JP2009518191A5 - - Google Patents
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- Publication number
- JP2009518191A5 JP2009518191A5 JP2008544013A JP2008544013A JP2009518191A5 JP 2009518191 A5 JP2009518191 A5 JP 2009518191A5 JP 2008544013 A JP2008544013 A JP 2008544013A JP 2008544013 A JP2008544013 A JP 2008544013A JP 2009518191 A5 JP2009518191 A5 JP 2009518191A5
- Authority
- JP
- Japan
- Prior art keywords
- silicon
- deposition
- support
- getter material
- supports
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims description 23
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 14
- 239000010703 silicon Substances 0.000 claims description 14
- 229910052710 silicon Inorganic materials 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 11
- 238000000151 deposition Methods 0.000 claims description 8
- 230000008021 deposition Effects 0.000 claims description 7
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 4
- 229910010293 ceramic material Inorganic materials 0.000 claims description 4
- 229910052726 zirconium Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 238000007740 vapor deposition Methods 0.000 claims description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 2
- 229910052750 molybdenum Inorganic materials 0.000 claims description 2
- 239000011733 molybdenum Substances 0.000 claims description 2
- 229910052758 niobium Inorganic materials 0.000 claims description 2
- 239000010955 niobium Substances 0.000 claims description 2
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 229910052715 tantalum Inorganic materials 0.000 claims description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 2
- 229910052721 tungsten Inorganic materials 0.000 claims description 2
- 239000010937 tungsten Substances 0.000 claims description 2
- 238000003466 welding Methods 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ITMI2005A002343 | 2005-12-06 | ||
| IT002343A ITMI20052343A1 (it) | 2005-12-06 | 2005-12-06 | Processo per la produzione di dispositivi micromeccanici contenenti un materiale getter e dispositivi cosi'prodotti |
| PCT/IT2006/000824 WO2007066370A1 (en) | 2005-12-06 | 2006-11-28 | Process for manufacturing micromechanical devices containing a getter material and devices so manufactured |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009518191A JP2009518191A (ja) | 2009-05-07 |
| JP2009518191A5 true JP2009518191A5 (enExample) | 2012-03-01 |
| JP5015947B2 JP5015947B2 (ja) | 2012-09-05 |
Family
ID=37951839
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008544013A Active JP5015947B2 (ja) | 2005-12-06 | 2006-11-28 | ゲッター材を含むマイクロメカニカルデバイスの製造方法及び製造されたデバイス |
Country Status (17)
| Country | Link |
|---|---|
| US (1) | US7833880B2 (enExample) |
| EP (1) | EP1957395B1 (enExample) |
| JP (1) | JP5015947B2 (enExample) |
| KR (1) | KR101364623B1 (enExample) |
| CN (1) | CN101291873B (enExample) |
| AT (1) | ATE480495T1 (enExample) |
| AU (1) | AU2006322862C1 (enExample) |
| CA (1) | CA2623020C (enExample) |
| DE (1) | DE602006016850D1 (enExample) |
| DK (1) | DK1957395T3 (enExample) |
| ES (1) | ES2348613T3 (enExample) |
| IL (1) | IL191756A (enExample) |
| IT (1) | ITMI20052343A1 (enExample) |
| NO (1) | NO20081994L (enExample) |
| RU (1) | RU2401245C2 (enExample) |
| TW (1) | TWI325409B (enExample) |
| WO (1) | WO2007066370A1 (enExample) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2922202B1 (fr) * | 2007-10-15 | 2009-11-20 | Commissariat Energie Atomique | Structure comportant une couche getter et une sous-couche d'ajustement et procede de fabrication. |
| EP2484629B1 (fr) * | 2011-02-03 | 2013-06-26 | Nivarox-FAR S.A. | Pièce de micromécanique complexe ajourée |
| RU2474912C1 (ru) * | 2011-08-23 | 2013-02-10 | Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Национальный исследовательский университет "МИЭТ" (МИЭТ) | Способ получения газопоглощающей структуры |
| US9966319B1 (en) * | 2011-10-27 | 2018-05-08 | Global Circuit Innovations Incorporated | Environmental hardening integrated circuit method and apparatus |
| US9870968B2 (en) | 2011-10-27 | 2018-01-16 | Global Circuit Innovations Incorporated | Repackaged integrated circuit and assembly method |
| US9935028B2 (en) | 2013-03-05 | 2018-04-03 | Global Circuit Innovations Incorporated | Method and apparatus for printing integrated circuit bond connections |
| RU2523718C2 (ru) * | 2012-11-20 | 2014-07-20 | Федеральное государственное автономное образовательное учреждение высшего профессионального образования "Национальный исследовательский университет "МИЭТ" (МИЭТ) | Нанокомпозитная газопоглощающая структура и способ ее получения |
| RU2522362C1 (ru) * | 2012-12-29 | 2014-07-10 | Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Московский государственный технический университет имени Н.Э. Баумана (МГТУ им. Н.Э. Баумана) | Микроэлектромеханический взрыватель изохорический |
| RU2522323C1 (ru) * | 2012-12-29 | 2014-07-10 | Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Московский государственный технический университет имени Н.Э. Баумана" (МГТУ им. Н.Э. Баумана) | Микроэлектромеханический взрыватель |
| US10160638B2 (en) | 2013-01-04 | 2018-12-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and apparatus for a semiconductor structure |
| US8847373B1 (en) * | 2013-05-07 | 2014-09-30 | Innovative Micro Technology | Exothermic activation for high vacuum packaging |
| DE102015224499A1 (de) * | 2015-12-08 | 2017-06-08 | Robert Bosch Gmbh | Spannungsreduzierung beim Laserwiederverschluss durch Temperaturerhöhung |
| DE102015226772A1 (de) * | 2015-12-29 | 2017-06-29 | Robert Bosch Gmbh | Gettervorrichtung für ein mikromechanisches Bauelement |
| JP6932491B2 (ja) * | 2016-10-31 | 2021-09-08 | 株式会社豊田中央研究所 | Ｍｅｍｓ装置を製造する方法 |
| CN106517082B (zh) * | 2016-11-14 | 2017-11-03 | 北方电子研究院安徽有限公司 | 一种mems吸气剂图形化制备方法 |
| CN109879240B (zh) * | 2017-12-06 | 2021-11-09 | 有研工程技术研究院有限公司 | 一种厚膜吸气材料的制备方法 |
| FR3083537B1 (fr) * | 2018-07-06 | 2021-07-30 | Ulis | Boitier hermetique comportant un getter, composant integrant un tel boitier hermetique et procede de fabrication associe |
| US11508680B2 (en) | 2020-11-13 | 2022-11-22 | Global Circuit Innovations Inc. | Solder ball application for singular die |
| CN112614779B (zh) * | 2020-12-17 | 2024-12-03 | 苏州厚朴传感科技有限公司 | 一种吸气剂图形化的掩膜方式 |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4050914A (en) * | 1976-07-26 | 1977-09-27 | S.A.E.S. Getters S.P.A. | Accelerator for charged particles |
| US5503285A (en) * | 1993-07-26 | 1996-04-02 | Litton Systems, Inc. | Method for forming an electrostatically force balanced silicon accelerometer |
| CA2179052C (en) | 1993-12-13 | 2001-02-13 | Robert E. Higashi | Integrated silicon vacuum micropackage for infrared devices |
| US5594170A (en) | 1994-06-15 | 1997-01-14 | Alliedsignal Inc. | Kip cancellation in a pendulous silicon accelerometer |
| US5656778A (en) | 1995-04-24 | 1997-08-12 | Kearfott Guidance And Navigation Corporation | Micromachined acceleration and coriolis sensor |
| JPH09196682A (ja) | 1996-01-19 | 1997-07-31 | Matsushita Electric Ind Co Ltd | 角速度センサと加速度センサ |
| US5821836A (en) | 1997-05-23 | 1998-10-13 | The Regents Of The University Of Michigan | Miniaturized filter assembly |
| RU2137249C1 (ru) * | 1998-03-31 | 1999-09-10 | Санкт-Петербургский государственный электротехнический университет | Способ изготовления микромеханических приборов |
| US6499354B1 (en) | 1998-05-04 | 2002-12-31 | Integrated Sensing Systems (Issys), Inc. | Methods for prevention, reduction, and elimination of outgassing and trapped gases in micromachined devices |
| US6110808A (en) * | 1998-12-04 | 2000-08-29 | Trw Inc. | Hydrogen getter for integrated microelectronic assembly |
| JP2000182511A (ja) * | 1998-12-14 | 2000-06-30 | Yamaha Corp | 電界放射型素子の製造方法 |
| US6058027A (en) | 1999-02-16 | 2000-05-02 | Maxim Integrated Products, Inc. | Micromachined circuit elements driven by micromachined DC-to-DC converter on a common substrate |
| US6590850B2 (en) | 2001-03-07 | 2003-07-08 | Hewlett-Packard Development Company, L.P. | Packaging for storage devices using electron emissions |
| US6534850B2 (en) * | 2001-04-16 | 2003-03-18 | Hewlett-Packard Company | Electronic device sealed under vacuum containing a getter and method of operation |
| TW533188B (en) * | 2001-07-20 | 2003-05-21 | Getters Spa | Support for microelectronic, microoptoelectronic or micromechanical devices |
| US6923625B2 (en) | 2002-01-07 | 2005-08-02 | Integrated Sensing Systems, Inc. | Method of forming a reactive material and article formed thereby |
| US6621134B1 (en) | 2002-02-07 | 2003-09-16 | Shayne Zurn | Vacuum sealed RF/microwave microresonator |
| US6635509B1 (en) | 2002-04-12 | 2003-10-21 | Dalsa Semiconductor Inc. | Wafer-level MEMS packaging |
| ITMI20030069A1 (it) * | 2003-01-17 | 2004-07-18 | Getters Spa | Dispositivi micromeccanici o microoptoelettronici con deposito di materiale getter e riscaldatore integrato. |
| US7235461B2 (en) * | 2003-04-29 | 2007-06-26 | S.O.I.Tec Silicon On Insulator Technologies | Method for bonding semiconductor structures together |
| CN1594067A (zh) * | 2003-09-08 | 2005-03-16 | 华中科技大学机械科学与工程学院 | 一种低温集成的圆片级微机电系统气密性封装工艺 |
| ITMI20032209A1 (it) * | 2003-11-14 | 2005-05-15 | Getters Spa | Processo per la produzione di dispositivi che richiedono per il loro funzionamento un materiale getter non evaporabile. |
| ITMI20050616A1 (it) | 2005-04-12 | 2006-10-13 | Getters Spa | Processo per la formazione di depositi getter miniaturizzati e depositi getrter cosi'ottenuti |
-
2005
- 2005-12-06 IT IT002343A patent/ITMI20052343A1/it unknown
-
2006
- 2006-11-20 TW TW095142822A patent/TWI325409B/zh active
- 2006-11-28 ES ES06832341T patent/ES2348613T3/es active Active
- 2006-11-28 DE DE602006016850T patent/DE602006016850D1/de active Active
- 2006-11-28 KR KR1020087016396A patent/KR101364623B1/ko active Active
- 2006-11-28 DK DK06832341.9T patent/DK1957395T3/da active
- 2006-11-28 WO PCT/IT2006/000824 patent/WO2007066370A1/en not_active Ceased
- 2006-11-28 EP EP06832341A patent/EP1957395B1/en active Active
- 2006-11-28 AU AU2006322862A patent/AU2006322862C1/en not_active Ceased
- 2006-11-28 CN CN2006800394011A patent/CN101291873B/zh active Active
- 2006-11-28 AT AT06832341T patent/ATE480495T1/de active
- 2006-11-28 US US12/094,726 patent/US7833880B2/en active Active
- 2006-11-28 CA CA2623020A patent/CA2623020C/en active Active
- 2006-11-28 RU RU2008127306/28A patent/RU2401245C2/ru not_active IP Right Cessation
- 2006-11-28 JP JP2008544013A patent/JP5015947B2/ja active Active
-
2008
- 2008-04-25 NO NO20081994A patent/NO20081994L/no not_active Application Discontinuation
- 2008-05-27 IL IL191756A patent/IL191756A/en active IP Right Grant
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