JP5189494B2 - マイクロ電子部品とキャリア基板との間に接点構造を形成する方法、および、この方法によって形成されるアセンブリユニット - Google Patents
マイクロ電子部品とキャリア基板との間に接点構造を形成する方法、および、この方法によって形成されるアセンブリユニット Download PDFInfo
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- JP5189494B2 JP5189494B2 JP2008540448A JP2008540448A JP5189494B2 JP 5189494 B2 JP5189494 B2 JP 5189494B2 JP 2008540448 A JP2008540448 A JP 2008540448A JP 2008540448 A JP2008540448 A JP 2008540448A JP 5189494 B2 JP5189494 B2 JP 5189494B2
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- component
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- solder
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- 239000000758 substrate Substances 0.000 title claims description 73
- 238000000034 method Methods 0.000 title claims description 47
- 238000004377 microelectronic Methods 0.000 title claims description 8
- 229910000679 solder Inorganic materials 0.000 claims description 63
- 239000000463 material Substances 0.000 claims description 58
- 239000000853 adhesive Substances 0.000 claims description 13
- 230000001070 adhesive effect Effects 0.000 claims description 13
- 239000012876 carrier material Substances 0.000 claims 1
- 239000011324 bead Substances 0.000 description 20
- 239000012790 adhesive layer Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000003908 quality control method Methods 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000011796 hollow space material Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
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Description
Claims (12)
- マイクロ電子部品(11)とキャリア基板(12)との間の接点構造(10)を形成する方法であって、前記部品の背面をレーザエネルギに晒すことにより、接続領域で必要とされる熱エネルギが得られ、前記部品および前記キャリア基板の対向する複数の接続面(17,18)間に機械的な接続接点(23)が形成され、ハンダ材料を少なくとも部分的に溶解させることにより、前記キャリア基板および前記部品の端子面(13,15)間に少なくとも1つの導電接続接点(22)が形成される方法において、
前記部品(11)と前記キャリア基板(12)とが互いに対して角度(α)を成して配置され、それにより、前記部品(11)と前記キャリア基板(12)とによって形成される頂点において、端子面(15)がハンダ材料から成る成形品(14,25)と接触し、または、複数のハンダ材料から成る成形品(14,25,26)が端子面(13,15)のそれぞれにおいて接触し、第2のステップで、前記頂点を中心に部品を回動させることにより複数の接続面(17,18)が接触する
ことを特徴とする方法。 - 前記接点構造(10)が形成される前に、ハンダ材料から成る前記成形品(14,25,26)が端子面(13,15)上に配置されることを特徴とする、請求項1に記載の方法。
- 前記接点構造(10)が形成される前に、ハンダ材料から成る前記成形品(26)が前記キャリア基板(12)の端子面(15)上に配置されることを特徴とする、請求項1に記載の方法。
- 前記接点構造(10)が形成される前に、ハンダ材料から成る前記成形品(14,25)が前記部品(11)の端子面(13)上に配置されることを特徴とする、請求項1に記載の方法。
- ハンダ材料から成る前記成形品(25)が機械的に変形されることを特徴とする、請求項4に記載の方法。
- 前記機械的な接続接点(23)および前記導電接続接点(22)が一回の工程で形成されることを特徴とする、請求項1ないし5のいずれか1項に記載の方法。
- 前記部品(11)と前記キャリア基板(12)との間で相対的な移動(29)があり、それにより、前記部品の端子面(13)がハンダ材料から成る前記成形品(26)と接触し、第2のステップで複数の接続面(17,18)が相互に接触することを特徴とする、請求項3に記載の方法。
- 前記機械的な接続接点(23)は、前記部品(11)または前記キャリア基板(12)に塗布される接続材料により形成されることを特徴とする、請求項1ないし7のいずれか1項に記載の方法。
- 前記接続材料として接着材料(16)が用いられることを特徴とする、請求項8に記載の方法。
- 前記接続材料としてハンダ材料が用いられることを特徴とする、請求項8に記載の方法。
- 請求項1ないし8のいずれか1項に記載の方法によって形成される少なくとも1つの接点構造(10)を有するアセンブリユニット(24)であって、
少なくとも1つのマイクロ電子部品(11)とキャリア基板(12)とを有し、前記部品と前記キャリア基板との間に1つの機械的な接続接点(23)と少なくとも1つの導電接続接点(22)とが形成され、互いに対して角度を成して配置される前記部品および前記キャリア基板の端子面(13,15)間で、ハンダ材料によって導電接続接点(22)が形成され、
前記機械的な接続接点(23)は、前記部品(11)と前記キャリア基板(12)との間で接着材料(16)により形成される
ことを特徴とするアセンブリユニット(24)。 - 前記機械的な接続接点(23)は、前記部品(11)と前記キャリア基板(12)との間でハンダ材料により形成されることを特徴とする、請求項11に記載のアセンブリユニット。
Applications Claiming Priority (3)
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DE102005055505 | 2005-11-18 | ||
DE102005055505.5 | 2005-11-18 | ||
PCT/DE2006/002021 WO2007056997A1 (de) | 2005-11-18 | 2006-11-17 | Verfahren zur herstellung einer kontaktanordnung zwischen einem mikroelektronischen bauelement und einem trägersubstrat sowie eine mit dem verfahren hergestellte bauteileinheit |
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JP2009516378A JP2009516378A (ja) | 2009-04-16 |
JP5189494B2 true JP5189494B2 (ja) | 2013-04-24 |
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US (1) | US8087163B2 (ja) |
EP (1) | EP1948386B1 (ja) |
JP (1) | JP5189494B2 (ja) |
KR (1) | KR101310442B1 (ja) |
DE (1) | DE112006003681A5 (ja) |
WO (1) | WO2007056997A1 (ja) |
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DE102008017180B4 (de) * | 2008-04-02 | 2020-07-02 | Pac Tech - Packaging Technologies Gmbh | Vorrichtung zur Applikation eines elektronischen Bauelements |
KR101845143B1 (ko) * | 2013-01-31 | 2018-05-18 | 파크 테크-파카징 테크놀로지이스 게엠베하 | 반도체 칩 배열 및 그 제조 방법 |
CN107315482A (zh) * | 2016-04-26 | 2017-11-03 | 育圣光电(深圳)有限公司 | 键盘装置与应用其上的投影画面防抖方法 |
KR102174928B1 (ko) * | 2019-02-01 | 2020-11-05 | 레이저쎌 주식회사 | 멀티 빔 레이저 디본딩 장치 및 방법 |
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JPS63155677A (ja) * | 1986-12-19 | 1988-06-28 | Agency Of Ind Science & Technol | 触覚センサと基板の接続方法 |
JPH0671135B2 (ja) * | 1989-01-26 | 1994-09-07 | 富士電機株式会社 | Icチップのはんだ付け方法 |
US5828031A (en) | 1996-06-27 | 1998-10-27 | International Business Machines Corporation | Head transducer to suspension lead termination by solder ball place/reflow |
US5821494A (en) * | 1996-09-27 | 1998-10-13 | International Business Machines Corporation | Method of electrical connection between head transducer and suspension by solder wire bumping at slider level and laser reflow |
JP4117807B2 (ja) * | 1997-06-24 | 2008-07-16 | 松下電工株式会社 | 電子部品のハンダ付け方法 |
DE19901623B4 (de) | 1999-01-18 | 2007-08-23 | Pac Tech-Packaging Technologies Gmbh | Verfahren und Vorrichtung zur thermischen Verbindung von Anschlußflächen zweier Substrate |
JP2001244619A (ja) * | 2000-03-02 | 2001-09-07 | Matsushita Electric Ind Co Ltd | はんだ付方法 |
JP3627916B2 (ja) * | 2000-08-03 | 2005-03-09 | Tdk株式会社 | 磁気ヘッド装置の製造方法 |
JP2002251705A (ja) * | 2001-02-16 | 2002-09-06 | Internatl Business Mach Corp <Ibm> | はんだボール配設装置、はんだボールリフロー装置、及びはんだボール接合装置。 |
US6523250B2 (en) * | 2001-03-21 | 2003-02-25 | International Business Machines Corporation | Method of attaching a slider with head transducer to a suspension |
JP2004283911A (ja) * | 2003-03-03 | 2004-10-14 | Shinka Jitsugyo Kk | 磁気ヘッド部品の装着方法、磁気ヘッド装置及び磁気ヘッド装置の製造方法 |
JP2005064206A (ja) | 2003-08-11 | 2005-03-10 | Niigata Seimitsu Kk | 半導体部品の半田付け方法および半導体部品の実装構造 |
JP2005191133A (ja) * | 2003-12-24 | 2005-07-14 | Ngk Spark Plug Co Ltd | 配線基板の製造方法および配線基板 |
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KR20080091330A (ko) | 2008-10-10 |
DE112006003681A5 (de) | 2008-10-23 |
EP1948386B1 (de) | 2014-03-26 |
WO2007056997A1 (de) | 2007-05-24 |
JP2009516378A (ja) | 2009-04-16 |
US8087163B2 (en) | 2012-01-03 |
EP1948386A1 (de) | 2008-07-30 |
KR101310442B1 (ko) | 2013-09-24 |
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