JP2009537993A5 - - Google Patents

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Publication number
JP2009537993A5
JP2009537993A5 JP2009511203A JP2009511203A JP2009537993A5 JP 2009537993 A5 JP2009537993 A5 JP 2009537993A5 JP 2009511203 A JP2009511203 A JP 2009511203A JP 2009511203 A JP2009511203 A JP 2009511203A JP 2009537993 A5 JP2009537993 A5 JP 2009537993A5
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JP
Japan
Prior art keywords
chamber
low frequency
discharge line
gas
degrees celsius
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JP2009511203A
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English (en)
Japanese (ja)
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JP2009537993A (ja
JP5269770B2 (ja
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Priority claimed from US11/435,065 external-priority patent/US20070267143A1/en
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Publication of JP2009537993A publication Critical patent/JP2009537993A/ja
Publication of JP2009537993A5 publication Critical patent/JP2009537993A5/ja
Application granted granted Critical
Publication of JP5269770B2 publication Critical patent/JP5269770B2/ja
Expired - Fee Related legal-status Critical Current
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JP2009511203A 2006-05-16 2007-05-15 Ｃｖｄシステム排出のイン・シトゥー洗浄 Expired - Fee Related JP5269770B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/435,065 US20070267143A1 (en) 2006-05-16 2006-05-16 In situ cleaning of CVD system exhaust
US11/435,065 2006-05-16
PCT/US2007/068948 WO2007137035A2 (en) 2006-05-16 2007-05-15 In situ cleaning of cvd system exhaust

Publications (3)

Publication Number Publication Date
JP2009537993A JP2009537993A (ja) 2009-10-29
JP2009537993A5 true JP2009537993A5 (enExample) 2010-05-20
JP5269770B2 JP5269770B2 (ja) 2013-08-21

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ID=38659696

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009511203A Expired - Fee Related JP5269770B2 (ja) 2006-05-16 2007-05-15 Ｃｖｄシステム排出のイン・シトゥー洗浄

Country Status (7)

Country Link
US (2) US20070267143A1 (enExample)
JP (1) JP5269770B2 (enExample)
KR (1) KR101046969B1 (enExample)
CN (1) CN101535525B (enExample)
DE (1) DE112007001223T5 (enExample)
TW (1) TWI388689B (enExample)
WO (1) WO2007137035A2 (enExample)

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CN102615068B (zh) * 2012-03-26 2015-05-20 中微半导体设备(上海)有限公司 Mocvd设备的清洁方法
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JP5605464B2 (ja) * 2013-06-25 2014-10-15 東京エレクトロン株式会社 成膜装置及びそのクリーニング方法
US11414759B2 (en) * 2013-11-29 2022-08-16 Taiwan Semiconductor Manufacturing Co., Ltd Mechanisms for supplying process gas into wafer process apparatus
CN103938177B (zh) * 2014-05-07 2015-12-30 南昌黄绿照明有限公司 可用氯气在线清洗的非钎焊mocvd喷头
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CN111069192A (zh) * 2018-10-22 2020-04-28 北京北方华创微电子装备有限公司 原位清洗装置和半导体处理设备
KR102368157B1 (ko) 2020-02-03 2022-03-02 주식회사 제이엔케이 화학기상증착 장치
KR102421233B1 (ko) 2020-02-03 2022-07-18 주식회사 제이엔케이 화학기상증착 장치
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