JP2010002328A - 膜厚測定装置 - Google Patents
膜厚測定装置 Download PDFInfo
- Publication number
- JP2010002328A JP2010002328A JP2008162047A JP2008162047A JP2010002328A JP 2010002328 A JP2010002328 A JP 2010002328A JP 2008162047 A JP2008162047 A JP 2008162047A JP 2008162047 A JP2008162047 A JP 2008162047A JP 2010002328 A JP2010002328 A JP 2010002328A
- Authority
- JP
- Japan
- Prior art keywords
- film thickness
- layer
- wavelength
- measured
- unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
- G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
- H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Length Measuring Devices By Optical Means (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008162047A JP2010002328A (ja) | 2008-06-20 | 2008-06-20 | 膜厚測定装置 |
| TW098115659A TW201007116A (en) | 2008-06-20 | 2009-05-12 | Film thickness measuring apparatus |
| KR1020090054697A KR20090132538A (ko) | 2008-06-20 | 2009-06-19 | 막 두께 측정 장치 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008162047A JP2010002328A (ja) | 2008-06-20 | 2008-06-20 | 膜厚測定装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010002328A true JP2010002328A (ja) | 2010-01-07 |
| JP2010002328A5 JP2010002328A5 (https=) | 2011-06-23 |
Family
ID=41584175
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008162047A Pending JP2010002328A (ja) | 2008-06-20 | 2008-06-20 | 膜厚測定装置 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2010002328A (https=) |
| KR (1) | KR20090132538A (https=) |
| TW (1) | TW201007116A (https=) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010002327A (ja) * | 2008-06-20 | 2010-01-07 | Otsuka Denshi Co Ltd | 膜厚測定装置および膜厚測定方法 |
| JP2012021916A (ja) * | 2010-07-15 | 2012-02-02 | Disco Abrasive Syst Ltd | 厚み検出装置および研削機 |
| JP2022148122A (ja) * | 2021-03-24 | 2022-10-06 | 株式会社Screenホールディングス | 検査装置および検査方法 |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014052811A1 (en) | 2012-09-28 | 2014-04-03 | Rudolph Technologies, Inc. | Inspection of substrates using calibration and imaging |
| KR101326204B1 (ko) * | 2013-01-16 | 2013-11-08 | 에스엔유 프리시젼 주식회사 | 박막 두께 측정장치 및 방법 |
| TWI485383B (zh) * | 2013-01-21 | 2015-05-21 | Nat Univ Chung Cheng | 石墨烯薄膜層數檢測系統及檢測方法 |
| KR20150012509A (ko) | 2013-07-25 | 2015-02-04 | 삼성전자주식회사 | 피측정물의 두께를 측정하는 방법 및 장치 |
| JP6180909B2 (ja) * | 2013-12-06 | 2017-08-16 | 東京エレクトロン株式会社 | 距離を求める方法、静電チャックを除電する方法、及び、処理装置 |
| JP7103906B2 (ja) * | 2018-09-28 | 2022-07-20 | 株式会社ディスコ | 厚み計測装置 |
| JP6758736B1 (ja) * | 2020-04-08 | 2020-09-23 | 大塚電子株式会社 | 光学測定システムおよび光学測定方法 |
| CN114935313B (zh) * | 2022-04-26 | 2023-09-15 | 香港中文大学(深圳) | 薄膜厚度测量方法、装置、设备和计算机可读存储介质 |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6271804A (ja) * | 1985-09-26 | 1987-04-02 | Nippon Kogaku Kk <Nikon> | 膜厚測定装置 |
| JPS63193003A (ja) * | 1987-02-06 | 1988-08-10 | Japan Spectroscopic Co | 凹部深さ・膜厚測定装置 |
| JPS63222208A (ja) * | 1987-03-11 | 1988-09-16 | Japan Spectroscopic Co | 凹部深さ測定装置 |
| JPH0466806A (ja) * | 1990-07-09 | 1992-03-03 | Jasco Corp | 膜厚測定方法 |
| JPH074922A (ja) * | 1993-06-21 | 1995-01-10 | Jasco Corp | 半導体多層薄膜膜厚測定装置およびその測定方法 |
| JPH07190858A (ja) * | 1993-12-27 | 1995-07-28 | Nikon Corp | フーリエ変換分光器 |
| JPH07294220A (ja) * | 1994-04-27 | 1995-11-10 | Mitsubishi Chem Corp | 多層薄膜の膜厚検出方法および装置 |
| JPH109829A (ja) * | 1996-06-26 | 1998-01-16 | Matsushita Electric Ind Co Ltd | 多層薄膜の膜厚測定方法と、その方法を用いた光学情報記録媒体の製造方法及び光学情報記録媒体の製造装置 |
| JPH11118431A (ja) * | 1997-10-16 | 1999-04-30 | Jeol Ltd | Ft−irを用いた膜厚測定方法及び装置 |
| JP2001227916A (ja) * | 2000-02-17 | 2001-08-24 | Murata Mfg Co Ltd | 膜厚測定方法および干渉膜厚測定装置 |
| JP2002343842A (ja) * | 2001-03-12 | 2002-11-29 | Denso Corp | 半導体層の膜厚測定方法及び半導体基板の製造方法 |
| JP2006513418A (ja) * | 2003-01-11 | 2006-04-20 | エリップソ テクノロジー カンパニー リミテッド | 改善された高速フ−リエ変換を利用した膜厚の測定装置及び方法 |
| JP2008039789A (ja) * | 2003-06-20 | 2008-02-21 | Lg Electron Inc | 光ディスクの厚さ測定方法 |
-
2008
- 2008-06-20 JP JP2008162047A patent/JP2010002328A/ja active Pending
-
2009
- 2009-05-12 TW TW098115659A patent/TW201007116A/zh unknown
- 2009-06-19 KR KR1020090054697A patent/KR20090132538A/ko not_active Withdrawn
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6271804A (ja) * | 1985-09-26 | 1987-04-02 | Nippon Kogaku Kk <Nikon> | 膜厚測定装置 |
| JPS63193003A (ja) * | 1987-02-06 | 1988-08-10 | Japan Spectroscopic Co | 凹部深さ・膜厚測定装置 |
| JPS63222208A (ja) * | 1987-03-11 | 1988-09-16 | Japan Spectroscopic Co | 凹部深さ測定装置 |
| JPH0466806A (ja) * | 1990-07-09 | 1992-03-03 | Jasco Corp | 膜厚測定方法 |
| JPH074922A (ja) * | 1993-06-21 | 1995-01-10 | Jasco Corp | 半導体多層薄膜膜厚測定装置およびその測定方法 |
| JPH07190858A (ja) * | 1993-12-27 | 1995-07-28 | Nikon Corp | フーリエ変換分光器 |
| JPH07294220A (ja) * | 1994-04-27 | 1995-11-10 | Mitsubishi Chem Corp | 多層薄膜の膜厚検出方法および装置 |
| JPH109829A (ja) * | 1996-06-26 | 1998-01-16 | Matsushita Electric Ind Co Ltd | 多層薄膜の膜厚測定方法と、その方法を用いた光学情報記録媒体の製造方法及び光学情報記録媒体の製造装置 |
| JPH11118431A (ja) * | 1997-10-16 | 1999-04-30 | Jeol Ltd | Ft−irを用いた膜厚測定方法及び装置 |
| JP2001227916A (ja) * | 2000-02-17 | 2001-08-24 | Murata Mfg Co Ltd | 膜厚測定方法および干渉膜厚測定装置 |
| JP2002343842A (ja) * | 2001-03-12 | 2002-11-29 | Denso Corp | 半導体層の膜厚測定方法及び半導体基板の製造方法 |
| JP2006513418A (ja) * | 2003-01-11 | 2006-04-20 | エリップソ テクノロジー カンパニー リミテッド | 改善された高速フ−リエ変換を利用した膜厚の測定装置及び方法 |
| JP2008039789A (ja) * | 2003-06-20 | 2008-02-21 | Lg Electron Inc | 光ディスクの厚さ測定方法 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010002327A (ja) * | 2008-06-20 | 2010-01-07 | Otsuka Denshi Co Ltd | 膜厚測定装置および膜厚測定方法 |
| JP2012021916A (ja) * | 2010-07-15 | 2012-02-02 | Disco Abrasive Syst Ltd | 厚み検出装置および研削機 |
| JP2022148122A (ja) * | 2021-03-24 | 2022-10-06 | 株式会社Screenホールディングス | 検査装置および検査方法 |
| JP7705723B2 (ja) | 2021-03-24 | 2025-07-10 | 株式会社Screenホールディングス | 検査装置および検査方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201007116A (en) | 2010-02-16 |
| KR20090132538A (ko) | 2009-12-30 |
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