JP2010056266A - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
- Publication number
- JP2010056266A JP2010056266A JP2008219183A JP2008219183A JP2010056266A JP 2010056266 A JP2010056266 A JP 2010056266A JP 2008219183 A JP2008219183 A JP 2008219183A JP 2008219183 A JP2008219183 A JP 2008219183A JP 2010056266 A JP2010056266 A JP 2010056266A
- Authority
- JP
- Japan
- Prior art keywords
- film
- columnar electrode
- forming
- resist film
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 33
- 238000004519 manufacturing process Methods 0.000 title claims description 18
- 229910052751 metal Inorganic materials 0.000 claims abstract description 55
- 239000002184 metal Substances 0.000 claims abstract description 55
- 238000007747 plating Methods 0.000 claims abstract description 42
- 238000000034 method Methods 0.000 claims abstract description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000010949 copper Substances 0.000 claims abstract description 15
- 229910052802 copper Inorganic materials 0.000 claims abstract description 15
- 239000010936 titanium Substances 0.000 claims abstract description 11
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 11
- 238000004544 sputter deposition Methods 0.000 claims abstract description 9
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 8
- 238000009713 electroplating Methods 0.000 claims abstract description 7
- 238000005530 etching Methods 0.000 claims description 30
- 239000000758 substrate Substances 0.000 claims description 14
- 230000015572 biosynthetic process Effects 0.000 claims description 11
- 238000000206 photolithography Methods 0.000 claims description 6
- 238000004528 spin coating Methods 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 4
- 238000000059 patterning Methods 0.000 claims description 3
- 238000007641 inkjet printing Methods 0.000 claims description 2
- 230000001681 protective effect Effects 0.000 abstract description 15
- 239000011248 coating agent Substances 0.000 description 13
- 238000000576 coating method Methods 0.000 description 13
- 239000010953 base metal Substances 0.000 description 9
- 238000007789 sealing Methods 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 3
- 150000003608 titanium Chemical class 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008219183A JP2010056266A (ja) | 2008-08-28 | 2008-08-28 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008219183A JP2010056266A (ja) | 2008-08-28 | 2008-08-28 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010056266A true JP2010056266A (ja) | 2010-03-11 |
| JP2010056266A5 JP2010056266A5 (enrdf_load_stackoverflow) | 2011-05-19 |
Family
ID=42071876
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008219183A Pending JP2010056266A (ja) | 2008-08-28 | 2008-08-28 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2010056266A (enrdf_load_stackoverflow) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105304586A (zh) * | 2015-11-20 | 2016-02-03 | 江阴长电先进封装有限公司 | 一种带有加强结构的芯片嵌入式封装结构及其封装方法 |
| CN110095935A (zh) * | 2018-01-30 | 2019-08-06 | 住友重机械工业株式会社 | 膜形成方法、膜形成装置及形成有膜的复合基板 |
| KR20210063236A (ko) | 2019-11-22 | 2021-06-01 | 스미도모쥬기가이고교 가부시키가이샤 | 잉크도포제어장치 및 잉크도포방법 |
| CN114361050A (zh) * | 2021-12-24 | 2022-04-15 | 苏州科阳半导体有限公司 | 一种多芯片倒装重置晶圆级封装结构及方法 |
| CN114361051A (zh) * | 2021-12-24 | 2022-04-15 | 苏州科阳半导体有限公司 | 一种多芯片正装重置晶圆级封装结构及方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001135742A (ja) * | 1999-11-01 | 2001-05-18 | Toppan Printing Co Ltd | 半導体装置の製造方法 |
| JP2001291733A (ja) * | 2000-04-11 | 2001-10-19 | Casio Comput Co Ltd | 半導体装置およびその製造方法 |
| JP2005158929A (ja) * | 2003-11-25 | 2005-06-16 | Shinko Electric Ind Co Ltd | 半導体装置及びその製造方法 |
| JP2005310817A (ja) * | 2004-04-16 | 2005-11-04 | Seiko Epson Corp | 半導体装置の製造方法、回路基板、並びに電子機器 |
| JP2007294786A (ja) * | 2006-04-27 | 2007-11-08 | Elpida Memory Inc | 半導体装置及びその製造方法 |
-
2008
- 2008-08-28 JP JP2008219183A patent/JP2010056266A/ja active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001135742A (ja) * | 1999-11-01 | 2001-05-18 | Toppan Printing Co Ltd | 半導体装置の製造方法 |
| JP2001291733A (ja) * | 2000-04-11 | 2001-10-19 | Casio Comput Co Ltd | 半導体装置およびその製造方法 |
| JP2005158929A (ja) * | 2003-11-25 | 2005-06-16 | Shinko Electric Ind Co Ltd | 半導体装置及びその製造方法 |
| JP2005310817A (ja) * | 2004-04-16 | 2005-11-04 | Seiko Epson Corp | 半導体装置の製造方法、回路基板、並びに電子機器 |
| JP2007294786A (ja) * | 2006-04-27 | 2007-11-08 | Elpida Memory Inc | 半導体装置及びその製造方法 |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105304586A (zh) * | 2015-11-20 | 2016-02-03 | 江阴长电先进封装有限公司 | 一种带有加强结构的芯片嵌入式封装结构及其封装方法 |
| CN110095935A (zh) * | 2018-01-30 | 2019-08-06 | 住友重机械工业株式会社 | 膜形成方法、膜形成装置及形成有膜的复合基板 |
| CN110095935B (zh) * | 2018-01-30 | 2022-05-10 | 住友重机械工业株式会社 | 膜形成方法、膜形成装置及形成有膜的复合基板 |
| KR20210063236A (ko) | 2019-11-22 | 2021-06-01 | 스미도모쥬기가이고교 가부시키가이샤 | 잉크도포제어장치 및 잉크도포방법 |
| CN114361050A (zh) * | 2021-12-24 | 2022-04-15 | 苏州科阳半导体有限公司 | 一种多芯片倒装重置晶圆级封装结构及方法 |
| CN114361051A (zh) * | 2021-12-24 | 2022-04-15 | 苏州科阳半导体有限公司 | 一种多芯片正装重置晶圆级封装结构及方法 |
| CN114361051B (zh) * | 2021-12-24 | 2023-03-10 | 苏州科阳半导体有限公司 | 一种多芯片正装重置晶圆级封装结构及方法 |
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