JP2009538739A - 特にはんだ接続に用いられる熱処理方法及び熱処理装置 - Google Patents
特にはんだ接続に用いられる熱処理方法及び熱処理装置 Download PDFInfo
- Publication number
- JP2009538739A JP2009538739A JP2009512402A JP2009512402A JP2009538739A JP 2009538739 A JP2009538739 A JP 2009538739A JP 2009512402 A JP2009512402 A JP 2009512402A JP 2009512402 A JP2009512402 A JP 2009512402A JP 2009538739 A JP2009538739 A JP 2009538739A
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- Prior art keywords
- heating
- cooling
- solder material
- chamber
- heat treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 84
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 41
- 238000000034 method Methods 0.000 title claims abstract description 31
- 238000001816 cooling Methods 0.000 claims abstract description 70
- 239000000463 material Substances 0.000 claims abstract description 38
- 238000005192 partition Methods 0.000 claims description 22
- 230000001681 protective effect Effects 0.000 claims description 4
- 238000003672 processing method Methods 0.000 claims 1
- 238000009833 condensation Methods 0.000 abstract description 6
- 230000005494 condensation Effects 0.000 abstract description 6
- 238000002844 melting Methods 0.000 abstract description 3
- 230000008018 melting Effects 0.000 abstract description 3
- 238000002955 isolation Methods 0.000 description 20
- 238000005476 soldering Methods 0.000 description 17
- 239000000758 substrate Substances 0.000 description 15
- 230000000694 effects Effects 0.000 description 9
- 230000008021 deposition Effects 0.000 description 8
- 239000007789 gas Substances 0.000 description 8
- 238000004140 cleaning Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000137 annealing Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000005496 tempering Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/085—Cooling, heat sink or heat shielding means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
- F27B9/14—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity characterised by the path of the charge during treatment; characterised by the means by which the charge is moved during treatment
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D1/00—Casings; Linings; Walls; Roofs
- F27D1/18—Door frames; Doors, lids, removable covers
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Physical Vapour Deposition (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Furnace Charging Or Discharging (AREA)
- Furnace Details (AREA)
Abstract
【選択図】図1
Description
Claims (16)
- 加工物又は部品の温度処理方法、特に、はんだ材料搬送台上に配されたはんだ材料を溶融して、このはんだ材料と、はんだ材料搬送台として用いる少なくとも一つの部品又は加工物とをはんだ接続する方法であって、少なくとも1つの部品の加熱処理と引き続き行われる冷却処理を周囲のエリアから封止された処理室内で行う方法において、
凝縮装置(15)によって互いに隔離可能な処理室(12)の2つの室内領域(13,14)内で部品(19)の加熱及び冷却を行うことを特徴とする方法。 - 加熱装置(20)を用いてほぼ一定の温度で加熱処理し、冷却装置(25)を用いてほぼ一定の温度で冷却処理することを特徴とする請求項1に記載の方法。
- 前記はんだ材料搬送台(19)を加熱する前に、室内領域(13,14)を互いに隔離するために、前記凝縮装置(15)を供給位置から、前記両室内領域を互いに隔離する隔壁位置にずらすことを特徴とする請求項1又は2に記載の方法。
- 前記凝縮装置(15)は、少なくとも前記供給位置にある間に冷却されることを特徴とする請求項3に記載の方法。
- 前記凝縮装置(15)によって冷却室内領域(14)から隔離された加熱処理領域(13)内で前記はんだ材料搬送台(19)を加熱する間に、前記加熱室内領域を真空化することを特徴とする前記請求項1乃至4の何れかに記載の方法。
- 前記加熱室内領域(13)を真空にする間に、前記冷却室内領域(14)及び/又は前記加熱室内領域に保護ガスを入れることを特徴とする請求項5に記載の方法。
- 前記はんだ材料搬送台(19)は、前記加熱室内領域(13)内で前記加熱装置(20)によって加熱される間、前記加熱装置とその向かい側に配された補助加熱装置(24)の間に配されることを特徴とする前記請求項の1又は6の何れかに記載の方法。
- 周囲から封止された処理室と、前記はんだ材料搬送台を加熱する加熱装置と、前記はんだ材料搬送台を冷却する冷却装置を備える、前記請求項1乃至7の何れかに記載の方法を実施する装置であって、
前記加熱装置(20)と前記冷却装置(25)が、凝縮装置(15)によって互いに隔離可能な2つの室内領域(13,14)内にそれぞれ配されることを特徴とする装置。 - 前記凝縮装置(15)は、供給位置から前記両室内領域(13,14)を互いに隔離する隔壁位置に移動可能に構成されていることを特徴とする請求項8に記載の装置。
- 前記供給位置は、前記処理室の外側に配されることを特徴とする請求項9に記載の装置。
- 前記凝縮装置(15)に冷却装置(36)を設けたことを特徴とする請求項9又は10に記載の装置。
- 前記冷却装置(36)は、少なくとも前記凝縮装置(15)の前記供給位置にある前記凝縮装置(15)と連動するよう構成されていることを特徴とする請求項11に記載の装置。
- 前記凝縮装置(15)は金属製の隔壁装置であることを特徴とする請求項8乃至12の何れかに記載の装置。
- 前記凝縮装置(15)は隔離プレートであることを特徴とする請求項13に記載の装置。
- 前記凝縮装置(15)を前記隔壁位置に配して、前記処理室(12)の前記両室内領域(13,14)を互いに連通させるべく相互連結するガス流路を形成することを特徴とする請求項8乃至14の何れかに記載の装置。
- 前記両室内領域(13,14)を互いに連通させるべく相互連結する隔壁ギャップ(30)が、前記処理室(12)の、前記隔壁位置に配された前記凝縮装置(15)と室壁(23,29)の間に形成されることを特徴とする請求項15に記載の装置。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102006025193 | 2006-05-29 | ||
DE102006025193.8 | 2006-05-29 | ||
DE102006029593.5 | 2006-06-26 | ||
DE102006029593A DE102006029593A1 (de) | 2006-05-29 | 2006-06-26 | Verfahren und Vorrichtung zur Herstellung einer Lotverbindung |
PCT/DE2007/000758 WO2007137547A1 (de) | 2006-05-29 | 2007-04-27 | Verfahren und vorrichtung zur temperaturbehandlung, insbesondere lotverbindung |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009538739A true JP2009538739A (ja) | 2009-11-12 |
JP5159768B2 JP5159768B2 (ja) | 2013-03-13 |
Family
ID=38445962
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009512402A Active JP5159768B2 (ja) | 2006-05-29 | 2007-04-27 | 特にはんだ接続に用いられる熱処理方法及び熱処理装置 |
Country Status (18)
Country | Link |
---|---|
US (1) | US7878386B2 (ja) |
EP (1) | EP2026927B1 (ja) |
JP (1) | JP5159768B2 (ja) |
KR (1) | KR101241559B1 (ja) |
AT (1) | ATE512744T1 (ja) |
AU (1) | AU2007266346B2 (ja) |
CA (1) | CA2650508C (ja) |
DE (1) | DE102006029593A1 (ja) |
DK (1) | DK2026927T3 (ja) |
HK (1) | HK1131764A1 (ja) |
IL (1) | IL195516A (ja) |
MX (1) | MX2008014929A (ja) |
MY (1) | MY150425A (ja) |
NO (1) | NO20085306L (ja) |
PL (1) | PL2026927T3 (ja) |
RU (1) | RU2420376C2 (ja) |
SI (1) | SI2026927T1 (ja) |
WO (1) | WO2007137547A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103056472A (zh) * | 2013-01-07 | 2013-04-24 | 山东高唐杰盛半导体科技有限公司 | 一种真空焊接炉的温度控制装置 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5424201B2 (ja) * | 2009-08-27 | 2014-02-26 | アユミ工業株式会社 | 加熱溶融処理装置および加熱溶融処理方法 |
JP5091296B2 (ja) * | 2010-10-18 | 2012-12-05 | 東京エレクトロン株式会社 | 接合装置 |
TWI443199B (zh) | 2011-03-03 | 2014-07-01 | Univ Nat Pingtung Sci & Tech | 具氣氛控制之局部電阻熱處理裝置 |
US11205633B2 (en) * | 2019-01-09 | 2021-12-21 | Kulicke And Soffa Industries, Inc. | Methods of bonding of semiconductor elements to substrates, and related bonding systems |
CN113543514B (zh) * | 2020-04-15 | 2022-09-23 | 昆山达菲乐电子产品有限公司 | 回焊炉 |
DE102020118875A1 (de) * | 2020-07-16 | 2022-01-20 | Johann Georg Reichart | Lötanlage, insbesondere für Lötverbindungen in der Leistungselektronik-, Mikroelektronik-, Mikromechanik-, und/oder Halbleiterfertigung |
EP4032648A1 (en) * | 2021-01-25 | 2022-07-27 | Infineon Technologies AG | Arrangement for forming a connection |
DE202021105596U1 (de) | 2021-10-14 | 2021-12-17 | Pink Gmbh Thermosysteme | Multifunktionale Sinter- oder Diffusionslötvorrichtung und Presswerkzeug |
DE102021126716B3 (de) | 2021-10-14 | 2022-09-01 | Pink Gmbh Thermosysteme | Multifunktionale sinter- oder diffusionslötvorrichtung und presswerkzeug |
TW202330132A (zh) | 2021-10-14 | 2023-08-01 | 德商平克塞莫系統有限公司 | 多功能燒結或擴散焊接設備和沖壓工具 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62148085A (ja) * | 1985-12-23 | 1987-07-02 | Hitachi Techno Eng Co Ltd | ペ−パ−リフロ−式はんだ付け装置 |
JPH04171888A (ja) * | 1990-11-05 | 1992-06-19 | Matsushita Electric Ind Co Ltd | リフロー半田付け方法 |
JPH04270064A (ja) * | 1991-02-20 | 1992-09-25 | Fujitsu Ltd | はんだ付け装置 |
JPH0550218A (ja) * | 1991-08-22 | 1993-03-02 | A Tec Tekutoron Kk | リフロー半田付け装置 |
JPH05154649A (ja) * | 1991-12-03 | 1993-06-22 | Fujitsu Ltd | リフロー半田付け装置 |
JPH06164132A (ja) * | 1992-11-25 | 1994-06-10 | Nippon Dennetsu Keiki Kk | 低酸素雰囲気はんだ付け装置におけるヒューム除去方法および装置 |
JP2003517376A (ja) * | 1999-11-08 | 2003-05-27 | ピンク ゲゼルシャフト ミット ベシュレンクター ハフツング ヴァクームテヒニク | はんだ接合部の製造方法および製造装置 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3618919A (en) * | 1969-11-03 | 1971-11-09 | Btu Eng Corp | Adjustable heat and gas barrier |
FR2149260B1 (ja) * | 1971-08-09 | 1974-03-29 | Chausson Usines Sa | |
US3882596A (en) * | 1972-11-09 | 1975-05-13 | Vaw Ver Aluminium Werke Ag | Method of flux-free soldering of aluminum-containing workpieces in a controlled atmosphere |
JPH0714353Y2 (ja) | 1988-07-08 | 1995-04-05 | 中外炉工業株式会社 | ローラハース型熱処理炉 |
JP2750747B2 (ja) | 1989-09-20 | 1998-05-13 | 日本真空技術株式会社 | 連続式真空ろう付炉 |
US5195673A (en) * | 1991-09-25 | 1993-03-23 | General Motors Corporation | Method and apparatus for convection brazing of aluminum heat exchangers |
US5172847A (en) * | 1991-09-25 | 1992-12-22 | General Motors Corporation | Method and apparatus for convection brazing of aluminum heat exchangers |
US5433368A (en) * | 1992-11-10 | 1995-07-18 | Spigarelli; Donald J. | Soldering system |
US5341978A (en) * | 1993-08-16 | 1994-08-30 | General Motors Corporation | Braze furnace with improved inert gas system |
JP2731127B2 (ja) * | 1995-04-24 | 1998-03-25 | 中外炉工業株式会社 | 多室型熱処理炉 |
JP2001064645A (ja) | 1999-09-01 | 2001-03-13 | Fuji Photo Film Co Ltd | 希土類賦活弗化ハロゲン化バリウム系蛍光体の製造装置、および製造方法 |
DE29924154U1 (de) * | 1999-11-08 | 2002-02-28 | Pink Gmbh Vakuumtechnik | Vorrichtung zur Herstellung einer Lotverbindung |
US6648216B2 (en) * | 2000-08-21 | 2003-11-18 | Matsushita Electric Industrial Co., Ltd. | Process and apparatus for flow soldering |
US6533577B2 (en) * | 2001-02-02 | 2003-03-18 | Cvd Equipment Corporation | Compartmentalized oven |
US6386422B1 (en) * | 2001-05-03 | 2002-05-14 | Asm Assembly Automation Limited | Solder reflow oven |
EP1536909A2 (en) * | 2002-06-14 | 2005-06-08 | Vapour Phase Technology Aps | Method and apparatus for vapour phase soldering |
WO2006111328A1 (de) | 2005-04-19 | 2006-10-26 | Loi Thermprocess Gmbh | Industrieofen, insbesondere drehherdofen |
-
2006
- 2006-06-26 DE DE102006029593A patent/DE102006029593A1/de not_active Withdrawn
-
2007
- 2007-04-27 AU AU2007266346A patent/AU2007266346B2/en not_active Ceased
- 2007-04-27 SI SI200730692T patent/SI2026927T1/sl unknown
- 2007-04-27 WO PCT/DE2007/000758 patent/WO2007137547A1/de active Application Filing
- 2007-04-27 KR KR1020087027054A patent/KR101241559B1/ko active IP Right Grant
- 2007-04-27 EP EP07722315A patent/EP2026927B1/de active Active
- 2007-04-27 US US12/300,851 patent/US7878386B2/en active Active
- 2007-04-27 JP JP2009512402A patent/JP5159768B2/ja active Active
- 2007-04-27 MX MX2008014929A patent/MX2008014929A/es active IP Right Grant
- 2007-04-27 RU RU2008150764/02A patent/RU2420376C2/ru active
- 2007-04-27 AT AT07722315T patent/ATE512744T1/de active
- 2007-04-27 CA CA2650508A patent/CA2650508C/en active Active
- 2007-04-27 PL PL07722315T patent/PL2026927T3/pl unknown
- 2007-04-27 DK DK07722315.4T patent/DK2026927T3/da active
- 2007-04-27 MY MYPI20084841 patent/MY150425A/en unknown
-
2008
- 2008-11-25 IL IL195516A patent/IL195516A/en not_active IP Right Cessation
- 2008-12-18 NO NO20085306A patent/NO20085306L/no not_active Application Discontinuation
-
2009
- 2009-10-21 HK HK09109735.2A patent/HK1131764A1/xx unknown
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62148085A (ja) * | 1985-12-23 | 1987-07-02 | Hitachi Techno Eng Co Ltd | ペ−パ−リフロ−式はんだ付け装置 |
JPH04171888A (ja) * | 1990-11-05 | 1992-06-19 | Matsushita Electric Ind Co Ltd | リフロー半田付け方法 |
JPH04270064A (ja) * | 1991-02-20 | 1992-09-25 | Fujitsu Ltd | はんだ付け装置 |
JPH0550218A (ja) * | 1991-08-22 | 1993-03-02 | A Tec Tekutoron Kk | リフロー半田付け装置 |
JPH05154649A (ja) * | 1991-12-03 | 1993-06-22 | Fujitsu Ltd | リフロー半田付け装置 |
JPH06164132A (ja) * | 1992-11-25 | 1994-06-10 | Nippon Dennetsu Keiki Kk | 低酸素雰囲気はんだ付け装置におけるヒューム除去方法および装置 |
JP2003517376A (ja) * | 1999-11-08 | 2003-05-27 | ピンク ゲゼルシャフト ミット ベシュレンクター ハフツング ヴァクームテヒニク | はんだ接合部の製造方法および製造装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103056472A (zh) * | 2013-01-07 | 2013-04-24 | 山东高唐杰盛半导体科技有限公司 | 一种真空焊接炉的温度控制装置 |
Also Published As
Publication number | Publication date |
---|---|
SI2026927T1 (sl) | 2011-09-30 |
US20090173771A1 (en) | 2009-07-09 |
KR20090010181A (ko) | 2009-01-29 |
IL195516A0 (en) | 2009-09-01 |
MY150425A (en) | 2014-01-15 |
PL2026927T3 (pl) | 2011-11-30 |
KR101241559B1 (ko) | 2013-03-08 |
RU2420376C2 (ru) | 2011-06-10 |
NO20085306L (no) | 2008-12-18 |
EP2026927B1 (de) | 2011-06-15 |
AU2007266346B2 (en) | 2011-03-31 |
HK1131764A1 (en) | 2010-02-05 |
JP5159768B2 (ja) | 2013-03-13 |
RU2008150764A (ru) | 2010-07-10 |
ATE512744T1 (de) | 2011-07-15 |
WO2007137547A1 (de) | 2007-12-06 |
AU2007266346A1 (en) | 2007-12-06 |
DE102006029593A1 (de) | 2007-12-13 |
EP2026927A1 (de) | 2009-02-25 |
MX2008014929A (es) | 2008-12-10 |
CA2650508A1 (en) | 2007-12-06 |
IL195516A (en) | 2013-11-28 |
US7878386B2 (en) | 2011-02-01 |
CA2650508C (en) | 2012-04-24 |
DK2026927T3 (da) | 2011-09-19 |
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