TW201007116A - Film thickness measuring apparatus - Google Patents

Film thickness measuring apparatus Download PDF

Info

Publication number
TW201007116A
TW201007116A TW098115659A TW98115659A TW201007116A TW 201007116 A TW201007116 A TW 201007116A TW 098115659 A TW098115659 A TW 098115659A TW 98115659 A TW98115659 A TW 98115659A TW 201007116 A TW201007116 A TW 201007116A
Authority
TW
Taiwan
Prior art keywords
film thickness
layer
wavelength
light
tested
Prior art date
Application number
TW098115659A
Other languages
English (en)
Chinese (zh)
Inventor
Tadayoshi Fujimori
Yoshimi Sawamura
Original Assignee
Otsuka Denshi Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Otsuka Denshi Kk filed Critical Otsuka Denshi Kk
Publication of TW201007116A publication Critical patent/TW201007116A/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
TW098115659A 2008-06-20 2009-05-12 Film thickness measuring apparatus TW201007116A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008162047A JP2010002328A (ja) 2008-06-20 2008-06-20 膜厚測定装置

Publications (1)

Publication Number Publication Date
TW201007116A true TW201007116A (en) 2010-02-16

Family

ID=41584175

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098115659A TW201007116A (en) 2008-06-20 2009-05-12 Film thickness measuring apparatus

Country Status (3)

Country Link
JP (1) JP2010002328A (https=)
KR (1) KR20090132538A (https=)
TW (1) TW201007116A (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI454654B (zh) * 2008-06-20 2014-10-01 Otsuka Denshi Kk Film thickness measuring device and method for measuring film thickness
TWI485383B (zh) * 2013-01-21 2015-05-21 Nat Univ Chung Cheng 石墨烯薄膜層數檢測系統及檢測方法
US9664625B2 (en) 2012-09-28 2017-05-30 Rudolph Technologies, Inc. Inspection of substrates using calibration and imaging
TWI830782B (zh) * 2018-09-28 2024-02-01 日商迪思科股份有限公司 厚度測量裝置
TWI861386B (zh) * 2020-04-08 2024-11-11 日商大塚電子股份有限公司 光學測定系統及光學測定方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012021916A (ja) * 2010-07-15 2012-02-02 Disco Abrasive Syst Ltd 厚み検出装置および研削機
KR101326204B1 (ko) * 2013-01-16 2013-11-08 에스엔유 프리시젼 주식회사 박막 두께 측정장치 및 방법
KR20150012509A (ko) 2013-07-25 2015-02-04 삼성전자주식회사 피측정물의 두께를 측정하는 방법 및 장치
JP6180909B2 (ja) * 2013-12-06 2017-08-16 東京エレクトロン株式会社 距離を求める方法、静電チャックを除電する方法、及び、処理装置
JP7705723B2 (ja) * 2021-03-24 2025-07-10 株式会社Ｓｃｒｅｅｎホールディングス 検査装置および検査方法
CN114935313B (zh) * 2022-04-26 2023-09-15 香港中文大学（深圳） 薄膜厚度测量方法、装置、设备和计算机可读存储介质

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6271804A (ja) * 1985-09-26 1987-04-02 Nippon Kogaku Kk <Nikon> 膜厚測定装置
JP2533514B2 (ja) * 1987-02-06 1996-09-11 日本分光株式会社 凹部深さ・膜厚測定装置
JPS63222208A (ja) * 1987-03-11 1988-09-16 Japan Spectroscopic Co 凹部深さ測定装置
JP2539283B2 (ja) * 1990-07-09 1996-10-02 日本分光工業株式会社 膜厚測定方法
JPH074922A (ja) * 1993-06-21 1995-01-10 Jasco Corp 半導体多層薄膜膜厚測定装置およびその測定方法
JPH07190858A (ja) * 1993-12-27 1995-07-28 Nikon Corp フーリエ変換分光器
JPH07294220A (ja) * 1994-04-27 1995-11-10 Mitsubishi Chem Corp 多層薄膜の膜厚検出方法および装置
JP3732894B2 (ja) * 1996-06-26 2006-01-11 松下電器産業株式会社 多層薄膜の膜厚測定方法と、その方法を用いた光学情報記録媒体の製造方法及び光学情報記録媒体の製造装置
JPH11118431A (ja) * 1997-10-16 1999-04-30 Jeol Ltd Ｆｔ−ｉｒを用いた膜厚測定方法及び装置
JP2001227916A (ja) * 2000-02-17 2001-08-24 Murata Mfg Co Ltd 膜厚測定方法および干渉膜厚測定装置
JP3946470B2 (ja) * 2001-03-12 2007-07-18 株式会社デンソー 半導体層の膜厚測定方法及び半導体基板の製造方法
KR100393522B1 (en) * 2003-01-11 2003-08-02 Ellipso Technology Co Ltd Device and method for measuring film thickness, making use of improved fast fourier transformation
KR100947228B1 (ko) * 2003-06-20 2010-03-11 엘지전자 주식회사 광디스크의 두께 측정 방법

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI454654B (zh) * 2008-06-20 2014-10-01 Otsuka Denshi Kk Film thickness measuring device and method for measuring film thickness
US9664625B2 (en) 2012-09-28 2017-05-30 Rudolph Technologies, Inc. Inspection of substrates using calibration and imaging
TWI485383B (zh) * 2013-01-21 2015-05-21 Nat Univ Chung Cheng 石墨烯薄膜層數檢測系統及檢測方法
TWI830782B (zh) * 2018-09-28 2024-02-01 日商迪思科股份有限公司 厚度測量裝置
TWI861386B (zh) * 2020-04-08 2024-11-11 日商大塚電子股份有限公司 光學測定系統及光學測定方法

Also Published As

Publication number Publication date
JP2010002328A (ja) 2010-01-07
KR20090132538A (ko) 2009-12-30

Similar Documents

Publication Publication Date Title
TW201007116A (en) Film thickness measuring apparatus
TWI454654B (zh) Film thickness measuring device and method for measuring film thickness
TW201315964A (zh) 膜厚量測裝置
KR101841776B1 (ko) 광학 특성 측정 장치 및 광학 특성 측정 방법
EP3026422B1 (en) An apparatus and a method for spectroscopic ellipsometry, in particular infrared spectroscopic ellipsometry
US10041838B2 (en) Optical critical dimension metrology
JP4834847B2 (ja) 多層膜解析装置および多層膜解析方法
CN109786277B (zh) 对薄膜进行计量分析的装置及方法与获得薄膜性质的方法
TW201011275A (en) Apparatus for scanning hyper-spectral image and method thereof
US8547555B1 (en) Spectrometer with built-in ATR and accessory compartment
CN119984090A (zh) 一种自聚焦型晶圆三维形貌精密检测装置及方法
US20070279635A1 (en) Measuring apparatus and method using surface plasmon resonance
CN103845039B (zh) 用于频域oct系统的光谱仪
CN203828901U (zh) 用于频域oct系统的光谱仪
CN117288107A (zh) 晶圆群折射率与几何厚度同步测量装置及方法
JP5028660B2 (ja) 光学特性測定装置および光学特性測定方法
TW202111292A (zh) 用於測量基於玻璃的樣品的基於應力的特徵的系統和方法
RU2573617C1 (ru) Инфракрасный амплитудно-фазовый плазмонный спектрометр
Cocco et al. From Soft to Hard X‐ray with a Single Grating Monochromator
TW569008B (en) A Multifunctional opto-electronic biochip system
US11513073B2 (en) Apparatus and methods for selective detection of pathogens and/or chemicals
Chen et al. Study of biological reaction in cancer cell with spectroscopic imaging ellipsometry
Vandezande et al. Generalized fiber-optic surface-plasmon-resonance modeling through ray-tracing
Kumar et al. Light focusing by chirped waveguide grating coupler
Kohlhaas et al. Computing focused beam transmissions of photonic crystals using angular spectrum field synthesis