JP2007294786A - 半導体装置及びその製造方法 - Google Patents
半導体装置及びその製造方法 Download PDFInfo
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- JP2007294786A JP2007294786A JP2006122913A JP2006122913A JP2007294786A JP 2007294786 A JP2007294786 A JP 2007294786A JP 2006122913 A JP2006122913 A JP 2006122913A JP 2006122913 A JP2006122913 A JP 2006122913A JP 2007294786 A JP2007294786 A JP 2007294786A
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- insulating film
- electrode
- semiconductor device
- substrate
- silicon substrate
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 63
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 54
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 37
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 37
- 239000010703 silicon Substances 0.000 claims abstract description 37
- 239000002184 metal Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 238000007747 plating Methods 0.000 claims description 7
- 239000010408 film Substances 0.000 description 61
- 239000010410 layer Substances 0.000 description 15
- 239000010949 copper Substances 0.000 description 14
- 238000000034 method Methods 0.000 description 11
- 229910000679 solder Inorganic materials 0.000 description 11
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- 239000010409 thin film Substances 0.000 description 6
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- 238000011161 development Methods 0.000 description 4
- 230000000644 propagated effect Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 2
- 235000012489 doughnuts Nutrition 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
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- 238000004544 sputter deposition Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
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Abstract
【解決手段】ウエハレベル・チップサイズのパッケージ構造は、シリコン基板11上に形成された半導体回路を一様に覆う薄い絶縁膜15と、この薄い絶縁膜15上に各外部電極22に対応して形成されて、各外部電極22を搭載するドーナツ状の厚い絶縁膜18とを有する。シリコン基板11は、裏面から研磨されて、0.6mm未満の厚みを有する。
【選択図】図1
Description
ε=3.5×8.85×10-12 F/m
とし、絶縁膜の厚みを種々に変え、絶接続電極とシリコン基板間に生じる静電容量(電極容量)を計算した。計算結果を表1に示す。
r=Eb2/6(1−ν)σd (1)
で与えられる。ここで、ウエハ径をwとすると、ウエハの反り量tは、
t=r{1−sin〔arccos(w/2r)〕} (2)
で与えられる。膜応力σをσ=100Mpa、基板のヤング率EをE=190GPa、基板のポアッソン比νをν=0.07とすると、絶縁膜の厚みdに対して、ウエハの反り量tは、表2で与えられる。
前記絶縁膜は、前記外部電極が形成される絶縁膜部分が他の絶縁膜部分に比して厚く形成されていることを特徴とする。
11:半導体ウエハ(シリコン基板)
12:Al電極
13:開口
14:SiN膜
15:絶縁膜(感光性ポリイミド膜)
16:配線
16A:Ti/Cu薄膜
17:レジストマスク
18:絶縁膜(ポリイミド膜)
19:シード層
20:レジスト膜
21:開口
22:めっき層(接続電極)
23:はんだボール
Claims (6)
- 基板と、該基板上に形成された半導体回路と、該半導体回路を覆う絶縁膜と、該絶縁膜上に形成され前記半導体回路に導通する外部電極とを備える半導体装置において、
前記絶縁膜は、前記外部電極が形成された絶縁膜部分が他の絶縁膜部分に比して厚く形成されていることを特徴とする半導体装置。 - 前記基板がシリコン基板であり、該シリコン基板の厚みが0.6mm未満である、請求項1に記載の半導体装置。
- 前記外部電極が形成された絶縁膜部分の厚みが5μm以上であり、他の絶縁膜部分の厚みが5μm未満である、請求項2に記載の半導体装置。
- 前記外部電極の電極容量が0.1pF以下である、請求項1〜3の何れか一に記載の半導体装置。
- 半導体基板上に内部電極を形成する工程と、
前記内部電極上に第1の開口を有する第1の絶縁膜を、前記半導体基板上に形成する工程と、
前記第1の絶縁膜上に、前記第1の開口を介して内部電極に接続された電極配線を形成する工程と、
前記電極配線の周囲を覆うと共に、該電極配線上に第2の開口を有する第2の絶縁膜を、前記電極配線に対応して前記第1の絶縁膜上に形成する工程と、
前記第2の絶縁膜上に、前記第2の開口を介して前記電極配線に接続された外部電極を形成する工程とを有することを特徴とする半導体装置の製造方法。 - 前記外部電極の形成工程は、前記第1及び第2の絶縁膜上にシード金属層を形成する工程と、該シード金属層上に選択的にめっき層を形成する工程とを含む、請求項5に記載の半導体装置の製造方法。
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