JPS6428889A - Manufacture of composite circuit board - Google Patents

Manufacture of composite circuit board

Info

Publication number
JPS6428889A
JPS6428889A JP62184009A JP18400987A JPS6428889A JP S6428889 A JPS6428889 A JP S6428889A JP 62184009 A JP62184009 A JP 62184009A JP 18400987 A JP18400987 A JP 18400987A JP S6428889 A JPS6428889 A JP S6428889A
Authority
JP
Japan
Prior art keywords
bonding conductors
sealing glass
bonding
circuit board
circuit boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62184009A
Other languages
Japanese (ja)
Other versions
JPH069307B2 (en
Inventor
Kazuo Oishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP62184009A priority Critical patent/JPH069307B2/en
Publication of JPS6428889A publication Critical patent/JPS6428889A/en
Publication of JPH069307B2 publication Critical patent/JPH069307B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination

Landscapes

  • Combinations Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

PURPOSE:To contrive the improvement in bonding strength, reliability, and humidity resistance by applying bonding conductors over desired electrodes on a circuit board and further applying a sealing glass around and among said bonding conductors, followed by firing of this laminated body. CONSTITUTION:A plurality of circuit boards 1 and 2 on which electrodes and circuit wirings have been formed on inorganic insulating substrates are prepared. On desired electrodes 3 of said circuit boards 1 and 2, bonding conductors 4 are applied and further a sealing glass 5 is applied around and among said bonding conductors 4. Then, while opposing the bonding conductors 4 one another and sealing their periphery with the sealing glass 5, the substrate in which the circuit boards 1 and 2 are laminated is fired. Thus, the bonding conductors 4 and the sealing glass 5 can be bonded by sintering and united electrically and mechanically.
JP62184009A 1987-07-23 1987-07-23 Method for manufacturing composite circuit board Expired - Lifetime JPH069307B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62184009A JPH069307B2 (en) 1987-07-23 1987-07-23 Method for manufacturing composite circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62184009A JPH069307B2 (en) 1987-07-23 1987-07-23 Method for manufacturing composite circuit board

Publications (2)

Publication Number Publication Date
JPS6428889A true JPS6428889A (en) 1989-01-31
JPH069307B2 JPH069307B2 (en) 1994-02-02

Family

ID=16145730

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62184009A Expired - Lifetime JPH069307B2 (en) 1987-07-23 1987-07-23 Method for manufacturing composite circuit board

Country Status (1)

Country Link
JP (1) JPH069307B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005311188A (en) * 2004-04-23 2005-11-04 Fuchigami Micro:Kk Multilayer interconnection board
KR100893418B1 (en) * 1998-10-15 2009-04-17 만네스만 파우데오 아게 Board having strip conductor on both sides

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS505374A (en) * 1973-05-28 1975-01-21
JPS5419050A (en) * 1977-07-13 1979-02-13 Daihatsu Motor Co Ltd Mechanism of preventing miss shift of speed change operational device
JPS6243197A (en) * 1985-08-21 1987-02-25 株式会社日立製作所 Laminate type hybrid ic
JPS63220598A (en) * 1987-03-10 1988-09-13 三菱鉱業セメント株式会社 Ceramic multilayer interconnection board and manufacture of the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS505374A (en) * 1973-05-28 1975-01-21
JPS5419050A (en) * 1977-07-13 1979-02-13 Daihatsu Motor Co Ltd Mechanism of preventing miss shift of speed change operational device
JPS6243197A (en) * 1985-08-21 1987-02-25 株式会社日立製作所 Laminate type hybrid ic
JPS63220598A (en) * 1987-03-10 1988-09-13 三菱鉱業セメント株式会社 Ceramic multilayer interconnection board and manufacture of the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100893418B1 (en) * 1998-10-15 2009-04-17 만네스만 파우데오 아게 Board having strip conductor on both sides
JP2005311188A (en) * 2004-04-23 2005-11-04 Fuchigami Micro:Kk Multilayer interconnection board

Also Published As

Publication number Publication date
JPH069307B2 (en) 1994-02-02

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