ITMI20130592A1 - Componente micromeccanico e procedimento per la fabbricazione di un componente micromeccanico - Google Patents

Componente micromeccanico e procedimento per la fabbricazione di un componente micromeccanico

Info

Publication number
ITMI20130592A1
ITMI20130592A1 IT000592A ITMI20130592A ITMI20130592A1 IT MI20130592 A1 ITMI20130592 A1 IT MI20130592A1 IT 000592 A IT000592 A IT 000592A IT MI20130592 A ITMI20130592 A IT MI20130592A IT MI20130592 A1 ITMI20130592 A1 IT MI20130592A1
Authority
IT
Italy
Prior art keywords
micromechanical component
substrate
carrier substrate
connection
stop
Prior art date
Application number
IT000592A
Other languages
English (en)
Inventor
Jens Frey
Julian Gonska
Thomas Mayer
Timo Schary
Heribert Weber
Original Assignee
Bosch Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert filed Critical Bosch Gmbh Robert
Publication of ITMI20130592A1 publication Critical patent/ITMI20130592A1/it

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/007—Interconnections between the MEMS and external electrical signals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00269—Bonding of solid lids or wafers to the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00301—Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0109—Bonding an individual cap on the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0172—Seals
    • B81C2203/019—Seals characterised by the material or arrangement of seals between parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/033—Thermal bonding
    • B81C2203/035—Soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Micromachines (AREA)
  • Pressure Sensors (AREA)
IT000592A 2012-04-25 2013-04-12 Componente micromeccanico e procedimento per la fabbricazione di un componente micromeccanico ITMI20130592A1 (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102012206869.4A DE102012206869B4 (de) 2012-04-25 2012-04-25 Mikromechanisches Bauelement und Verfahren zur Herstellung eines mikromechanischen Bauelements

Publications (1)

Publication Number Publication Date
ITMI20130592A1 true ITMI20130592A1 (it) 2013-10-26

Family

ID=49323206

Family Applications (1)

Application Number Title Priority Date Filing Date
IT000592A ITMI20130592A1 (it) 2012-04-25 2013-04-12 Componente micromeccanico e procedimento per la fabbricazione di un componente micromeccanico

Country Status (4)

Country Link
US (1) US20130285175A1 (it)
CN (1) CN103420323A (it)
DE (1) DE102012206869B4 (it)
IT (1) ITMI20130592A1 (it)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9540231B2 (en) * 2014-01-28 2017-01-10 Taiwan Semiconductor Manufacturing Co., Ltd. MEMS device with a bonding layer embedded in the cap
DE102014202817B4 (de) 2014-02-17 2023-06-15 Robert Bosch Gmbh Vorrichtung zum eutektischen Bonden
CN106586948A (zh) * 2015-10-15 2017-04-26 中芯国际集成电路制造(上海)有限公司 一种mems器件及其制备方法、电子装置
CN106946216B (zh) * 2016-01-07 2019-09-27 中芯国际集成电路制造(上海)有限公司 一种mems器件及其制备方法、电子装置
US9859180B2 (en) 2016-02-17 2018-01-02 Semiconductor Components Industries, Llc High reliability wafer level semiconductor packaging
CN107226453B (zh) * 2016-03-24 2021-08-13 中芯国际集成电路制造(上海)有限公司 一种mems器件及其制备方法、电子装置
CN107416758B (zh) * 2016-05-24 2020-03-10 中芯国际集成电路制造(上海)有限公司 一种mems器件及制备方法、电子装置
CN107235468A (zh) * 2017-05-22 2017-10-10 苏州敏芯微电子技术股份有限公司 一种微机电系统器件及其制造方法
CN107902626A (zh) * 2017-11-15 2018-04-13 上海华虹宏力半导体制造有限公司 共晶键合的方法及半导体器件的制造方法
CN109824011A (zh) * 2017-11-23 2019-05-31 上海新微技术研发中心有限公司 一种共晶键合的结构和方法
CN110116984B (zh) * 2018-02-06 2022-01-28 中芯国际集成电路制造(上海)有限公司 Mems器件及其制备方法
CN110116983B (zh) * 2018-02-06 2022-02-15 中芯国际集成电路制造(上海)有限公司 Mems器件及其制备方法
CN109534284B (zh) * 2018-11-28 2020-08-21 上海交通大学 用于微电极与柔性排线之间热压焊接的方法
DE102018221717A1 (de) * 2018-12-13 2020-06-18 Robert Bosch Gmbh Mikromechanische Vorrichtung mit eutektischer Bondverbindung
DE102019208399A1 (de) * 2019-06-07 2020-12-10 Robert Bosch Gmbh Verfahren zum Verbinden von Wafern und Vorrichtung
DE102022120673A1 (de) 2022-08-16 2024-02-22 Innovative Sensor Technology Ist Ag Sensorelement zur Erfassung von zumindest einer physikalischen oder chemischen Messgröße und Sensoranordnung

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US7121402B2 (en) * 2003-04-09 2006-10-17 Reactive Nano Technologies, Inc Container hermetically sealed with crushable material and reactive multilayer material
US6710682B2 (en) * 2000-10-04 2004-03-23 Matsushita Electric Industrial Co., Ltd. Surface acoustic wave device, method for producing the same, and circuit module using the same
US6537892B2 (en) * 2001-02-02 2003-03-25 Delphi Technologies, Inc. Glass frit wafer bonding process and packages formed thereby
SE0202681D0 (sv) * 2002-09-10 2002-09-10 Frank Niklaus Hermetic sealing with combined adhesive bonding and sealing rings
KR100447851B1 (ko) * 2002-11-14 2004-09-08 삼성전자주식회사 반도체장치의 플립칩 방식 측면 접합 본딩 방법 및 이를이용한 ｍｅｍｓ 소자 패키지 및 패키지 방법
US6879035B2 (en) * 2003-05-02 2005-04-12 Athanasios J. Syllaios Vacuum package fabrication of integrated circuit components
CN2626973Y (zh) * 2003-05-16 2004-07-21 中国科学院上海微系统与信息技术研究所 控制键合过程中玻璃或有机胶塌陷的支撑体
US7681306B2 (en) * 2004-04-28 2010-03-23 Hymite A/S Method of forming an assembly to house one or more micro components
US7491567B2 (en) * 2005-11-22 2009-02-17 Honeywell International Inc. MEMS device packaging methods
CN100530614C (zh) * 2006-08-22 2009-08-19 日月光半导体制造股份有限公司 封装结构
JP2008218811A (ja) * 2007-03-06 2008-09-18 Hitachi Metals Ltd 機能素子パッケージ
DE102007044806A1 (de) 2007-09-20 2009-04-02 Robert Bosch Gmbh Mikromechanisches Bauelement und Verfahren zur Herstellung eines mikromechanischen Bauelements
US8900931B2 (en) * 2007-12-26 2014-12-02 Skyworks Solutions, Inc. In-situ cavity integrated circuit package
DE102008041656A1 (de) * 2008-08-28 2010-03-04 Robert Bosch Gmbh Verfahren zur Herstellung eines Bauelements und Bauelement
EP2259018B1 (en) * 2009-05-29 2017-06-28 Infineon Technologies AG Gap control for die or layer bonding using intermediate layers of a micro-electromechanical system
DE102009026628A1 (de) * 2009-06-02 2010-12-09 Robert Bosch Gmbh Mikromechanisches Bauelement und Verfahren zum Herstellen eines mikromechanischen Bauelements
DE102009046687A1 (de) * 2009-11-13 2011-05-19 Robert Bosch Gmbh Mikromechanisches Verfahren und entsprechende Anordnung zum Bonden von Halbleitersubstraten sowie entsprechender gebondeter Halbleitechip
CN101819214B (zh) * 2010-01-29 2011-09-07 东南大学 基于陶瓷圆片级封装的集成风速风向传感器
CN101819076B (zh) * 2010-04-21 2011-07-27 中国电子科技集团公司第二十四研究所 基于金锡共晶的谐振型压力传感器芯片局部真空封装方法

Also Published As

Publication number Publication date
US20130285175A1 (en) 2013-10-31
DE102012206869B4 (de) 2021-05-27
CN103420323A (zh) 2013-12-04
DE102012206869A1 (de) 2013-10-31

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