JP2009520251A - 高周波識別（ｒｆｉｄ）アンテナを含む導電パターンを作製するための方法及び材料 - Google Patents

高周波識別（ｒｆｉｄ）アンテナを含む導電パターンを作製するための方法及び材料 Download PDF

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Publication number
JP2009520251A
JP2009520251A JP2008544542A JP2008544542A JP2009520251A JP 2009520251 A JP2009520251 A JP 2009520251A JP 2008544542 A JP2008544542 A JP 2008544542A JP 2008544542 A JP2008544542 A JP 2008544542A JP 2009520251 A JP2009520251 A JP 2009520251A
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JP
Japan
Prior art keywords
layer
conductive metal
adhesive layer
release coating
conductive
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008544542A
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English (en)
Japanese (ja)
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JP2009520251A5 (https=
Inventor
ウィリアムズ，リチャード，ケー．
フィリップ，チャールズ，アール．
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K B Inc
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K B Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by K B Inc filed Critical K B Inc
Publication of JP2009520251A publication Critical patent/JP2009520251A/ja
Publication of JP2009520251A5 publication Critical patent/JP2009520251A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0522—Using an adhesive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Credit Cards Or The Like (AREA)
  • Details Of Aerials (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
JP2008544542A 2005-12-09 2006-12-11 高周波識別（ｒｆｉｄ）アンテナを含む導電パターンを作製するための方法及び材料 Pending JP2009520251A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US74934905P 2005-12-09 2005-12-09
PCT/US2006/046933 WO2007070391A1 (en) 2005-12-09 2006-12-11 Method and material for manufacturing electrically conductive patterns, including radio frequency identification (rfid) antennas

Publications (2)

Publication Number Publication Date
JP2009520251A true JP2009520251A (ja) 2009-05-21
JP2009520251A5 JP2009520251A5 (https=) 2010-03-11

Family

ID=37904891

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008544542A Pending JP2009520251A (ja) 2005-12-09 2006-12-11 高周波識別（ｒｆｉｄ）アンテナを含む導電パターンを作製するための方法及び材料

Country Status (8)

Country Link
US (1) US20090250522A1 (https=)
EP (1) EP1964031A1 (https=)
JP (1) JP2009520251A (https=)
KR (1) KR20080095842A (https=)
CN (1) CN101341500B (https=)
AU (1) AU2006326694A1 (https=)
CA (1) CA2630834A1 (https=)
WO (1) WO2007070391A1 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013015953A (ja) * 2011-07-01 2013-01-24 Konica Minolta Business Technologies Inc 非接触情報記録媒体の製造方法
JP2015511182A (ja) * 2012-01-13 2015-04-16 アルジョ ウイグギンス フイネ パペルス リミテッド シートを製造するための方法
JP2016179581A (ja) * 2015-03-24 2016-10-13 トッパン・フォームズ株式会社 複写帳票
JP2016201068A (ja) * 2015-04-14 2016-12-01 トッパン・フォームズ株式会社 Ｒｆｉｄメディアの製造方法

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6615189B1 (en) 1998-06-22 2003-09-02 Bank One, Delaware, National Association Debit purchasing of stored value card for use by and/or delivery to others
US7809642B1 (en) 1998-06-22 2010-10-05 Jpmorgan Chase Bank, N.A. Debit purchasing of stored value card for use by and/or delivery to others
US8793160B2 (en) 1999-12-07 2014-07-29 Steve Sorem System and method for processing transactions
US7860789B2 (en) 2001-07-24 2010-12-28 Jpmorgan Chase Bank, N.A. Multiple account advanced payment card and method of routing card transactions
US8020754B2 (en) 2001-08-13 2011-09-20 Jpmorgan Chase Bank, N.A. System and method for funding a collective account by use of an electronic tag
US7899753B1 (en) 2002-03-25 2011-03-01 Jpmorgan Chase Bank, N.A Systems and methods for time variable financial authentication
WO2003083619A2 (en) 2002-03-29 2003-10-09 Bank One, Delaware, N.A. System and process for performing purchase transaction using tokens
US7809595B2 (en) 2002-09-17 2010-10-05 Jpmorgan Chase Bank, Na System and method for managing risks associated with outside service providers
US20040122736A1 (en) 2002-10-11 2004-06-24 Bank One, Delaware, N.A. System and method for granting promotional rewards to credit account holders
US8306907B2 (en) 2003-05-30 2012-11-06 Jpmorgan Chase Bank N.A. System and method for offering risk-based interest rates in a credit instrument
US7401731B1 (en) 2005-05-27 2008-07-22 Jpmorgan Chase Bank, Na Method and system for implementing a card product with multiple customized relationships
MX2008014010A (es) * 2007-11-02 2009-05-26 Citicorp Credit Services Inc Metodos y sistemas para gestion de cuentas de clientes de institucion financiera.
AU2009304245C1 (en) * 2008-10-15 2014-05-08 T-Touch International S.A.R.L. Planar data carrier
US9076092B2 (en) * 2009-05-08 2015-07-07 Confidex Ltd. RFID transponder and a method for fabricating the same
US8725589B1 (en) 2009-07-30 2014-05-13 Jpmorgan Chase Bank, N.A. Methods for personalizing multi-layer transaction cards
FR2954361B1 (fr) 2009-12-23 2012-06-15 Arjo Wiggins Fine Papers Ltd Feuille imprimable ultra lisse et recyclable et son procede de fabrication
US8480942B2 (en) * 2010-01-27 2013-07-09 The Board Of Trustees Of The University Of Illinois Method of forming a patterned layer of a material on a substrate
USD623690S1 (en) 2010-03-05 2010-09-14 Jpmorgan Chase Bank, N.A. Metal transaction device with gem-like surface
USD643064S1 (en) 2010-07-29 2011-08-09 Jpmorgan Chase Bank, N.A. Metal transaction device with gem-like surface
CN103119663B (zh) * 2010-09-28 2015-06-24 三菱制纸株式会社 导电材料前体及导电材料
WO2012126063A1 (en) * 2011-03-24 2012-09-27 Tagsys Sas Rfid tag assembly and label process
EP2739464B1 (en) 2011-08-03 2017-11-29 Graphic Packaging International, Inc. Systems and methods for forming laminates with patterned microwave energy interactive material
FR2985744B1 (fr) * 2012-01-13 2014-11-28 Arjo Wiggins Fine Papers Ltd Procede de fabrication d'une feuille electro-conductrice
FR2992663B1 (fr) * 2012-07-02 2015-04-03 Arjo Wiggins Fine Papers Ltd Procede de fabrication d'une feuille dont une face comporte une zone de plus grand lisse que le reste de la face
US9038918B2 (en) * 2012-12-13 2015-05-26 Avery Dennison Corporation Antenna for RFID device and method for making the same
USD854083S1 (en) 2013-03-27 2019-07-16 Jpmorgan Chase Bank, N.A. Hybrid transaction device
WO2015023262A1 (en) 2013-08-13 2015-02-19 Hewlett-Packard Development Company, L.P. Pattern foil printing
JP6290385B2 (ja) 2013-09-26 2018-03-07 グラフィック パッケージング インターナショナル インコーポレイテッドＧｒａｐｈｉｃ Ｐａｃｋａｇｉｎｇ Ｉｎｔｅｒｎａｔｉｏｎａｌ，Ｉｎｃ． 積層体並びに積層を行うシステム及び方法
MX384916B (es) 2014-12-22 2025-03-14 Graphic Packaging Int Llc Sistemas y métodos para formar laminados.
US11479693B2 (en) 2018-05-03 2022-10-25 Avery Dennison Corporation Adhesive laminates and method for making adhesive laminates
CN108963422A (zh) * 2018-06-26 2018-12-07 中山国安火炬科技发展有限公司 一种rfid天线制造工艺
US10813225B2 (en) * 2019-02-15 2020-10-20 Xerox Corporation Radio-frequency identification (RFID) label or conductive trace thermal transfer printing method
CN112312669B (zh) * 2019-07-26 2022-03-01 北京梦之墨科技有限公司 一种金属图案、金属图案的制备方法及制备装置
CN114514534B (zh) * 2019-07-30 2024-10-11 艾利丹尼森零售信息服务有限公司 可重新定位的射频识别装置
CN110957556A (zh) * 2019-12-20 2020-04-03 江苏科睿坦电子科技有限公司 一种新型镭射防伪的超高频rfid标签天线及其生产工艺
US11939478B2 (en) 2020-03-10 2024-03-26 Xerox Corporation Metallic inks composition for digital offset lithographic printing

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60160692A (ja) * 1984-01-09 1985-08-22 ストウフア−　ケミカル　カンパニ− 導電性金属層の転写積層体その他
JPH0387089A (ja) * 1989-08-30 1991-04-11 Nitto Denko Corp 回路パターン形成用フィルムおよび回路板の製造法
JP2000048155A (ja) * 1998-07-31 2000-02-18 Toppan Forms Co Ltd 非接触ｉｃモジュール用アンテナの形成方法
JP2001034732A (ja) * 1999-07-16 2001-02-09 Toppan Forms Co Ltd 非接触ｉｃモジュール用アンテナの形成方法
JP2003209421A (ja) * 2002-01-17 2003-07-25 Dainippon Printing Co Ltd 透明アンテナを有するｒｆｉｄタグ、及びその製造方法
JP2004342755A (ja) * 2003-05-14 2004-12-02 Shinko Electric Ind Co Ltd 平面コイルの製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4012552A (en) * 1975-03-10 1977-03-15 Dennison Manufacturing Company Decorative metal film heat transfer decalcomania
US5751256A (en) * 1994-03-04 1998-05-12 Flexcon Company Inc. Resonant tag labels and method of making same
GB9709263D0 (en) * 1997-05-07 1997-06-25 Astor Universal Limited Laminate structure
US6107920A (en) * 1998-06-09 2000-08-22 Motorola, Inc. Radio frequency identification tag having an article integrated antenna
DE59900131D1 (de) * 1999-01-23 2001-07-26 Ident Gmbh X RFID-Transponder mit bedruckbarer Oberfläche
US20040200061A1 (en) * 2003-04-11 2004-10-14 Coleman James P. Conductive pattern and method of making
WO2005002305A2 (en) * 2003-06-06 2005-01-06 Sipix Imaging, Inc. In mold manufacture of an object with embedded display panel
US7384496B2 (en) * 2004-02-23 2008-06-10 Checkpoint Systems, Inc. Security tag system for fabricating a tag including an integrated surface processing system
US20070102103A1 (en) * 2005-11-07 2007-05-10 Klaser Technology Inc. Manufacturing method for printing circuit

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60160692A (ja) * 1984-01-09 1985-08-22 ストウフア−　ケミカル　カンパニ− 導電性金属層の転写積層体その他
JPH0387089A (ja) * 1989-08-30 1991-04-11 Nitto Denko Corp 回路パターン形成用フィルムおよび回路板の製造法
JP2000048155A (ja) * 1998-07-31 2000-02-18 Toppan Forms Co Ltd 非接触ｉｃモジュール用アンテナの形成方法
JP2001034732A (ja) * 1999-07-16 2001-02-09 Toppan Forms Co Ltd 非接触ｉｃモジュール用アンテナの形成方法
JP2003209421A (ja) * 2002-01-17 2003-07-25 Dainippon Printing Co Ltd 透明アンテナを有するｒｆｉｄタグ、及びその製造方法
JP2004342755A (ja) * 2003-05-14 2004-12-02 Shinko Electric Ind Co Ltd 平面コイルの製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013015953A (ja) * 2011-07-01 2013-01-24 Konica Minolta Business Technologies Inc 非接触情報記録媒体の製造方法
JP2015511182A (ja) * 2012-01-13 2015-04-16 アルジョ ウイグギンス フイネ パペルス リミテッド シートを製造するための方法
US9648751B2 (en) 2012-01-13 2017-05-09 Arjo Wiggins Fine Papers Limited Method for producing a sheet
JP2016179581A (ja) * 2015-03-24 2016-10-13 トッパン・フォームズ株式会社 複写帳票
JP2016201068A (ja) * 2015-04-14 2016-12-01 トッパン・フォームズ株式会社 Ｒｆｉｄメディアの製造方法

Also Published As

Publication number Publication date
US20090250522A1 (en) 2009-10-08
AU2006326694A1 (en) 2007-06-21
CN101341500B (zh) 2011-03-02
KR20080095842A (ko) 2008-10-29
WO2007070391A1 (en) 2007-06-21
CN101341500A (zh) 2009-01-07
EP1964031A1 (en) 2008-09-03
CA2630834A1 (en) 2007-06-21

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