JP2009526909A5 - - Google Patents
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- Publication number
- JP2009526909A5 JP2009526909A5 JP2008554623A JP2008554623A JP2009526909A5 JP 2009526909 A5 JP2009526909 A5 JP 2009526909A5 JP 2008554623 A JP2008554623 A JP 2008554623A JP 2008554623 A JP2008554623 A JP 2008554623A JP 2009526909 A5 JP2009526909 A5 JP 2009526909A5
- Authority
- JP
- Japan
- Prior art keywords
- acid
- salts
- selenium
- solution
- sulfur
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP06003278.6 | 2006-02-17 | ||
| EP06003278A EP1820884B1 (en) | 2006-02-17 | 2006-02-17 | Solution and process to treat surfaces of copper alloys in order to improve the adhesion between the metal surface and the bonded polymeric material |
| PCT/EP2007/000826 WO2007093284A1 (en) | 2006-02-17 | 2007-01-31 | Solution and process to treat surfaces of copper alloys in order to improve the adhesion between the metal surface and the bonded polymeric material |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013057660A Division JP5710670B2 (ja) | 2006-02-17 | 2013-03-21 | 金属表面と接合した高分子材料との間の接着性を向上するために銅合金の表面を処理する溶液および方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009526909A JP2009526909A (ja) | 2009-07-23 |
| JP2009526909A5 true JP2009526909A5 (enExample) | 2013-06-20 |
| JP5300135B2 JP5300135B2 (ja) | 2013-09-25 |
Family
ID=36636657
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008554623A Expired - Fee Related JP5300135B2 (ja) | 2006-02-17 | 2007-01-31 | 金属表面と接合した高分子材料との間の接着性を向上するために銅合金の表面を処理する溶液および方法 |
| JP2013057660A Expired - Fee Related JP5710670B2 (ja) | 2006-02-17 | 2013-03-21 | 金属表面と接合した高分子材料との間の接着性を向上するために銅合金の表面を処理する溶液および方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013057660A Expired - Fee Related JP5710670B2 (ja) | 2006-02-17 | 2013-03-21 | 金属表面と接合した高分子材料との間の接着性を向上するために銅合金の表面を処理する溶液および方法 |
Country Status (9)
| Country | Link |
|---|---|
| US (3) | US20100288731A1 (enExample) |
| EP (1) | EP1820884B1 (enExample) |
| JP (2) | JP5300135B2 (enExample) |
| CN (1) | CN101379220B (enExample) |
| AT (1) | ATE445031T1 (enExample) |
| DE (1) | DE602006009614D1 (enExample) |
| MY (1) | MY144294A (enExample) |
| TW (2) | TWI495759B (enExample) |
| WO (1) | WO2007093284A1 (enExample) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009059910A (ja) * | 2007-08-31 | 2009-03-19 | Panasonic Corp | リード、配線部材、パッケージ部品、樹脂付金属部品及び樹脂封止半導体装置、並びにこれらの製造方法 |
| EP2546387A1 (en) † | 2008-03-21 | 2013-01-16 | Enthone, Inc. | Adhesion promotion of metal to laminate with a multi-functional compound |
| JP2009245960A (ja) * | 2008-03-28 | 2009-10-22 | Panasonic Corp | 半導体装置用パッケージ、半導体装置、及びその製造方法 |
| ATE513066T1 (de) * | 2008-10-13 | 2011-07-15 | Atotech Deutschland Gmbh | Verfahren zur verbesserung der haftung zwischen silberoberflächen und harzmaterialien |
| KR101560000B1 (ko) | 2009-02-06 | 2015-10-13 | 동우 화인켐 주식회사 | 액정표시장치용 어레이 기판의 제조방법 |
| WO2012005722A1 (en) * | 2010-07-06 | 2012-01-12 | Zettacore, Inc. | Methods of treating metal surfaces and devices formed thereby |
| JP5443863B2 (ja) * | 2009-07-09 | 2014-03-19 | 株式会社Ａｄｅｋａ | 銅含有材料用エッチング剤組成物及び銅含有材料のエッチング方法 |
| KR101578575B1 (ko) * | 2010-03-24 | 2015-12-17 | 세키스이가가쿠 고교가부시키가이샤 | 접착제 조성물, 접착 테이프, 반도체 웨이퍼의 처리 방법 및 tsv 웨이퍼의 제조 방법 |
| KR101366938B1 (ko) * | 2012-01-06 | 2014-02-25 | 삼성전기주식회사 | 에칭액 및 이를 이용한 인쇄 배선 기판의 제조방법 |
| JP5219008B1 (ja) * | 2012-07-24 | 2013-06-26 | メック株式会社 | 銅のマイクロエッチング剤及びその補給液、並びに配線基板の製造方法 |
| CN104674222A (zh) * | 2013-11-27 | 2015-06-03 | 芝普企业股份有限公司 | 可有效减缓贾凡尼效应的刻蚀液 |
| JP5792336B2 (ja) * | 2014-02-28 | 2015-10-07 | 芝普企業股▲分▼有限公司 | 有効にガルバノ効果を軽減できるエッチング液 |
| EP3159432B1 (en) * | 2015-10-23 | 2020-08-05 | ATOTECH Deutschland GmbH | Surface treatment agent for copper and copper alloy surfaces |
| KR102155951B1 (ko) | 2016-03-11 | 2020-09-15 | 아토테크더치랜드게엠베하 | 리드-프레임 구조물, 리드-프레임, 표면 장착 전자 디바이스 및 이들을 제조하는 방법들 |
| JP6354086B1 (ja) | 2017-01-21 | 2018-07-11 | メック株式会社 | 被膜形成用組成物、表面処理金属部材の製造方法、および金属‐樹脂複合体の製造方法 |
| JP6387543B1 (ja) | 2017-05-11 | 2018-09-12 | メック株式会社 | 被膜形成用組成物、表面処理金属部材の製造方法、および金属‐樹脂複合体の製造方法 |
| TWI749287B (zh) * | 2019-01-22 | 2021-12-11 | 達興材料股份有限公司 | 酸性過氧化氫水溶液組成物 |
| JP7363105B2 (ja) | 2019-05-31 | 2023-10-18 | 株式会社レゾナック | 感光性樹脂組成物、感光性樹脂フィルム、プリント配線板及び半導体パッケージ、並びにプリント配線板の製造方法 |
| EP4279634A1 (en) * | 2022-05-17 | 2023-11-22 | Atotech Deutschland GmbH & Co. KG | Method for nano etching of copper and copper alloy surfaces |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3645772A (en) | 1970-06-30 | 1972-02-29 | Du Pont | Process for improving bonding of a photoresist to copper |
| JPS5221460B1 (enExample) * | 1971-04-26 | 1977-06-10 | ||
| JPH0897559A (ja) | 1994-09-26 | 1996-04-12 | Okuno Chem Ind Co Ltd | 多層プリント配線板の内層用回路板の銅箔処理方法、及び該内層用回路板の銅箔処理液 |
| GB9425090D0 (en) | 1994-12-12 | 1995-02-08 | Alpha Metals Ltd | Copper coating |
| JP3361680B2 (ja) * | 1995-12-27 | 2003-01-07 | 日本パーオキサイド株式会社 | 銅又は銅合金の表面処理液 |
| TW374802B (en) * | 1996-07-29 | 1999-11-21 | Ebara Densan Ltd | Etching composition, method for roughening copper surface and method for producing printed wiring board |
| US5869130A (en) | 1997-06-12 | 1999-02-09 | Mac Dermid, Incorporated | Process for improving the adhesion of polymeric materials to metal surfaces |
| US6162366A (en) * | 1997-12-25 | 2000-12-19 | Canon Kabushiki Kaisha | Etching process |
| TW460622B (en) | 1998-02-03 | 2001-10-21 | Atotech Deutschland Gmbh | Solution and process to pretreat copper surfaces |
| TW470785B (en) * | 1998-02-03 | 2002-01-01 | Atotech Deutschland Gmbh | Process for preliminary treatment of copper surfaces |
| JP2000064067A (ja) * | 1998-06-09 | 2000-02-29 | Ebara Densan Ltd | エッチング液および銅表面の粗化処理方法 |
| US6117250A (en) * | 1999-02-25 | 2000-09-12 | Morton International Inc. | Thiazole and thiocarbamide based chemicals for use with oxidative etchant solutions |
| DE10066028C2 (de) * | 2000-07-07 | 2003-04-24 | Atotech Deutschland Gmbh | Kupfersubstrat mit aufgerauhten Oberflächen |
| JP4309602B2 (ja) * | 2001-04-25 | 2009-08-05 | メック株式会社 | 銅または銅合金と樹脂との接着性を向上させる方法、ならびに積層体 |
| DE10302596A1 (de) * | 2002-01-24 | 2003-08-28 | Shipley Company Marlborough | Behandlung von Metalloberflächen mit einer modifizierten Oxidaustauschmasse |
| KR100960687B1 (ko) * | 2003-06-24 | 2010-06-01 | 엘지디스플레이 주식회사 | 구리(또는 구리합금층)를 포함하는 이중금속층을 일괄식각하기위한 식각액 |
| US20050067378A1 (en) * | 2003-09-30 | 2005-03-31 | Harry Fuerhaupter | Method for micro-roughening treatment of copper and mixed-metal circuitry |
-
2006
- 2006-02-17 DE DE602006009614T patent/DE602006009614D1/de active Active
- 2006-02-17 EP EP06003278A patent/EP1820884B1/en not_active Not-in-force
- 2006-02-17 AT AT06003278T patent/ATE445031T1/de active
-
2007
- 2007-01-10 TW TW096100950A patent/TWI495759B/zh active
- 2007-01-10 TW TW104111778A patent/TW201529889A/zh unknown
- 2007-01-31 JP JP2008554623A patent/JP5300135B2/ja not_active Expired - Fee Related
- 2007-01-31 WO PCT/EP2007/000826 patent/WO2007093284A1/en not_active Ceased
- 2007-01-31 CN CN2007800044722A patent/CN101379220B/zh active Active
- 2007-01-31 US US12/224,016 patent/US20100288731A1/en not_active Abandoned
-
2008
- 2008-08-15 MY MYPI20083112A patent/MY144294A/en unknown
-
2013
- 2013-03-21 JP JP2013057660A patent/JP5710670B2/ja not_active Expired - Fee Related
-
2016
- 2016-02-11 US US15/041,840 patent/US20160168722A1/en not_active Abandoned
- 2016-04-11 US US15/095,645 patent/US20160222523A1/en not_active Abandoned
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