JP2009540060A - 流動性接着剤組成物を用いた結着方法 - Google Patents

流動性接着剤組成物を用いた結着方法 Download PDF

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Publication number
JP2009540060A
JP2009540060A JP2009514449A JP2009514449A JP2009540060A JP 2009540060 A JP2009540060 A JP 2009540060A JP 2009514449 A JP2009514449 A JP 2009514449A JP 2009514449 A JP2009514449 A JP 2009514449A JP 2009540060 A JP2009540060 A JP 2009540060A
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Japan
Prior art keywords
adhesive composition
water
silica nanoparticles
article
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009514449A
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English (en)
Japanese (ja)
Other versions
JP2009540060A5 (enExample
Inventor
エイチ． ベアー，アンドリュー
ピュン，ユーミ
エー． ラッセル，ビクトリア
ジェイ． シュルツ，ウィリアム
エル． スミス，テリー
エル． トンプソン，ウェンディ
ジェイ． ズナメロスキ，スティーブン
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3M Innovative Properties Co
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3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2009540060A publication Critical patent/JP2009540060A/ja
Publication of JP2009540060A5 publication Critical patent/JP2009540060A5/ja
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F292/00—Macromolecular compounds obtained by polymerising monomers on to inorganic materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J1/00—Adhesives based on inorganic constituents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J151/10—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to inorganic materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/18, H10D48/04 and H10D48/07, with or without impurities, e.g. doping materials
    • H01L21/44—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/38 - H01L21/428
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Mechanical Coupling Of Light Guides (AREA)
JP2009514449A 2006-06-09 2007-05-11 流動性接着剤組成物を用いた結着方法 Pending JP2009540060A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/423,191 US7491287B2 (en) 2006-06-09 2006-06-09 Bonding method with flowable adhesive composition
PCT/US2007/068762 WO2007146521A1 (en) 2006-06-09 2007-05-11 Bonding method with flowable adhesive composition

Publications (2)

Publication Number Publication Date
JP2009540060A true JP2009540060A (ja) 2009-11-19
JP2009540060A5 JP2009540060A5 (enExample) 2010-06-03

Family

ID=38832092

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009514449A Pending JP2009540060A (ja) 2006-06-09 2007-05-11 流動性接着剤組成物を用いた結着方法

Country Status (6)

Country Link
US (1) US7491287B2 (enExample)
EP (1) EP2029685B1 (enExample)
JP (1) JP2009540060A (enExample)
KR (1) KR20090018100A (enExample)
CN (1) CN101466807B (enExample)
WO (1) WO2007146521A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102965063A (zh) * 2012-11-25 2013-03-13 广东普赛特电子科技股份有限公司 一种纳米改性红胶及其制备方法
JP2014529646A (ja) * 2011-09-07 2014-11-13 ティーピーケイ タッチ ソリューションズ（シアメン）インコーポレーテッド 導光性液状接着剤及びこれを用いたタッチセンシティブディスプレイ
JP2019532165A (ja) * 2016-09-14 2019-11-07 スリーエム イノベイティブ プロパティズ カンパニー 速硬化性光学接着剤

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US20080303129A1 (en) * 2007-06-11 2008-12-11 Wang Qing Ya Michael Patterned contact sheet to protect critical surfaces in manufacturing processes
WO2009025041A1 (ja) * 2007-08-22 2009-02-26 The Furukawa Electric Co., Ltd. 光ファイバリボン芯線
US11235565B2 (en) 2008-04-07 2022-02-01 Valinge Innovation Ab Wood fibre based panels with a thin surface layer
WO2009152296A1 (en) * 2008-06-12 2009-12-17 3M Innovative Properties Company End-capped curable resin sols
JP5399512B2 (ja) * 2008-12-18 2014-01-29 ダウ グローバル テクノロジーズ エルエルシー 固体塩をエポキシ樹脂溶液から分離する方法
US20130034713A1 (en) * 2009-12-17 2013-02-07 Busman Stanley C Display panel assembly and methods of making same
NZ600492A (en) 2010-01-15 2014-06-27 Valinge Innovation Ab Bright colored surface layer
JP5809241B2 (ja) * 2010-04-20 2015-11-10 スリーエム イノベイティブ プロパティズ カンパニー ポリマー表面修飾ナノ粒子を含有する感圧接着剤
US9512264B2 (en) * 2010-12-13 2016-12-06 3M Innovative Properties Company Dry, surface-modified nanocalcite
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RU2608416C2 (ru) 2011-08-26 2017-01-18 Сералок Инновейшн Аб Способ изготовления многослойного изделия и панель пола
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JP5938514B2 (ja) * 2012-03-12 2016-06-22 エルジー・ケム・リミテッド 粘着剤組成物
KR101479813B1 (ko) 2012-04-10 2015-01-06 (주)엘지하우시스 반경화 감압 점착필름
UA118967C2 (uk) 2013-07-02 2019-04-10 Велінге Інновейшн Аб Спосіб виготовлення будівельної панелі і будівельна панель
US9512336B2 (en) * 2013-10-04 2016-12-06 Cytec Industries Inc. Aqueous primer composition for enhanced film formation and method of using the same
TWI526505B (zh) 2014-09-11 2016-03-21 財團法人工業技術研究院 硬塗層組成物及應用其之偏光膜和顯示器
WO2020145871A1 (en) * 2019-01-10 2020-07-16 Välinge Innovation AB A method of manufacturing a building element and a building element
CN115175809A (zh) * 2020-02-26 2022-10-11 康宁股份有限公司 采用聚电解质多层的具有大粗糙度的基材临时性粘结
CN113088094B (zh) * 2021-02-23 2022-04-19 上杭鑫昌龙实业有限公司 一种高压电气绝缘填充膏及其制备方法和应用
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CN101466807B (zh) 2012-10-03
EP2029685A4 (en) 2014-05-28
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US20070295446A1 (en) 2007-12-27
CN101466807A (zh) 2009-06-24

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