JP2009516378A - マイクロ電子部品とキャリア基板との間に接点構造を形成する方法、および、この方法によって形成されるアセンブリユニット - Google Patents
マイクロ電子部品とキャリア基板との間に接点構造を形成する方法、および、この方法によって形成されるアセンブリユニット Download PDFInfo
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- JP2009516378A JP2009516378A JP2008540448A JP2008540448A JP2009516378A JP 2009516378 A JP2009516378 A JP 2009516378A JP 2008540448 A JP2008540448 A JP 2008540448A JP 2008540448 A JP2008540448 A JP 2008540448A JP 2009516378 A JP2009516378 A JP 2009516378A
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- Prior art keywords
- component
- carrier substrate
- contact
- solder
- connection
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- 239000000758 substrate Substances 0.000 title claims abstract description 74
- 238000000034 method Methods 0.000 title claims abstract description 51
- 238000004377 microelectronic Methods 0.000 title claims abstract description 9
- 229910000679 solder Inorganic materials 0.000 claims abstract description 64
- 239000000463 material Substances 0.000 claims abstract description 59
- 239000000853 adhesive Substances 0.000 claims description 13
- 230000001070 adhesive effect Effects 0.000 claims description 13
- 239000011324 bead Substances 0.000 description 20
- 239000012790 adhesive layer Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000003908 quality control method Methods 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000011796 hollow space material Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
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Abstract
【解決手段】 本発明は、マイクロ電子部品(11)と支持基板(12)との間で接点構造(10)を形成する方法、および、当該方法によって形成される部品ユニット(24)に関する。本発明によれば、部品とレーザエネルギとの後方衝突により接続領域で熱エネルギが生み出され、部品および支持基板の対向する接続面(17,18)間に機械的な接続接点(23)が形成され、ハンダ材料を少なくとも部分的に溶解させることにより支持基板および部品の接続面(13,15)間に少なくとも1つの導電接続接点(22)が形成され、当該接続面が互いに対して角度を成して配置される。前記方法によって形成される部品は少なくとも1つの接点構造を有する。
【選択図】図4
Description
Claims (14)
- マイクロ電子部品(11)とキャリア基板(12)との間の接点構造(10)を形成する方法であって、前記部品の背面をレーザエネルギに晒すことにより、接続領域で必要とされる熱エネルギが得られ、前記部品および前記キャリア基板の対向する接続面(17,18)間に機械的な接続接点(23)が形成され、ハンダ材料を少なくとも部分的に溶解させることにより、前記キャリア基板および前記部品の端子面(13,15)間に少なくとも1つの導電接続接点(22)が形成される方法において、
前記端子面が互いに対して角度を成して配置されることを特徴とする方法。 - 前記接点構造(10)が形成される前に、ハンダ材料から成る成形品(14,25,26)が端子面(13,15)上に配置されることを特徴とする、請求項1に記載の方法。
- 前記接点構造(10)が形成される前に、ハンダ材料から成る成形品(26)がキャリア基板(12)の端子面(15)上に配置されることを特徴とする、請求項1に記載の方法。
- 前記接点構造(10)が形成される前に、ハンダ材料から成る成形品(14,25)が前記部品(11)の端子面(13)上に配置されることを特徴とする、請求項1に記載の方法。
- ハンダ材料から成る前記成形品(25)が機械的に変形されることを特徴とする、請求項4に記載の方法。
- 機械的な接続接点(23)および導電接続接点(22)が1つのステップで形成されることを特徴とする、請求項1ないし5のいずれか1項に記載の方法。
- 前記部品(11)と前記キャリア基板(12)との間で相対的な移動(29)があり、それにより、前記部品の端子面(13)がハンダ材料から成る前記成形品(26)と接触し、第2のステップで接続面(17,18)が接触することを特徴とする、請求項3に記載の方法。
- 前記部品(11)と前記キャリア基板(12)とが互いに対して角度(α)を成して配置され、それにより、その頂点において、端子面(15)がハンダ材料から成る成形品(14,25)と接触し、そして/または、複数のハンダ材料から成る成形品(14,25,26)が端子面(13,15)のそれぞれにおいて接触し、第2のステップで、前記頂点を中心に部品を回動させることにより接続面(17,18)が接触することを特徴とする、請求項1ないし5のいずれか1項に記載の方法。
- 機械的な接続接点(23)は、前記部品(11)または前記キャリア基板(12)に塗布される接続材料により形成されることを特徴とする、請求項1ないし8のいずれか1項に記載の方法。
- 接続材料として接着材料(16)が用いられることを特徴とする、請求項9に記載の方法。
- 接続材料としてハンダ材料が用いられることを特徴とする、請求項9に記載の方法。
- 請求項1ないし9のいずれか1項に記載の方法によって形成される少なくとも1つの接点構造(10)を有するアセンブリユニット(24)であって、
少なくとも1つのマイクロ電子部品(11)とキャリア基板(12)とを有し、前記部品と前記キャリア基板との間に1つの機械的な接続接点(23)と少なくとも1つの導電接続接点(22)とが形成され、互いに対して角度を成して配置される前記部品および前記キャリア基板の端子面(13,15)間で、ハンダ材料によって導電接続接点(22)が形成されることを特徴とするアセンブリユニット(24)。 - 前記機械的な接続接点(23)は、前記部品(11)と前記キャリア基板(12)との間で接着材料(16)により形成されることを特徴とする、請求項12に記載のアセンブリユニット。
- 前記機械的な接続接点(23)は、前記部品(11)と前記キャリア基板(12)との間でハンダ材料により形成されることを特徴とする、請求項12に記載のアセンブリユニット。
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PCT/DE2006/002021 WO2007056997A1 (de) | 2005-11-18 | 2006-11-17 | Verfahren zur herstellung einer kontaktanordnung zwischen einem mikroelektronischen bauelement und einem trägersubstrat sowie eine mit dem verfahren hergestellte bauteileinheit |
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DE102008017180B4 (de) * | 2008-04-02 | 2020-07-02 | Pac Tech - Packaging Technologies Gmbh | Vorrichtung zur Applikation eines elektronischen Bauelements |
CN107315482A (zh) * | 2016-04-26 | 2017-11-03 | 育圣光电(深圳)有限公司 | 键盘装置与应用其上的投影画面防抖方法 |
KR102174928B1 (ko) * | 2019-02-01 | 2020-11-05 | 레이저쎌 주식회사 | 멀티 빔 레이저 디본딩 장치 및 방법 |
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