JP2010056266A5 - - Google Patents
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- Publication number
- JP2010056266A5 JP2010056266A5 JP2008219183A JP2008219183A JP2010056266A5 JP 2010056266 A5 JP2010056266 A5 JP 2010056266A5 JP 2008219183 A JP2008219183 A JP 2008219183A JP 2008219183 A JP2008219183 A JP 2008219183A JP 2010056266 A5 JP2010056266 A5 JP 2010056266A5
- Authority
- JP
- Japan
- Prior art keywords
- forming
- film
- resist film
- wiring
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 9
- 238000005530 etching Methods 0.000 claims 8
- 238000004519 manufacturing process Methods 0.000 claims 8
- 229910052751 metal Inorganic materials 0.000 claims 8
- 239000002184 metal Substances 0.000 claims 8
- 238000000034 method Methods 0.000 claims 5
- 238000007747 plating Methods 0.000 claims 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 238000004544 sputter deposition Methods 0.000 claims 2
- 239000010936 titanium Substances 0.000 claims 2
- 229910052719 titanium Inorganic materials 0.000 claims 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 238000009713 electroplating Methods 0.000 claims 1
- 238000007641 inkjet printing Methods 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
- 238000000059 patterning Methods 0.000 claims 1
- 238000000206 photolithography Methods 0.000 claims 1
- 238000004528 spin coating Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008219183A JP2010056266A (ja) | 2008-08-28 | 2008-08-28 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008219183A JP2010056266A (ja) | 2008-08-28 | 2008-08-28 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010056266A JP2010056266A (ja) | 2010-03-11 |
| JP2010056266A5 true JP2010056266A5 (enrdf_load_stackoverflow) | 2011-05-19 |
Family
ID=42071876
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008219183A Pending JP2010056266A (ja) | 2008-08-28 | 2008-08-28 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2010056266A (enrdf_load_stackoverflow) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105304586A (zh) * | 2015-11-20 | 2016-02-03 | 江阴长电先进封装有限公司 | 一种带有加强结构的芯片嵌入式封装结构及其封装方法 |
| JP6925749B2 (ja) * | 2018-01-30 | 2021-08-25 | 住友重機械工業株式会社 | 膜形成方法、及び膜形成装置 |
| JP7464378B2 (ja) | 2019-11-22 | 2024-04-09 | 住友重機械工業株式会社 | インク塗布制御装置及びインク塗布方法 |
| CN114361050A (zh) * | 2021-12-24 | 2022-04-15 | 苏州科阳半导体有限公司 | 一种多芯片倒装重置晶圆级封装结构及方法 |
| CN114361051B (zh) * | 2021-12-24 | 2023-03-10 | 苏州科阳半导体有限公司 | 一种多芯片正装重置晶圆级封装结构及方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3770007B2 (ja) * | 1999-11-01 | 2006-04-26 | 凸版印刷株式会社 | 半導体装置の製造方法 |
| JP3457926B2 (ja) * | 2000-04-11 | 2003-10-20 | カシオ計算機株式会社 | 半導体装置およびその製造方法 |
| JP3929966B2 (ja) * | 2003-11-25 | 2007-06-13 | 新光電気工業株式会社 | 半導体装置及びその製造方法 |
| JP4492196B2 (ja) * | 2004-04-16 | 2010-06-30 | セイコーエプソン株式会社 | 半導体装置の製造方法、回路基板、並びに電子機器 |
| JP2007294786A (ja) * | 2006-04-27 | 2007-11-08 | Elpida Memory Inc | 半導体装置及びその製造方法 |
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2008
- 2008-08-28 JP JP2008219183A patent/JP2010056266A/ja active Pending