ATE506686T1 - Herstellungsverfahren für eine luftdicht versiegelte glasverpackung - Google Patents

Herstellungsverfahren für eine luftdicht versiegelte glasverpackung

Info

Publication number
ATE506686T1
ATE506686T1 AT06838444T AT06838444T ATE506686T1 AT E506686 T1 ATE506686 T1 AT E506686T1 AT 06838444 T AT06838444 T AT 06838444T AT 06838444 T AT06838444 T AT 06838444T AT E506686 T1 ATE506686 T1 AT E506686T1
Authority
AT
Austria
Prior art keywords
production process
sealed glass
glass packaging
airtight sealed
substrates
Prior art date
Application number
AT06838444T
Other languages
English (en)
Inventor
Keith J Becken
Stephan L Logunov
Aiyu Zhang
John Bayne
Original Assignee
Corning Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corning Inc filed Critical Corning Inc
Application granted granted Critical
Publication of ATE506686T1 publication Critical patent/ATE506686T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B7/00—Closing containers or receptacles after filling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/06—Joining glass to glass by processes other than fusing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Glass Compositions (AREA)
  • Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
AT06838444T 2005-12-06 2006-11-27 Herstellungsverfahren für eine luftdicht versiegelte glasverpackung ATE506686T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US74830005P 2005-12-06 2005-12-06
PCT/US2006/045479 WO2007067384A2 (en) 2005-12-06 2006-11-27 Hermetically sealed glass package and method of manufacture

Publications (1)

Publication Number Publication Date
ATE506686T1 true ATE506686T1 (de) 2011-05-15

Family

ID=38123380

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06838444T ATE506686T1 (de) 2005-12-06 2006-11-27 Herstellungsverfahren für eine luftdicht versiegelte glasverpackung

Country Status (8)

Country Link
US (2) US8375744B2 (de)
EP (1) EP1958247B1 (de)
JP (1) JP5127465B2 (de)
KR (1) KR100887009B1 (de)
AT (1) ATE506686T1 (de)
DE (1) DE602006021468D1 (de)
TW (1) TWI394307B (de)
WO (1) WO2007067384A2 (de)

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US7425166B2 (en) * 2005-12-06 2008-09-16 Corning Incorporated Method of sealing glass substrates
US8247730B2 (en) 2007-09-28 2012-08-21 Corning Incorporated Method and apparatus for frit sealing with a variable laser beam
US8198807B2 (en) 2008-02-28 2012-06-12 Corning Incorporated Hermetically-sealed packages for electronic components having reduced unused areas
WO2009108319A1 (en) * 2008-02-28 2009-09-03 Corning Incorporated Method of sealing a glass envelope
JP5308718B2 (ja) 2008-05-26 2013-10-09 浜松ホトニクス株式会社 ガラス溶着方法
JP5535652B2 (ja) 2008-06-11 2014-07-02 浜松ホトニクス株式会社 ガラス溶着方法
JP5535653B2 (ja) 2008-06-23 2014-07-02 浜松ホトニクス株式会社 ガラス溶着方法
JP5183424B2 (ja) * 2008-10-30 2013-04-17 京セラ株式会社 パッケージの製造方法
US8860305B2 (en) 2009-07-09 2014-10-14 Corning Incorporated Methods for forming fritted cover sheets with masks and glass packages comprising the same
KR101791580B1 (ko) 2009-10-17 2017-10-30 삼성전자주식회사 광학 요소, 이를 포함한 제품, 및 그 제조 방법
JP5481167B2 (ja) 2009-11-12 2014-04-23 浜松ホトニクス株式会社 ガラス溶着方法
JP5567319B2 (ja) 2009-11-25 2014-08-06 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5466929B2 (ja) 2009-11-25 2014-04-09 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5481172B2 (ja) 2009-11-25 2014-04-23 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5535589B2 (ja) 2009-11-25 2014-07-02 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5481173B2 (ja) 2009-11-25 2014-04-23 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5535588B2 (ja) 2009-11-25 2014-07-02 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5525246B2 (ja) 2009-11-25 2014-06-18 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5535590B2 (ja) 2009-11-25 2014-07-02 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
KR101174882B1 (ko) 2010-06-15 2012-08-17 주식회사 엔씰텍 평판 표시 장치, 평판 표시 장치용 원장 기판, 평판 표시 장치 제조 방법 및 평판 표시 장치용 원장 기판 제조 방법
JP5498310B2 (ja) * 2010-08-02 2014-05-21 浜松ホトニクス株式会社 ガラス溶着方法
US9487437B2 (en) * 2011-02-11 2016-11-08 Guardian Industries Corp. Substrates or assemblies having indirectly laser-fused frits, and/or method of making the same
US9422189B2 (en) * 2011-02-11 2016-08-23 Guardian Industries Corp. Substrates or assemblies having directly laser-fused frits, and/or method of making the same
JP2013022922A (ja) * 2011-07-25 2013-02-04 Stanley Electric Co Ltd レーザ照射による樹脂部材の溶融接合方法
JP2013053032A (ja) * 2011-09-02 2013-03-21 Asahi Glass Co Ltd 気密部材とその製造方法
KR102001815B1 (ko) 2011-11-29 2019-07-19 가부시키가이샤 한도오따이 에네루기 켄큐쇼 밀봉체의 제작 방법 및 발광 장치의 제작 방법
KR101987423B1 (ko) * 2012-11-16 2019-06-11 삼성디스플레이 주식회사 유기 발광 표시 장치와 이의 제조 방법
US9666763B2 (en) 2012-11-30 2017-05-30 Corning Incorporated Glass sealing with transparent materials having transient absorption properties
TWI636875B (zh) * 2013-02-04 2018-10-01 半導體能源研究所股份有限公司 玻璃層的形成方法及密封結構的製造方法
EP2994437A1 (de) 2013-05-10 2016-03-16 Corning Incorporated Laserschweissen von transparenten glasscheiben mit niederschmelzendem glas oder dünnen absorbierenden folien
CN105637267B (zh) * 2013-08-16 2018-11-13 三星电子株式会社 用于制造光学部件的方法、光学部件及包括其的产品
CN105336876B (zh) * 2014-07-29 2017-08-29 上海微电子装备（集团）股份有限公司 激光密封玻璃封装体封装系统和封装方法
WO2016069822A1 (en) 2014-10-31 2016-05-06 Corning Incorporated Laser welded glass packages and methods of making
PL3475240T3 (pl) * 2016-06-25 2021-06-14 Efacec Engenharia E Sistemas, S.A. Sposób hermetyzacji wspomaganej laserem oraz jej produkt
DK3707103T3 (da) 2017-11-06 2022-08-08 Efacec Engenharia E Sist S A Fremgangsmåde til forsegling af huller i glas samt herved opnåede genstande

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US6109994A (en) * 1996-12-12 2000-08-29 Candescent Technologies Corporation Gap jumping to seal structure, typically using combination of vacuum and non-vacuum environments
CN1210749C (zh) * 1997-10-01 2005-07-13 全显示解法有限公司 用于密封可视显示器的方法及设备
EP1087915A2 (de) * 1998-05-19 2001-04-04 Corning Incorporated Materialen mit negativer thermischer ausdehnung,verfahren zur herstellung und verwendung dieser materialen
US6391809B1 (en) * 1999-12-30 2002-05-21 Corning Incorporated Copper alumino-silicate glasses
JP2001307633A (ja) * 2000-04-20 2001-11-02 Mitsubishi Electric Corp フラットディスプレイパネル、フラットディスプレイ装置およびフラットディスプレイパネルの製造方法
JP2001319775A (ja) * 2000-05-10 2001-11-16 Auto Network Gijutsu Kenkyusho:Kk 有機ｅｌ表示装置の封止方法および封止構造
JP2002137939A (ja) 2000-10-30 2002-05-14 Matsushita Electric Ind Co Ltd 表示パネルの製造方法およびその製造装置
JP2002163977A (ja) 2000-11-27 2002-06-07 Sony Corp 平面型ディスプレイパネル用平面基板、これを用いた平面型ディスプレイパネル及びその製造方法
JP4290918B2 (ja) * 2002-02-15 2009-07-08 太陽インキ製造株式会社 光硬化性組成物及びそれを用いて黒色パターンを形成したプラズマディスプレイパネル
DE10219951A1 (de) 2002-05-03 2003-11-13 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Verfahren zur Verkapselung eines Bauelements auf Basis organischer Halbleiter
US6998776B2 (en) * 2003-04-16 2006-02-14 Corning Incorporated Glass package that is hermetically sealed with a frit and method of fabrication
US20040206953A1 (en) * 2003-04-16 2004-10-21 Robert Morena Hermetically sealed glass package and method of fabrication
US7371143B2 (en) * 2004-10-20 2008-05-13 Corning Incorporated Optimization of parameters for sealing organic emitting light diode (OLED) displays
US7537504B2 (en) * 2005-12-06 2009-05-26 Corning Incorporated Method of encapsulating a display element with frit wall and laser beam
US8071183B2 (en) * 2006-06-02 2011-12-06 Hitachi Displays, Ltd. Display apparatus
WO2009108319A1 (en) * 2008-02-28 2009-09-03 Corning Incorporated Method of sealing a glass envelope
KR101588918B1 (ko) * 2008-07-28 2016-01-26 코닝 인코포레이티드 유리 패키지 내에 액체를 밀봉하는 방법 및 이로부터 얻어진 유리 패키지
US8245536B2 (en) * 2008-11-24 2012-08-21 Corning Incorporated Laser assisted frit sealing of high CTE glasses and the resulting sealed glass package
US8440479B2 (en) * 2009-05-28 2013-05-14 Corning Incorporated Method for forming an organic light emitting diode device
JP5243469B2 (ja) * 2010-02-15 2013-07-24 パナソニック株式会社 プラズマディスプレイパネルおよびその製造方法

Also Published As

Publication number Publication date
US20100126898A1 (en) 2010-05-27
KR20070090189A (ko) 2007-09-05
JP2008527655A (ja) 2008-07-24
EP1958247A4 (de) 2009-12-23
JP5127465B2 (ja) 2013-01-23
US20130125516A1 (en) 2013-05-23
TWI394307B (zh) 2013-04-21
EP1958247A2 (de) 2008-08-20
US8375744B2 (en) 2013-02-19
WO2007067384A2 (en) 2007-06-14
KR100887009B1 (ko) 2009-03-04
EP1958247B1 (de) 2011-04-20
WO2007067384A3 (en) 2009-04-30
TW200805731A (en) 2008-01-16
DE602006021468D1 (de) 2011-06-01

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Legal Events

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