JP2009535518A5 - - Google Patents

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Publication number
JP2009535518A5
JP2009535518A5 JP2009509986A JP2009509986A JP2009535518A5 JP 2009535518 A5 JP2009535518 A5 JP 2009535518A5 JP 2009509986 A JP2009509986 A JP 2009509986A JP 2009509986 A JP2009509986 A JP 2009509986A JP 2009535518 A5 JP2009535518 A5 JP 2009535518A5
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JP
Japan
Prior art keywords
stages
stage
copper
copper material
forging
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JP2009509986A
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English (en)
Japanese (ja)
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JP5325096B2 (ja
JP2009535518A (ja
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Publication date
Priority claimed from US11/415,621 external-priority patent/US20070251818A1/en
Application filed filed Critical
Publication of JP2009535518A publication Critical patent/JP2009535518A/ja
Publication of JP2009535518A5 publication Critical patent/JP2009535518A5/ja
Application granted granted Critical
Publication of JP5325096B2 publication Critical patent/JP5325096B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2009509986A 2006-05-01 2007-04-30 銅ターゲット Expired - Fee Related JP5325096B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/415,621 US20070251818A1 (en) 2006-05-01 2006-05-01 Copper physical vapor deposition targets and methods of making copper physical vapor deposition targets
US11/415,621 2006-05-01
PCT/US2007/067734 WO2007130888A1 (en) 2006-05-01 2007-04-30 Copper target

Publications (3)

Publication Number Publication Date
JP2009535518A JP2009535518A (ja) 2009-10-01
JP2009535518A5 true JP2009535518A5 (enExample) 2013-06-20
JP5325096B2 JP5325096B2 (ja) 2013-10-23

Family

ID=38445688

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009509986A Expired - Fee Related JP5325096B2 (ja) 2006-05-01 2007-04-30 銅ターゲット

Country Status (5)

Country Link
US (2) US20070251818A1 (enExample)
JP (1) JP5325096B2 (enExample)
KR (1) KR20080113124A (enExample)
TW (1) TW200801209A (enExample)
WO (1) WO2007130888A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
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US8791018B2 (en) * 2006-12-19 2014-07-29 Spansion Llc Method of depositing copper using physical vapor deposition
JP5464352B2 (ja) * 2010-03-05 2014-04-09 三菱マテリアル株式会社 均一かつ微細結晶組織を有する高純度銅加工材の製造方法
CN104053814B (zh) 2012-01-12 2016-08-24 吉坤日矿日石金属株式会社 高纯度铜溅射靶
CN102862439A (zh) * 2012-08-31 2013-01-09 金星铜集团有限公司 一种喷丸法制造仿铸铜效果艺术品的方法
US9761420B2 (en) * 2013-12-13 2017-09-12 Praxair S.T. Technology, Inc. Diffusion bonded high purity copper sputtering target assemblies
WO2015151901A1 (ja) * 2014-03-31 2015-10-08 Jx日鉱日石金属株式会社 銅又は銅合金スパッタリングターゲット
CN104946923B (zh) * 2015-06-30 2017-02-01 浙江工业大学 一种铜基复合材料及其制备方法
US11035036B2 (en) * 2018-02-01 2021-06-15 Honeywell International Inc. Method of forming copper alloy sputtering targets with refined shape and microstructure
CN114892135B (zh) * 2022-05-24 2023-09-08 宁波江丰电子材料股份有限公司 一种高纯铜靶材及其制备方法与应用

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