AU2006326694A1 - Method and material for manufacturing electrically conductive patterns, including radio frequency identification (RFID) antennas - Google Patents

Method and material for manufacturing electrically conductive patterns, including radio frequency identification (RFID) antennas Download PDF

Info

Publication number
AU2006326694A1
AU2006326694A1 AU2006326694A AU2006326694A AU2006326694A1 AU 2006326694 A1 AU2006326694 A1 AU 2006326694A1 AU 2006326694 A AU2006326694 A AU 2006326694A AU 2006326694 A AU2006326694 A AU 2006326694A AU 2006326694 A1 AU2006326694 A1 AU 2006326694A1
Authority
AU
Australia
Prior art keywords
layer
conductive metal
adhesive layer
release coating
acrylate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2006326694A
Other languages
English (en)
Inventor
Charles R. Philip
Richard K. Williams
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
K B Inc
Original Assignee
K B Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by K B Inc filed Critical K B Inc
Publication of AU2006326694A1 publication Critical patent/AU2006326694A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0522—Using an adhesive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Credit Cards Or The Like (AREA)
  • Details Of Aerials (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
AU2006326694A 2005-12-09 2006-12-11 Method and material for manufacturing electrically conductive patterns, including radio frequency identification (RFID) antennas Abandoned AU2006326694A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US74934905P 2005-12-09 2005-12-09
US60/749,349 2005-12-09
PCT/US2006/046933 WO2007070391A1 (en) 2005-12-09 2006-12-11 Method and material for manufacturing electrically conductive patterns, including radio frequency identification (rfid) antennas

Publications (1)

Publication Number Publication Date
AU2006326694A1 true AU2006326694A1 (en) 2007-06-21

Family

ID=37904891

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2006326694A Abandoned AU2006326694A1 (en) 2005-12-09 2006-12-11 Method and material for manufacturing electrically conductive patterns, including radio frequency identification (RFID) antennas

Country Status (8)

Country Link
US (1) US20090250522A1 (https=)
EP (1) EP1964031A1 (https=)
JP (1) JP2009520251A (https=)
KR (1) KR20080095842A (https=)
CN (1) CN101341500B (https=)
AU (1) AU2006326694A1 (https=)
CA (1) CA2630834A1 (https=)
WO (1) WO2007070391A1 (https=)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6615189B1 (en) 1998-06-22 2003-09-02 Bank One, Delaware, National Association Debit purchasing of stored value card for use by and/or delivery to others
US7809642B1 (en) 1998-06-22 2010-10-05 Jpmorgan Chase Bank, N.A. Debit purchasing of stored value card for use by and/or delivery to others
US8793160B2 (en) 1999-12-07 2014-07-29 Steve Sorem System and method for processing transactions
US7860789B2 (en) 2001-07-24 2010-12-28 Jpmorgan Chase Bank, N.A. Multiple account advanced payment card and method of routing card transactions
US8020754B2 (en) 2001-08-13 2011-09-20 Jpmorgan Chase Bank, N.A. System and method for funding a collective account by use of an electronic tag
US7899753B1 (en) 2002-03-25 2011-03-01 Jpmorgan Chase Bank, N.A Systems and methods for time variable financial authentication
WO2003083619A2 (en) 2002-03-29 2003-10-09 Bank One, Delaware, N.A. System and process for performing purchase transaction using tokens
US7809595B2 (en) 2002-09-17 2010-10-05 Jpmorgan Chase Bank, Na System and method for managing risks associated with outside service providers
US20040122736A1 (en) 2002-10-11 2004-06-24 Bank One, Delaware, N.A. System and method for granting promotional rewards to credit account holders
US8306907B2 (en) 2003-05-30 2012-11-06 Jpmorgan Chase Bank N.A. System and method for offering risk-based interest rates in a credit instrument
US7401731B1 (en) 2005-05-27 2008-07-22 Jpmorgan Chase Bank, Na Method and system for implementing a card product with multiple customized relationships
MX2008014010A (es) * 2007-11-02 2009-05-26 Citicorp Credit Services Inc Metodos y sistemas para gestion de cuentas de clientes de institucion financiera.
AU2009304245C1 (en) * 2008-10-15 2014-05-08 T-Touch International S.A.R.L. Planar data carrier
US9076092B2 (en) * 2009-05-08 2015-07-07 Confidex Ltd. RFID transponder and a method for fabricating the same
US8725589B1 (en) 2009-07-30 2014-05-13 Jpmorgan Chase Bank, N.A. Methods for personalizing multi-layer transaction cards
FR2954361B1 (fr) 2009-12-23 2012-06-15 Arjo Wiggins Fine Papers Ltd Feuille imprimable ultra lisse et recyclable et son procede de fabrication
US8480942B2 (en) * 2010-01-27 2013-07-09 The Board Of Trustees Of The University Of Illinois Method of forming a patterned layer of a material on a substrate
USD623690S1 (en) 2010-03-05 2010-09-14 Jpmorgan Chase Bank, N.A. Metal transaction device with gem-like surface
USD643064S1 (en) 2010-07-29 2011-08-09 Jpmorgan Chase Bank, N.A. Metal transaction device with gem-like surface
CN103119663B (zh) * 2010-09-28 2015-06-24 三菱制纸株式会社 导电材料前体及导电材料
WO2012126063A1 (en) * 2011-03-24 2012-09-27 Tagsys Sas Rfid tag assembly and label process
JP5397423B2 (ja) * 2011-07-01 2014-01-22 コニカミノルタ株式会社 非接触情報記録媒体の製造方法
EP2739464B1 (en) 2011-08-03 2017-11-29 Graphic Packaging International, Inc. Systems and methods for forming laminates with patterned microwave energy interactive material
FR2985744B1 (fr) * 2012-01-13 2014-11-28 Arjo Wiggins Fine Papers Ltd Procede de fabrication d'une feuille electro-conductrice
FR2992663B1 (fr) * 2012-07-02 2015-04-03 Arjo Wiggins Fine Papers Ltd Procede de fabrication d'une feuille dont une face comporte une zone de plus grand lisse que le reste de la face
CA2861728C (fr) * 2012-01-13 2020-04-28 Aw Branding Limited Procede de fabrication d'une feuille
US9038918B2 (en) * 2012-12-13 2015-05-26 Avery Dennison Corporation Antenna for RFID device and method for making the same
USD854083S1 (en) 2013-03-27 2019-07-16 Jpmorgan Chase Bank, N.A. Hybrid transaction device
WO2015023262A1 (en) 2013-08-13 2015-02-19 Hewlett-Packard Development Company, L.P. Pattern foil printing
JP6290385B2 (ja) 2013-09-26 2018-03-07 グラフィック パッケージング インターナショナル インコーポレイテッドＧｒａｐｈｉｃ Ｐａｃｋａｇｉｎｇ Ｉｎｔｅｒｎａｔｉｏｎａｌ，Ｉｎｃ． 積層体並びに積層を行うシステム及び方法
MX384916B (es) 2014-12-22 2025-03-14 Graphic Packaging Int Llc Sistemas y métodos para formar laminados.
JP6457853B2 (ja) * 2015-03-24 2019-01-23 トッパン・フォームズ株式会社 複写帳票
JP6448449B2 (ja) * 2015-04-14 2019-01-09 トッパン・フォームズ株式会社 Ｒｆｉｄメディアの製造方法
US11479693B2 (en) 2018-05-03 2022-10-25 Avery Dennison Corporation Adhesive laminates and method for making adhesive laminates
CN108963422A (zh) * 2018-06-26 2018-12-07 中山国安火炬科技发展有限公司 一种rfid天线制造工艺
US10813225B2 (en) * 2019-02-15 2020-10-20 Xerox Corporation Radio-frequency identification (RFID) label or conductive trace thermal transfer printing method
CN112312669B (zh) * 2019-07-26 2022-03-01 北京梦之墨科技有限公司 一种金属图案、金属图案的制备方法及制备装置
CN114514534B (zh) * 2019-07-30 2024-10-11 艾利丹尼森零售信息服务有限公司 可重新定位的射频识别装置
CN110957556A (zh) * 2019-12-20 2020-04-03 江苏科睿坦电子科技有限公司 一种新型镭射防伪的超高频rfid标签天线及其生产工艺
US11939478B2 (en) 2020-03-10 2024-03-26 Xerox Corporation Metallic inks composition for digital offset lithographic printing

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4012552A (en) * 1975-03-10 1977-03-15 Dennison Manufacturing Company Decorative metal film heat transfer decalcomania
IL73403A0 (en) * 1984-01-09 1985-02-28 Stauffer Chemical Co Transfer laminates and their use for forming a metal layer on a support
JPH0387089A (ja) * 1989-08-30 1991-04-11 Nitto Denko Corp 回路パターン形成用フィルムおよび回路板の製造法
US5751256A (en) * 1994-03-04 1998-05-12 Flexcon Company Inc. Resonant tag labels and method of making same
GB9709263D0 (en) * 1997-05-07 1997-06-25 Astor Universal Limited Laminate structure
US6107920A (en) * 1998-06-09 2000-08-22 Motorola, Inc. Radio frequency identification tag having an article integrated antenna
JP3834689B2 (ja) * 1998-07-31 2006-10-18 トッパン・フォームズ株式会社 非接触ｉｃモジュール用アンテナの形成方法
DE59900131D1 (de) * 1999-01-23 2001-07-26 Ident Gmbh X RFID-Transponder mit bedruckbarer Oberfläche
JP2001034732A (ja) * 1999-07-16 2001-02-09 Toppan Forms Co Ltd 非接触ｉｃモジュール用アンテナの形成方法
JP2003209421A (ja) * 2002-01-17 2003-07-25 Dainippon Printing Co Ltd 透明アンテナを有するｒｆｉｄタグ、及びその製造方法
US20040200061A1 (en) * 2003-04-11 2004-10-14 Coleman James P. Conductive pattern and method of making
JP2004342755A (ja) * 2003-05-14 2004-12-02 Shinko Electric Ind Co Ltd 平面コイルの製造方法
WO2005002305A2 (en) * 2003-06-06 2005-01-06 Sipix Imaging, Inc. In mold manufacture of an object with embedded display panel
US7384496B2 (en) * 2004-02-23 2008-06-10 Checkpoint Systems, Inc. Security tag system for fabricating a tag including an integrated surface processing system
US20070102103A1 (en) * 2005-11-07 2007-05-10 Klaser Technology Inc. Manufacturing method for printing circuit

Also Published As

Publication number Publication date
US20090250522A1 (en) 2009-10-08
CN101341500B (zh) 2011-03-02
KR20080095842A (ko) 2008-10-29
WO2007070391A1 (en) 2007-06-21
CN101341500A (zh) 2009-01-07
JP2009520251A (ja) 2009-05-21
EP1964031A1 (en) 2008-09-03
CA2630834A1 (en) 2007-06-21

Similar Documents

Publication Publication Date Title
US20090250522A1 (en) Method and Material for Manufacturing Electrically Conductive Patterns, Including Radio Frequency Identification (RFID) Antennas
US6641860B1 (en) Method of manufacturing printed circuit boards
US7463154B2 (en) Selective metal removal process for metallized retro-reflective and holographic films and radio frequency devices made therewith
CN1296728A (zh) 可转移的薄膜电气元件
US20060283005A1 (en) Conductive pattern and method of making
US20020160786A1 (en) Selective metal removal process for metallized retro-reflective and holographic films and radio frequency devices made therewith
US20020171065A1 (en) Circuit elements having an embedded conductive trace and methods of manufacture
CN102958281A (zh) 柔性基材上制备电路的方法及其应用
US20030228748A1 (en) Circuit elements having an ink receptive coating and a conductive trace and methods of manufacture
US10832113B2 (en) Method of producing an electronic device
CA2803104C (en) Multilayered film element
US20020018880A1 (en) Stamping foils for use in making printed circuits and radio frequency antennas
US11645490B2 (en) Method for manufacturing personalized chipless radiofrequency identification (“RFID”) devices
CN117438773A (zh) Rfid天线及其制备方法
US9184491B2 (en) Manipulation-proof RFID antenna having safety feature
US11464115B2 (en) Method for depositing functional traces
US20040241404A1 (en) Paper with holographic pattern and manufacture of it
CN1100999C (zh) 谐振标签等的电路形金属箔片及其制造方法
EP3281789B1 (en) Method for transfer lamination
JP2019091777A (ja) 回路シートの製造方法
CN112020239B (zh) 一种电子电路及电子电路制作方法
CN210478087U (zh) 一种印刷电子及印刷电子制作系统
WO2005125290A1 (en) A method for processing an electrically conductive pattern
HK40007929B (en) Method for manufacturing personalised chip-free radiofrequency identification (rfid) devices

Legal Events

Date Code Title Description
MK4 Application lapsed section 142(2)(d) - no continuation fee paid for the application