PL3475240T3 - Sposób hermetyzacji wspomaganej laserem oraz jej produkt - Google Patents

Sposób hermetyzacji wspomaganej laserem oraz jej produkt

Info

Publication number
PL3475240T3
PL3475240T3 PL17757869T PL17757869T PL3475240T3 PL 3475240 T3 PL3475240 T3 PL 3475240T3 PL 17757869 T PL17757869 T PL 17757869T PL 17757869 T PL17757869 T PL 17757869T PL 3475240 T3 PL3475240 T3 PL 3475240T3
Authority
PL
Poland
Prior art keywords
assisted
laser
product
encapsulation process
hermetic encapsulation
Prior art date
Application number
PL17757869T
Other languages
English (en)
Inventor
Adélio Miguel MAGALHÃES MENDES
Joaquim Gabriel MAGALHÃES MENDES
Luísa Manuela MADUREIRA ANDRADE
Seyedali EMAMI
Jorge Filipe SANTOS MARTINS
Jorge Miguel DOS SANTOS PINTO
Original Assignee
Efacec Engenharia E Sistemas, S.A.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Efacec Engenharia E Sistemas, S.A. filed Critical Efacec Engenharia E Sistemas, S.A.
Publication of PL3475240T3 publication Critical patent/PL3475240T3/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/06—Joining glass to glass by processes other than fusing
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/04—Joining glass to metal by means of an interlayer
    • C03C27/042—Joining glass to metal by means of an interlayer consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/04—Joining glass to metal by means of an interlayer
    • C03C27/042—Joining glass to metal by means of an interlayer consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts
    • C03C27/046—Joining glass to metal by means of an interlayer consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts of metals, metal oxides or metal salts only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
PL17757869T 2016-06-25 2017-06-26 Sposób hermetyzacji wspomaganej laserem oraz jej produkt PL3475240T3 (pl)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
PT10948916 2016-06-25
PT2016109489 2016-06-25
PT10982617 2017-01-02
PT2017109826 2017-01-02
EP17757869.7A EP3475240B1 (en) 2016-06-25 2017-06-26 Laser-assisted hermetic encapsulation process and product thereof
PCT/IB2017/053808 WO2017221218A1 (en) 2016-06-25 2017-06-26 Laser-assisted hermetic encapsulation process and product thereof

Publications (1)

Publication Number Publication Date
PL3475240T3 true PL3475240T3 (pl) 2021-06-14

Family

ID=59702764

Family Applications (1)

Application Number Title Priority Date Filing Date
PL17757869T PL3475240T3 (pl) 2016-06-25 2017-06-26 Sposób hermetyzacji wspomaganej laserem oraz jej produkt

Country Status (4)

Country Link
US (1) US11427505B2 (pl)
EP (1) EP3475240B1 (pl)
PL (1) PL3475240T3 (pl)
WO (1) WO2017221218A1 (pl)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230347622A1 (en) * 2019-11-25 2023-11-02 Corning Incorporated Bonded articles and methods for forming the same
KR20210141870A (ko) * 2020-05-14 2021-11-23 삼성전자주식회사 웨이퍼 처리 장치 및 이를 이용한 반도체 소자 제조 방법

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6998776B2 (en) * 2003-04-16 2006-02-14 Corning Incorporated Glass package that is hermetically sealed with a frit and method of fabrication
US7425166B2 (en) * 2005-12-06 2008-09-16 Corning Incorporated Method of sealing glass substrates
US7537504B2 (en) * 2005-12-06 2009-05-26 Corning Incorporated Method of encapsulating a display element with frit wall and laser beam
US8375744B2 (en) * 2005-12-06 2013-02-19 Corning Incorporated Hermetically sealed glass package and method of manufacture
US8448468B2 (en) * 2008-06-11 2013-05-28 Corning Incorporated Mask and method for sealing a glass envelope
WO2011041579A2 (en) 2009-10-02 2011-04-07 Wisconsin Alumni Research Foundation (20S,22E)-2-METHYLENE-19-NOR-22-ENE-1α,25-DIHYDROXYVITAMIN D3 ANALOGS
KR101117732B1 (ko) * 2010-01-19 2012-02-24 삼성모바일디스플레이주식회사 기판 밀봉에 사용되는 레이저 빔 조사 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
US8796109B2 (en) 2010-12-23 2014-08-05 Medtronic, Inc. Techniques for bonding substrates using an intermediate layer
US10629386B2 (en) 2011-03-22 2020-04-21 Efacec Engenharia E Sistemas, S.A. Substrate and electrode for solar cells and the corresponding manufacturing process
KR102034252B1 (ko) * 2012-12-21 2019-10-21 삼성디스플레이 주식회사 레이저 빔 조사 장치 및 기판 밀봉 방법
TWI636875B (zh) * 2013-02-04 2018-10-01 半導體能源研究所股份有限公司 玻璃層的形成方法及密封結構的製造方法
KR102049445B1 (ko) * 2013-05-31 2019-11-28 삼성디스플레이 주식회사 레이저 빔 조사 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법

Also Published As

Publication number Publication date
EP3475240A1 (en) 2019-05-01
EP3475240B1 (en) 2020-08-26
WO2017221218A1 (en) 2017-12-28
US20210230060A1 (en) 2021-07-29
US11427505B2 (en) 2022-08-30

Similar Documents

Publication Publication Date Title
EP3537476A4 (en) CHIP HOUSING STRUCTURE AND METHOD
SG10201913388VA (en) Semiconductor package and method of forming the same
SG10201913140RA (en) Semiconductor package and method of forming the same
GB201622340D0 (en) Product and Method
ZA201807596B (en) Lead-based alloy and related processes and products
EP3547054A4 (en) PRODUCT MANUFACTURING PROCESS AND PRODUCT MANUFACTURING DEVICE
PL3050814T3 (pl) Urządzenie pakujące i sposób jego działania
SG10201607486YA (en) Improved packaging and method of manufacturing same
EP3584824A4 (en) SEMICONDUCTOR DEVICE AND CORRESPONDING PRODUCTION PROCESS
EP3412318A4 (en) PROCESS FOR PRODUCING DEODORANT AND DEODORANT
EP3255660A4 (en) Encapsulating device and encapsulating method
SI3490988T1 (sl) Nova spojina in postopek
EP3205416A4 (en) Titanium encapsulation structure and titanium material
PL3475240T3 (pl) Sposób hermetyzacji wspomaganej laserem oraz jej produkt
ZA201608720B (en) Thermobaric nonel and preparation method thereof
GB201613244D0 (en) Powder and process
GB201613243D0 (en) Powder and process
EP3385858A4 (en) Die and package
GB201609412D0 (en) Self-sanitising compositions and method for the production thereof
EP3203510A4 (en) Semiconductor package manufacturing method and semiconductor package
PT3475240T (pt) Processo de encapsulamento hermético assistido por laser e produto do mesmo
GB201720514D0 (en) Product and process
EP3327755A4 (en) Chip packaging structure and chip packaging method
EP3220404A4 (en) Chip fuse manufacturing method and chip fuse
GB201719144D0 (en) Product and method