JPS505374A - - Google Patents
Info
- Publication number
- JPS505374A JPS505374A JP5854073A JP5854073A JPS505374A JP S505374 A JPS505374 A JP S505374A JP 5854073 A JP5854073 A JP 5854073A JP 5854073 A JP5854073 A JP 5854073A JP S505374 A JPS505374 A JP S505374A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Furan Compounds (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5854073A JPS505374A (ja) | 1973-05-28 | 1973-05-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5854073A JPS505374A (ja) | 1973-05-28 | 1973-05-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS505374A true JPS505374A (ja) | 1975-01-21 |
Family
ID=13087263
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5854073A Pending JPS505374A (ja) | 1973-05-28 | 1973-05-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS505374A (ja) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53140569A (en) * | 1977-05-12 | 1978-12-07 | Nippon Electric Co | Method of producing multilayer circuit board |
| JPS53140570A (en) * | 1977-05-12 | 1978-12-07 | Nippon Electric Co | Method of producing multilayer circuit board |
| JPS5648197A (en) * | 1979-09-28 | 1981-05-01 | Hitachi Ltd | Method of manufacturing ceramic multilayer circuit board |
| JPS63220598A (ja) * | 1987-03-10 | 1988-09-13 | 三菱鉱業セメント株式会社 | セラミック多層配線基板の製法 |
| JPS6428889A (en) * | 1987-07-23 | 1989-01-31 | Matsushita Electric Ind Co Ltd | Manufacture of composite circuit board |
| JPH01321695A (ja) * | 1988-06-23 | 1989-12-27 | Mitsubishi Mining & Cement Co Ltd | セラミック複合回路基板 |
| US8106306B2 (en) | 2008-09-05 | 2012-01-31 | Samsung Electro-Mechanics Co., Ltd. | Ceramic multi-layer circuit substrate and manufacturing method thereof |
-
1973
- 1973-05-28 JP JP5854073A patent/JPS505374A/ja active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53140569A (en) * | 1977-05-12 | 1978-12-07 | Nippon Electric Co | Method of producing multilayer circuit board |
| JPS53140570A (en) * | 1977-05-12 | 1978-12-07 | Nippon Electric Co | Method of producing multilayer circuit board |
| JPS5648197A (en) * | 1979-09-28 | 1981-05-01 | Hitachi Ltd | Method of manufacturing ceramic multilayer circuit board |
| JPS63220598A (ja) * | 1987-03-10 | 1988-09-13 | 三菱鉱業セメント株式会社 | セラミック多層配線基板の製法 |
| JPH0217957B2 (ja) * | 1987-03-10 | 1990-04-24 | Mitsubishi Mining & Cement Co | |
| JPS6428889A (en) * | 1987-07-23 | 1989-01-31 | Matsushita Electric Ind Co Ltd | Manufacture of composite circuit board |
| JPH01321695A (ja) * | 1988-06-23 | 1989-12-27 | Mitsubishi Mining & Cement Co Ltd | セラミック複合回路基板 |
| US8106306B2 (en) | 2008-09-05 | 2012-01-31 | Samsung Electro-Mechanics Co., Ltd. | Ceramic multi-layer circuit substrate and manufacturing method thereof |