NO20081994L - Fremstilling av mikromekaniske anordninger som inneholder et gettermateriale samt anordninger fremstilt slik - Google Patents
Fremstilling av mikromekaniske anordninger som inneholder et gettermateriale samt anordninger fremstilt slikInfo
- Publication number
- NO20081994L NO20081994L NO20081994A NO20081994A NO20081994L NO 20081994 L NO20081994 L NO 20081994L NO 20081994 A NO20081994 A NO 20081994A NO 20081994 A NO20081994 A NO 20081994A NO 20081994 L NO20081994 L NO 20081994L
- Authority
- NO
- Norway
- Prior art keywords
- devices
- getter material
- preparation
- well
- way
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00277—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS
- B81C1/00285—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C99/00—Subject matter not provided for in other groups of this subclass
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Micromachines (AREA)
- Solid-Sorbent Or Filter-Aiding Compositions (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Glass Compositions (AREA)
Abstract
En prosess for fremstilling av mikromekaniske anordninger blir beskrevet, hvor anordningene blir dannet ved å sammenføye to deler ved direkte bonding, der en av delene (12) er laget av silisium og den andre er laget av et materiale valgt fra silisium og et keramisk eller oksidisk halvledermateriale, slik at forbindelsen mellom de to delene danner en kavitet (14) som inneholder de funksjonelle elementene i anordningen (11), eventuelt tilleggselementer og en avsetning (13) av et 15 gettermateriale.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT002343A ITMI20052343A1 (it) | 2005-12-06 | 2005-12-06 | Processo per la produzione di dispositivi micromeccanici contenenti un materiale getter e dispositivi cosi'prodotti |
PCT/IT2006/000824 WO2007066370A1 (en) | 2005-12-06 | 2006-11-28 | Process for manufacturing micromechanical devices containing a getter material and devices so manufactured |
Publications (1)
Publication Number | Publication Date |
---|---|
NO20081994L true NO20081994L (no) | 2008-06-05 |
Family
ID=37951839
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO20081994A NO20081994L (no) | 2005-12-06 | 2008-04-25 | Fremstilling av mikromekaniske anordninger som inneholder et gettermateriale samt anordninger fremstilt slik |
Country Status (17)
Country | Link |
---|---|
US (1) | US7833880B2 (no) |
EP (1) | EP1957395B1 (no) |
JP (1) | JP5015947B2 (no) |
KR (1) | KR101364623B1 (no) |
CN (1) | CN101291873B (no) |
AT (1) | ATE480495T1 (no) |
AU (1) | AU2006322862C1 (no) |
CA (1) | CA2623020C (no) |
DE (1) | DE602006016850D1 (no) |
DK (1) | DK1957395T3 (no) |
ES (1) | ES2348613T3 (no) |
IL (1) | IL191756A (no) |
IT (1) | ITMI20052343A1 (no) |
NO (1) | NO20081994L (no) |
RU (1) | RU2401245C2 (no) |
TW (1) | TWI325409B (no) |
WO (1) | WO2007066370A1 (no) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2922202B1 (fr) * | 2007-10-15 | 2009-11-20 | Commissariat Energie Atomique | Structure comportant une couche getter et une sous-couche d'ajustement et procede de fabrication. |
EP2484629B1 (fr) * | 2011-02-03 | 2013-06-26 | Nivarox-FAR S.A. | Pièce de micromécanique complexe ajourée |
RU2474912C1 (ru) * | 2011-08-23 | 2013-02-10 | Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Национальный исследовательский университет "МИЭТ" (МИЭТ) | Способ получения газопоглощающей структуры |
US9870968B2 (en) | 2011-10-27 | 2018-01-16 | Global Circuit Innovations Incorporated | Repackaged integrated circuit and assembly method |
US9935028B2 (en) * | 2013-03-05 | 2018-04-03 | Global Circuit Innovations Incorporated | Method and apparatus for printing integrated circuit bond connections |
US9966319B1 (en) | 2011-10-27 | 2018-05-08 | Global Circuit Innovations Incorporated | Environmental hardening integrated circuit method and apparatus |
RU2523718C2 (ru) * | 2012-11-20 | 2014-07-20 | Федеральное государственное автономное образовательное учреждение высшего профессионального образования "Национальный исследовательский университет "МИЭТ" (МИЭТ) | Нанокомпозитная газопоглощающая структура и способ ее получения |
RU2522323C1 (ru) * | 2012-12-29 | 2014-07-10 | Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Московский государственный технический университет имени Н.Э. Баумана" (МГТУ им. Н.Э. Баумана) | Микроэлектромеханический взрыватель |
RU2522362C1 (ru) * | 2012-12-29 | 2014-07-10 | Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Московский государственный технический университет имени Н.Э. Баумана (МГТУ им. Н.Э. Баумана) | Микроэлектромеханический взрыватель изохорический |
US10160638B2 (en) | 2013-01-04 | 2018-12-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and apparatus for a semiconductor structure |
US8847373B1 (en) * | 2013-05-07 | 2014-09-30 | Innovative Micro Technology | Exothermic activation for high vacuum packaging |
DE102015224499A1 (de) * | 2015-12-08 | 2017-06-08 | Robert Bosch Gmbh | Spannungsreduzierung beim Laserwiederverschluss durch Temperaturerhöhung |
DE102015226772A1 (de) * | 2015-12-29 | 2017-06-29 | Robert Bosch Gmbh | Gettervorrichtung für ein mikromechanisches Bauelement |
JP6932491B2 (ja) * | 2016-10-31 | 2021-09-08 | 株式会社豊田中央研究所 | Mems装置を製造する方法 |
CN106517082B (zh) * | 2016-11-14 | 2017-11-03 | 北方电子研究院安徽有限公司 | 一种mems吸气剂图形化制备方法 |
CN109879240B (zh) * | 2017-12-06 | 2021-11-09 | 有研工程技术研究院有限公司 | 一种厚膜吸气材料的制备方法 |
FR3083537B1 (fr) * | 2018-07-06 | 2021-07-30 | Ulis | Boitier hermetique comportant un getter, composant integrant un tel boitier hermetique et procede de fabrication associe |
US11508680B2 (en) | 2020-11-13 | 2022-11-22 | Global Circuit Innovations Inc. | Solder ball application for singular die |
CN112614779A (zh) * | 2020-12-17 | 2021-04-06 | 苏州晶鼎鑫光电科技有限公司 | 一种吸气剂图形化的掩膜方式 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4050914A (en) * | 1976-07-26 | 1977-09-27 | S.A.E.S. Getters S.P.A. | Accelerator for charged particles |
US5503285A (en) * | 1993-07-26 | 1996-04-02 | Litton Systems, Inc. | Method for forming an electrostatically force balanced silicon accelerometer |
DE69409257T2 (de) | 1993-12-13 | 1998-09-10 | Honeywell Inc | Integrierte silizium-vakuum-mikropackung für infrarot-geräte |
US5594170A (en) | 1994-06-15 | 1997-01-14 | Alliedsignal Inc. | Kip cancellation in a pendulous silicon accelerometer |
US5656778A (en) | 1995-04-24 | 1997-08-12 | Kearfott Guidance And Navigation Corporation | Micromachined acceleration and coriolis sensor |
JPH09196682A (ja) | 1996-01-19 | 1997-07-31 | Matsushita Electric Ind Co Ltd | 角速度センサと加速度センサ |
US5821836A (en) | 1997-05-23 | 1998-10-13 | The Regents Of The University Of Michigan | Miniaturized filter assembly |
US6499354B1 (en) * | 1998-05-04 | 2002-12-31 | Integrated Sensing Systems (Issys), Inc. | Methods for prevention, reduction, and elimination of outgassing and trapped gases in micromachined devices |
US6110808A (en) * | 1998-12-04 | 2000-08-29 | Trw Inc. | Hydrogen getter for integrated microelectronic assembly |
JP2000182511A (ja) * | 1998-12-14 | 2000-06-30 | Yamaha Corp | 電界放射型素子の製造方法 |
US6058027A (en) | 1999-02-16 | 2000-05-02 | Maxim Integrated Products, Inc. | Micromachined circuit elements driven by micromachined DC-to-DC converter on a common substrate |
US6590850B2 (en) | 2001-03-07 | 2003-07-08 | Hewlett-Packard Development Company, L.P. | Packaging for storage devices using electron emissions |
US6534850B2 (en) * | 2001-04-16 | 2003-03-18 | Hewlett-Packard Company | Electronic device sealed under vacuum containing a getter and method of operation |
TW533188B (en) * | 2001-07-20 | 2003-05-21 | Getters Spa | Support for microelectronic, microoptoelectronic or micromechanical devices |
US6923625B2 (en) | 2002-01-07 | 2005-08-02 | Integrated Sensing Systems, Inc. | Method of forming a reactive material and article formed thereby |
US6621134B1 (en) | 2002-02-07 | 2003-09-16 | Shayne Zurn | Vacuum sealed RF/microwave microresonator |
US6635509B1 (en) | 2002-04-12 | 2003-10-21 | Dalsa Semiconductor Inc. | Wafer-level MEMS packaging |
ITMI20030069A1 (it) * | 2003-01-17 | 2004-07-18 | Getters Spa | Dispositivi micromeccanici o microoptoelettronici con deposito di materiale getter e riscaldatore integrato. |
US7235461B2 (en) * | 2003-04-29 | 2007-06-26 | S.O.I.Tec Silicon On Insulator Technologies | Method for bonding semiconductor structures together |
CN1594067A (zh) * | 2003-09-08 | 2005-03-16 | 华中科技大学机械科学与工程学院 | 一种低温集成的圆片级微机电系统气密性封装工艺 |
ITMI20032209A1 (it) | 2003-11-14 | 2005-05-15 | Getters Spa | Processo per la produzione di dispositivi che richiedono per il loro funzionamento un materiale getter non evaporabile. |
ITMI20050616A1 (it) | 2005-04-12 | 2006-10-13 | Getters Spa | Processo per la formazione di depositi getter miniaturizzati e depositi getrter cosi'ottenuti |
-
2005
- 2005-12-06 IT IT002343A patent/ITMI20052343A1/it unknown
-
2006
- 2006-11-20 TW TW095142822A patent/TWI325409B/zh active
- 2006-11-28 JP JP2008544013A patent/JP5015947B2/ja active Active
- 2006-11-28 CA CA2623020A patent/CA2623020C/en active Active
- 2006-11-28 ES ES06832341T patent/ES2348613T3/es active Active
- 2006-11-28 WO PCT/IT2006/000824 patent/WO2007066370A1/en active Application Filing
- 2006-11-28 US US12/094,726 patent/US7833880B2/en active Active
- 2006-11-28 KR KR1020087016396A patent/KR101364623B1/ko active IP Right Grant
- 2006-11-28 EP EP06832341A patent/EP1957395B1/en active Active
- 2006-11-28 AU AU2006322862A patent/AU2006322862C1/en not_active Ceased
- 2006-11-28 RU RU2008127306/28A patent/RU2401245C2/ru not_active IP Right Cessation
- 2006-11-28 AT AT06832341T patent/ATE480495T1/de active
- 2006-11-28 CN CN2006800394011A patent/CN101291873B/zh active Active
- 2006-11-28 DE DE602006016850T patent/DE602006016850D1/de active Active
- 2006-11-28 DK DK06832341.9T patent/DK1957395T3/da active
-
2008
- 2008-04-25 NO NO20081994A patent/NO20081994L/no not_active Application Discontinuation
- 2008-05-27 IL IL191756A patent/IL191756A/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
CN101291873B (zh) | 2011-06-15 |
ATE480495T1 (de) | 2010-09-15 |
AU2006322862B2 (en) | 2011-04-28 |
DE602006016850D1 (de) | 2010-10-21 |
AU2006322862C1 (en) | 2011-12-01 |
WO2007066370A1 (en) | 2007-06-14 |
US20080293178A1 (en) | 2008-11-27 |
CN101291873A (zh) | 2008-10-22 |
IL191756A (en) | 2012-08-30 |
EP1957395A1 (en) | 2008-08-20 |
JP2009518191A (ja) | 2009-05-07 |
EP1957395B1 (en) | 2010-09-08 |
TWI325409B (en) | 2010-06-01 |
AU2006322862A1 (en) | 2007-06-14 |
US7833880B2 (en) | 2010-11-16 |
RU2401245C2 (ru) | 2010-10-10 |
TW200732245A (en) | 2007-09-01 |
RU2008127306A (ru) | 2010-01-20 |
KR20080081019A (ko) | 2008-09-05 |
ES2348613T3 (es) | 2010-12-09 |
DK1957395T3 (da) | 2011-01-03 |
ITMI20052343A1 (it) | 2007-06-07 |
CA2623020C (en) | 2015-10-20 |
JP5015947B2 (ja) | 2012-09-05 |
CA2623020A1 (en) | 2007-06-14 |
IL191756A0 (en) | 2008-12-29 |
KR101364623B1 (ko) | 2014-02-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
NO20081994L (no) | Fremstilling av mikromekaniske anordninger som inneholder et gettermateriale samt anordninger fremstilt slik | |
DK2165362T3 (da) | Through-wafer-via ved lav modstand | |
ATE540960T1 (de) | Organosilane und damit gebundenes substrat | |
TW200638496A (en) | Package structure of photo sensor and manufacturing method thereof | |
WO2006112995A3 (en) | Glass-based semiconductor on insulator structures and methods of making same | |
JP2017505998A5 (no) | ||
NO20055685D0 (no) | Kvartsglassmeltedigel for a trekke opp enkle silisiumktystaller og fremstilling av denne | |
MY138751A (en) | Packaging microelectromechanical structures | |
TW200715380A (en) | Process for lateral disjonting of a semiconductor wafer and opto-electronic element | |
DK1979512T3 (da) | Digel til behandling af smeltet silicium og fremgangsmåde til fremstilling heraf | |
ATE506686T1 (de) | Herstellungsverfahren für eine luftdicht versiegelte glasverpackung | |
NO20092733L (no) | Kjemiske bindingsgrupper og spaltbare substrater og konjugater derav | |
WO2008133104A1 (ja) | ウォータージェットレーザダイシング用粘着シート | |
SG159515A1 (en) | Method of low temperature imprinting process with high pattern transfer yield | |
TW200602178A (en) | Flexible mold and methods | |
WO2007024549A3 (en) | Semiconductor on glass insulator with deposited barrier layer | |
TW200628396A (en) | Microelectromechanical (MEM) device including a spring release bridge and method of making the same | |
HK1131446A1 (en) | Coupled resonator for regulating system | |
YU53801A (sh) | Kalijumova so (s) - omeprazola | |
RU2015121117A (ru) | Способ изготовления составной компенсационной балансирной пружины | |
NO20082116L (no) | Kjemisk fremgangsmate for fremstilling av en amido-fenoksybenzosyreforbindelse | |
NO20071012L (no) | Fremgangsmate for fremstilling av D-erytro-2,2-difluor-2-deoksy-1-oksoribosederivat | |
WO2007027380A3 (en) | Mems package and method of forming the same | |
IL174350A0 (en) | Spinel articles and methods for forming same | |
TWI612009B (zh) | 半導體之配置及其形成方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FC2A | Withdrawal, rejection or dismissal of laid open patent application |