JP2009543931A - 金属組成物、熱画像形成ドナーおよびそれらから得られたパターン化多層組成物 - Google Patents
金属組成物、熱画像形成ドナーおよびそれらから得られたパターン化多層組成物 Download PDFInfo
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- JP2009543931A JP2009543931A JP2009520785A JP2009520785A JP2009543931A JP 2009543931 A JP2009543931 A JP 2009543931A JP 2009520785 A JP2009520785 A JP 2009520785A JP 2009520785 A JP2009520785 A JP 2009520785A JP 2009543931 A JP2009543931 A JP 2009543931A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
- B41M5/382—Contact thermal transfer or sublimation processes
- B41M5/38207—Contact thermal transfer or sublimation processes characterised by aspects not provided for in groups B41M5/385 - B41M5/395
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
- B41M3/006—Patterns of chemical products used for a specific purpose, e.g. pesticides, perfumes, adhesive patterns; use of microencapsulated material; Printing on smoking articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
- B41M5/382—Contact thermal transfer or sublimation processes
- B41M5/392—Additives, other than colour forming substances, dyes or pigments, e.g. sensitisers, transfer promoting agents
- B41M5/395—Macromolecular additives, e.g. binders
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/18—Deposition of organic active material using non-liquid printing techniques, e.g. thermal transfer printing from a donor sheet
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M2205/00—Printing methods or features related to printing methods; Location or type of the layers
- B41M2205/02—Dye diffusion thermal transfer printing (D2T2)
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M2205/00—Printing methods or features related to printing methods; Location or type of the layers
- B41M2205/08—Ablative thermal transfer, i.e. the exposed transfer medium is propelled from the donor to a receptor by generation of a gas
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M2205/00—Printing methods or features related to printing methods; Location or type of the layers
- B41M2205/38—Intermediate layers; Layers between substrate and imaging layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
- B41M5/382—Contact thermal transfer or sublimation processes
- B41M5/385—Contact thermal transfer or sublimation processes characterised by the transferable dyes or pigments
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
- B41M5/40—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used characterised by the base backcoat, intermediate, or covering layers, e.g. for thermal transfer dye-donor or dye-receiver sheets; Heat, radiation filtering or absorbing means or layers; combined with other image registration layers or compositions; Special originals for reproduction by thermography
- B41M5/41—Base layers supports or substrates
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
- B41M5/40—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used characterised by the base backcoat, intermediate, or covering layers, e.g. for thermal transfer dye-donor or dye-receiver sheets; Heat, radiation filtering or absorbing means or layers; combined with other image registration layers or compositions; Special originals for reproduction by thermography
- B41M5/42—Intermediate, backcoat, or covering layers
- B41M5/44—Intermediate, backcoat, or covering layers characterised by the macromolecular compounds
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
- B41M5/40—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used characterised by the base backcoat, intermediate, or covering layers, e.g. for thermal transfer dye-donor or dye-receiver sheets; Heat, radiation filtering or absorbing means or layers; combined with other image registration layers or compositions; Special originals for reproduction by thermography
- B41M5/46—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used characterised by the base backcoat, intermediate, or covering layers, e.g. for thermal transfer dye-donor or dye-receiver sheets; Heat, radiation filtering or absorbing means or layers; combined with other image registration layers or compositions; Special originals for reproduction by thermography characterised by the light-to-heat converting means; characterised by the heat or radiation filtering or absorbing means or layers
- B41M5/465—Infrared radiation-absorbing materials, e.g. dyes, metals, silicates, C black
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0329—Intrinsically conductive polymer [ICP]; Semiconductive polymer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
- H10K85/113—Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24893—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including particulate material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24893—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including particulate material
- Y10T428/24909—Free metal or mineral containing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Dispersion Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Pest Control & Pesticides (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials Engineering (AREA)
- Laminated Bodies (AREA)
- Thermal Transfer Or Thermal Recording In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/488,247 US7582403B2 (en) | 2006-07-17 | 2006-07-17 | Metal compositions, thermal imaging donors and patterned multilayer compositions derived therefrom |
| PCT/US2007/016111 WO2008010978A2 (en) | 2006-07-17 | 2007-07-16 | Metal compositions, thermal imaging donors and patterned multilayer compositions derived therefrom |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009543931A true JP2009543931A (ja) | 2009-12-10 |
| JP2009543931A5 JP2009543931A5 (enExample) | 2010-09-02 |
Family
ID=38769913
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009520785A Pending JP2009543931A (ja) | 2006-07-17 | 2007-07-16 | 金属組成物、熱画像形成ドナーおよびそれらから得られたパターン化多層組成物 |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US7582403B2 (enExample) |
| EP (1) | EP2042006A2 (enExample) |
| JP (1) | JP2009543931A (enExample) |
| KR (1) | KR20090029291A (enExample) |
| CN (1) | CN101569245B (enExample) |
| WO (1) | WO2008010978A2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015129546A1 (ja) * | 2014-02-25 | 2015-09-03 | 住友ベークライト株式会社 | 電磁波シールドフィルム、フレキシブルプリント基板、電子部品搭載基板、及び電子部品の被覆方法 |
Families Citing this family (60)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8062824B2 (en) * | 2006-07-17 | 2011-11-22 | E. I. Du Pont De Nemours And Company | Thermally imageable dielectric layers, thermal transfer donors and receivers |
| US8659158B2 (en) | 2006-08-16 | 2014-02-25 | Funai Electric Co., Ltd. | Thermally inkjettable acrylic dielectric ink formulation and process |
| DE102006062269A1 (de) * | 2006-12-22 | 2008-06-26 | Eckart Gmbh & Co. Kg | Verwendung von sphärischen Metallpartikeln als Lasermarkierungs- oder Laserschweißbarkeitsmittel sowie lasermarkierbarer und/oder laserschweißbarer Kunststoff |
| US20100035377A1 (en) * | 2006-12-22 | 2010-02-11 | Cbrite Inc. | Transfer Coating Method |
| CN101848675B (zh) * | 2007-09-25 | 2013-06-05 | 日本光电工业株式会社 | 电极片和电极片的制造方法 |
| DE102008019091A1 (de) * | 2008-04-16 | 2009-10-29 | Bmdsys Gmbh | Kryostat und biomagnetisches Messsystem mit Hochfrequenzabschirmung |
| US8182633B2 (en) * | 2008-04-29 | 2012-05-22 | Samsung Electronics Co., Ltd. | Method of fabricating a flexible display device |
| US8247033B2 (en) | 2008-09-19 | 2012-08-21 | The University Of Massachusetts | Self-assembly of block copolymers on topographically patterned polymeric substrates |
| US8518837B2 (en) * | 2008-09-25 | 2013-08-27 | The University Of Massachusetts | Method of producing nanopatterned articles using surface-reconstructed block copolymer films |
| US9244568B2 (en) * | 2008-11-15 | 2016-01-26 | Atmel Corporation | Touch screen sensor |
| KR101078079B1 (ko) * | 2008-12-10 | 2011-10-28 | 엘에스전선 주식회사 | 은 수식 탄소 나노튜브 함유 전도성 페이스트 조성물 |
| WO2010095652A1 (ja) * | 2009-02-17 | 2010-08-26 | 綜研化学株式会社 | 複合導電性高分子組成物、その製法、当該組成物を含有する溶液、および当該組成物の用途 |
| KR101295763B1 (ko) * | 2009-02-17 | 2013-08-12 | 소켄 케미칼 앤드 엔지니어링 캄파니, 리미티드 | 복합 전기 전도성 폴리머 조성물, 이의 제조 방법, 이를 함유하는 용액, 및 이의 용도 |
| WO2010095649A1 (ja) * | 2009-02-17 | 2010-08-26 | 綜研化学株式会社 | 複合導電性ポリマー組成物、その製造法、当該組成物を含有する溶液、および当該組成物の用途 |
| WO2010095651A1 (ja) * | 2009-02-17 | 2010-08-26 | 綜研化学株式会社 | 複合導電性高分子組成物、その製造法、当該組成物を含有する溶液、および当該組成物の用途 |
| WO2010095650A1 (ja) * | 2009-02-17 | 2010-08-26 | 綜研化学株式会社 | 複合導電性高分子組成物、その製造方法、当該組成物を含有する溶液、および当該組成物の用途 |
| KR100946598B1 (ko) * | 2009-04-24 | 2010-03-09 | 주식회사 엘파니 | 플라스마 처리를 이용한 전도성 고분자용 고체 도판트, 그의 제조 방법 및 장치, 및 전도성 고분자의 고상 도핑 방법 |
| US8377523B2 (en) * | 2009-06-29 | 2013-02-19 | Jin Wu | Intermediate transfer members |
| EP2452982B1 (en) * | 2009-07-08 | 2018-02-28 | Soken Chemical & Engineering Co., Ltd. | Electrically conductive polymer composition and method for producing same |
| JP5417630B2 (ja) * | 2009-07-08 | 2014-02-19 | 綜研化学株式会社 | 固体電解質用組成物およびそれを用いた太陽電池 |
| US20110291032A1 (en) * | 2010-05-27 | 2011-12-01 | Industrial Technology Research Institute | Electromagnetic shielding composition, electromagnetic shielding device, anti-electrostatic device and method of manufacturing electromagnetic shielding structure |
| GB201013112D0 (en) * | 2010-08-04 | 2010-09-22 | Element Six Ltd | A diamond optical element |
| CN101976591B (zh) * | 2010-08-31 | 2012-07-25 | 中国乐凯胶片集团公司 | 一种透明导电膜 |
| SG189854A1 (en) | 2010-10-07 | 2013-06-28 | Denki Kagaku Kogyo Kk | Electronic component packaging sheet, and formed article thereof |
| MY160899A (en) | 2010-10-07 | 2017-03-31 | Denki Kagaku Kogyo Kk | Styrene resin composition, and molded article thereof |
| CN102465259A (zh) * | 2010-11-11 | 2012-05-23 | 鸿富锦精密工业(深圳)有限公司 | 塑料表面电磁屏蔽处理方法及其制品 |
| KR101734555B1 (ko) * | 2011-01-03 | 2017-05-11 | 엘지이노텍 주식회사 | 터치 패널의 제조 방법 |
| FR2971068B1 (fr) * | 2011-01-31 | 2013-09-27 | Stantum | Capteur tactile multicontacts a couche intermédiaire résistive |
| US9156682B2 (en) | 2011-05-25 | 2015-10-13 | The University Of Massachusetts | Method of forming oriented block copolymer line patterns, block copolymer line patterns formed thereby, and their use to form patterned articles |
| JP5782855B2 (ja) * | 2011-06-17 | 2015-09-24 | コニカミノルタ株式会社 | 透明電極及び有機エレクトロルミネッセンス素子 |
| US8969244B2 (en) | 2012-09-13 | 2015-03-03 | Kodak Alaris Inc. | Metallized thermal dye image receiver elements and imaging |
| WO2014088383A1 (fr) * | 2012-12-05 | 2014-06-12 | Universite Hassan Ii-Mohammedia | Procede d'elaboration de nanoparticules metalliques dans une emulsion acqueuse de latex sous l'effet d'irradiation micro-ondes |
| ITTO20130087A1 (it) * | 2013-02-04 | 2013-05-06 | K4B S R L | Procedimento di marchiatura laser e realizzazione di connessioni elettriche / elettroniche per superfici trasparenti |
| KR20140140188A (ko) * | 2013-05-28 | 2014-12-09 | 삼성디스플레이 주식회사 | 도너기판 및 이의 제조방법 및 이를 이용한 전사패턴 형성방법 |
| CN103559957B (zh) * | 2013-09-22 | 2016-11-23 | 江苏瑞德新能源科技有限公司 | 一种正银浆料的制备方法 |
| CN103995619A (zh) * | 2014-06-13 | 2014-08-20 | 郑州巨顺佳电子科技有限公司 | 无边框触摸屏感应片及其制备方法 |
| US9607726B2 (en) * | 2015-01-30 | 2017-03-28 | Xerox Corporation | Composition comprising silver nanowires |
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Also Published As
| Publication number | Publication date |
|---|---|
| US7901596B2 (en) | 2011-03-08 |
| CN101569245A (zh) | 2009-10-28 |
| US8440383B2 (en) | 2013-05-14 |
| US20080014528A1 (en) | 2008-01-17 |
| WO2008010978A2 (en) | 2008-01-24 |
| CN101569245B (zh) | 2012-01-11 |
| WO2008010978A3 (en) | 2008-10-30 |
| EP2042006A2 (en) | 2009-04-01 |
| US20090297739A1 (en) | 2009-12-03 |
| US7582403B2 (en) | 2009-09-01 |
| KR20090029291A (ko) | 2009-03-20 |
| US20110151214A1 (en) | 2011-06-23 |
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