- 1970-03-23 JP JP45024206A patent/JPS505374B1/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010062522A (ja) * | 2008-09-05 | 2010-03-18 | Samsung Electro-Mechanics Co Ltd | セラミック多層回路基板及びその製造方法 |