CN101466807B - 使用流动性粘合剂组合物的粘结方法 - Google Patents

使用流动性粘合剂组合物的粘结方法 Download PDF

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Publication number
CN101466807B
CN101466807B CN2007800214333A CN200780021433A CN101466807B CN 101466807 B CN101466807 B CN 101466807B CN 2007800214333 A CN2007800214333 A CN 2007800214333A CN 200780021433 A CN200780021433 A CN 200780021433A CN 101466807 B CN101466807 B CN 101466807B
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adhesive composition
water
silica nanoparticles
article
weight
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CN101466807A (zh
Inventor
安德鲁·H·贝尔
卞裕美
维多利亚·A·拉塞尔
威廉·J·舒策
特里·L·史密斯
温迪·L·汤普森
斯蒂芬·J·兹纳梅罗斯基
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3M Innovative Properties Co
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3M Innovative Properties Co
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F292/00—Macromolecular compounds obtained by polymerising monomers on to inorganic materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J1/00—Adhesives based on inorganic constituents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J151/10—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to inorganic materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/18, H10D48/04 and H10D48/07, with or without impurities, e.g. doping materials
    • H01L21/44—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/38 - H01L21/428
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Mechanical Coupling Of Light Guides (AREA)
CN2007800214333A 2006-06-09 2007-05-11 使用流动性粘合剂组合物的粘结方法 Active CN101466807B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/423,191 2006-06-09
US11/423,191 US7491287B2 (en) 2006-06-09 2006-06-09 Bonding method with flowable adhesive composition
PCT/US2007/068762 WO2007146521A1 (en) 2006-06-09 2007-05-11 Bonding method with flowable adhesive composition

Publications (2)

Publication Number Publication Date
CN101466807A CN101466807A (zh) 2009-06-24
CN101466807B true CN101466807B (zh) 2012-10-03

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Family Applications (1)

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CN2007800214333A Active CN101466807B (zh) 2006-06-09 2007-05-11 使用流动性粘合剂组合物的粘结方法

Country Status (6)

Country Link
US (1) US7491287B2 (enExample)
EP (1) EP2029685B1 (enExample)
JP (1) JP2009540060A (enExample)
KR (1) KR20090018100A (enExample)
CN (1) CN101466807B (enExample)
WO (1) WO2007146521A1 (enExample)

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WO2009025041A1 (ja) * 2007-08-22 2009-02-26 The Furukawa Electric Co., Ltd. 光ファイバリボン芯線
US11235565B2 (en) 2008-04-07 2022-02-01 Valinge Innovation Ab Wood fibre based panels with a thin surface layer
WO2009152296A1 (en) * 2008-06-12 2009-12-17 3M Innovative Properties Company End-capped curable resin sols
JP5399512B2 (ja) * 2008-12-18 2014-01-29 ダウ グローバル テクノロジーズ エルエルシー 固体塩をエポキシ樹脂溶液から分離する方法
US20130034713A1 (en) * 2009-12-17 2013-02-07 Busman Stanley C Display panel assembly and methods of making same
NZ600492A (en) 2010-01-15 2014-06-27 Valinge Innovation Ab Bright colored surface layer
JP5809241B2 (ja) * 2010-04-20 2015-11-10 スリーエム イノベイティブ プロパティズ カンパニー ポリマー表面修飾ナノ粒子を含有する感圧接着剤
US9512264B2 (en) * 2010-12-13 2016-12-06 3M Innovative Properties Company Dry, surface-modified nanocalcite
CN103459165B (zh) 2011-04-12 2017-02-15 瓦林格创新股份有限公司 生产层的方法
DE102011075401A1 (de) * 2011-05-06 2012-05-03 Carl Zeiss Jena Gmbh Klebstoff mit nanoskaligen füllstoffen
RU2608416C2 (ru) 2011-08-26 2017-01-18 Сералок Инновейшн Аб Способ изготовления многослойного изделия и панель пола
CN102977806B (zh) * 2011-09-07 2016-01-20 宸鸿科技(厦门)有限公司 导光液态胶及其应用之触控显示设备
EP2817375A4 (en) * 2012-02-21 2015-08-05 Kegel Llc VOC-FREE, LOW VISCOSIS, LED-CURABLE COATING AND METHOD OF USE
JP5938514B2 (ja) * 2012-03-12 2016-06-22 エルジー・ケム・リミテッド 粘着剤組成物
KR101479813B1 (ko) 2012-04-10 2015-01-06 (주)엘지하우시스 반경화 감압 점착필름
CN102965063A (zh) * 2012-11-25 2013-03-13 广东普赛特电子科技股份有限公司 一种纳米改性红胶及其制备方法
UA118967C2 (uk) 2013-07-02 2019-04-10 Велінге Інновейшн Аб Спосіб виготовлення будівельної панелі і будівельна панель
US9512336B2 (en) * 2013-10-04 2016-12-06 Cytec Industries Inc. Aqueous primer composition for enhanced film formation and method of using the same
TWI526505B (zh) 2014-09-11 2016-03-21 財團法人工業技術研究院 硬塗層組成物及應用其之偏光膜和顯示器
US10329460B2 (en) * 2016-09-14 2019-06-25 3M Innovative Properties Company Fast curing optical adhesive
WO2020145871A1 (en) * 2019-01-10 2020-07-16 Välinge Innovation AB A method of manufacturing a building element and a building element
CN115175809A (zh) * 2020-02-26 2022-10-11 康宁股份有限公司 采用聚电解质多层的具有大粗糙度的基材临时性粘结
CN113088094B (zh) * 2021-02-23 2022-04-19 上杭鑫昌龙实业有限公司 一种高压电气绝缘填充膏及其制备方法和应用
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US7491287B2 (en) 2009-02-17
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US20070295446A1 (en) 2007-12-27
CN101466807A (zh) 2009-06-24

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